Claims
- 1. A processing composition for use in fabricating semiconductor-based structures, the processing composition comprising a liquid carrier and a β-diketonate-containing compound, wherein the liquid carrier comprises water.
- 2. The composition according to claim 1, wherein the β-diketonate-containing compound is present in the composition in an amount of less than about 50% by weight.
- 3. The composition according to claim 1, wherein the compound comprises a tetraorganoammonium β-di ketonate-containing compound.
- 4. The composition according to claim 1, wherein the β-diketonate-containing compound is present in the composition in an amount of less than about 10% by weight.
- 5. The composition according to claim 1, wherein the composition further comprises a surfactant.
- 6. A processing composition for use in fabricating semiconductor-based structures, the processing composition comprising a liquid carrier, a β-diketonate-containing compound, and an abrasive component.
- 7. The composition according to claim 6, wherein the β-diketonate-containing compound is present in the composition in an amount of less than about 50% by weight.
- 8. The composition according to claim 6, wherein the compound comprises a tetraorganoammonium β-diketonate-containing compound.
- 9. The composition according to claim 6, wherein the β-diketonate-containing compound is present in the composition in an amount of less than about 10% by weight.
- 10. The composition according to claim 6, wherein the composition further comprises a surfactant.
- 11. A processing composition for use in fabricating semiconductor-based structures, the processing composition comprising a liquid carrier and a β-diketonate-containing compound, wherein the liquid carrier consists essentially of water.
- 12. The composition according to claim 11, wherein the β-diketonate-containing compound is present in the composition in an amount of less than about 50% by weight.
- 13. The composition according to claim 11, wherein the compound comprises a tetraorganoammonium β-diketonate-containing compound.
- 14. The composition according to claim 11, wherein the composition further comprises an abrasive component.
- 15. The composition according to claim 11, wherein the β-diketonate-containing compound is present in the composition in an amount of less than about 10% by weight.
- 16. The composition according to claim 11, wherein the composition further comprises a surfactant.
Parent Case Info
This is a continuation of application Ser. No. 09/490,660, filed Jan. 25, 2000, U.S. Pat. No. 6,375,754, which is a continuation of application Ser. No. 08/914,509, filed Aug. 19, 1997, now U.S. Pat. No. 6,030,491, issued Feb. 29, 2000, which are all incorporated herein by reference.
US Referenced Citations (8)
Foreign Referenced Citations (1)
Number |
Date |
Country |
A 59-196368 |
Nov 1984 |
JP |
Non-Patent Literature Citations (3)
Entry |
Akiya et al., “Thin-Oxide Dielectric Strength Improvement by Adding a Phosphonic Acid Chelating Agent into NH4OH-H2O2 Solution,” J. Electrochem. Soc., 141, 4 pgs. (1994). |
Cady et al., “RCA Clean Replacement,” J. Electrochem. Soc., 143, pp. 2064-2067 (1996). |
Hidber et al., “Citric—A Dispersant for Aqueous Alumina Suspensions,” J. Am. Ceram. Soc., 79, 1857-1867 (1996). |
Continuations (2)
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Number |
Date |
Country |
Parent |
09/490660 |
Jan 2000 |
US |
Child |
10/051269 |
|
US |
Parent |
08/914509 |
Aug 1997 |
US |
Child |
09/490660 |
|
US |