RADIATION-SENSITIVE POSITIVE RESIN COMPOSITION FOR PRODUCING PLATINGS, TRANSFER FILM, AND PROCESS FOR PRODUCING PLATINGS

Abstract

A radiation-sensitive positive resin composition is excellent in sensitivity, resolution and adhesion to a substrate and is developed to form clear apertures without residues. The composition does not contaminate a plating solution and is capable of forming a resin film (resist) that is resistant to cracks after plating, resistant to indentation by platings, and resistant to lifting. A transfer film has the composition. A process of the invention produces thick platings as bumps or wirings with high precision.

Description

Claims

1. A radiation-sensitive positive resin composition for producing platings, comprising: a polymer (A) that has at least one end terminated with —SR (wherein R is a linear or branched alkyl group of 1 to 20 carbon atoms, a cyclic alkyl group of 3 to 20 carbon atoms, or a derivative thereof) and includes a structural unit having an acid-dissociative functional group which is dissociated by an acid to yield an acidic functional group;a radiation-sensitive acid generator (B); andan organic solvent (C).

2. The radiation-sensitive positive resin composition for producing platings according to claim 1, wherein the polymer (A) is obtained using a chain transfer agent represented by Formula (1): R—SR   (1)wherein R is a linear or branched alkyl group of 1 to 20 carbon atoms, a cyclic alkyl group of 3 to 20 carbon atoms, or a derivative thereof.

3. The radiation-sensitive positive resin composition for producing platings according to claim 1 or 2, wherein the polymer (A) further includes a structural unit represented by Formula (2) and/or a structural unit represented by Formula (3):

4. The radiation-sensitive positive resin composition for producing platings according to any one of claims 1 to 3, wherein the structural unit having an acid-dissociative functional group of the polymer (A) is represented by Formula (4):

5. The radiation-sensitive positive resin composition for producing platings according to any one of claims 1 to 4, wherein the polymer (A) is a copolymer that includes a structural unit derived from a monomer with two or more ethylenically unsaturated double bonds.

6. The radiation-sensitive positive resin composition for producing platings according to any one of claims 1 to 5, wherein the composition further includes an alkali-soluble resin other than the polymer (A).

7. The radiation-sensitive positive resin composition for producing platings according to any one of claims 1 to 6, wherein the composition further includes an acid diffusion controller.

8. The radiation-sensitive positive resin composition for producing platings according to any one of claims 1 to 7, wherein the platings are bumps.

9. A resin film that is formed from the radiation-sensitive positive resin composition of any one of claims 1 to 8 and has a thickness of 20 to 100 μm.

10. A transfer film comprising a support film and the resin fIlm of claim 9 on the support film.

11. A process for producing platings, comprising the steps of: (1) providing a resin film on a wafer having a barrier metal layer, the resin film comprising the radiation-sensitive positive resin composition of any one of claims 1 to 8;(2) exposing the resin film to light and developing a latent image to form a pattern;(3) depositing an electrode material by electroplating using the pattern as a template; and(4) releasing the remaining resin film and etching the barrier metal layer.

12. The process for producing platings according to claim 11, wherein the resin film in the step (1) is provided on the wafer by transferring the resin film of the transfer film of claim 10.