The present invention relates generally to heat dissipation technology for automatic test equipment, and, in particular, to a radiator module system for an automatic test equipment for performing cooling circulations on heat energy generated by a device under test (DUT) during testing.
Generally speaking, a test head for device tests can be installed on a robot arm and force a device under test (DUT) tightly stressed by downward pressure into a test area inside an electric or layered test equipment. However, due to certain incapability in the heat sinking mechanism of the conventional test head for high performance integrated circuit (IC) DUT, upon performing electric tests or layered tests, the heat sinking effect of the test head may be insufficient and even reduced after multiple test operations, which may cause adverse influences on the heat dissipation result for heat generated by the IC DUT thus accordingly leading to occurrence of IC device impairment.
In order to resolve the above-said issues, in the industry it is common to prepare an additional cooling machine for connecting to the test head thereby removing the accumulated heat energy from the test head; however, such an additionally added cooling machine takes up significant space and purchase fees for such machines may also undesirably increase the manufacture costs. Besides, the cooling machine needs to connect multiple lines to the test head so as to conduct away the generated heat energy to perform effective heat exchanges. But, unfortunately, in this way the complexity among such pipelines become inevitable, and this complication tends to induce troubles in operation and maintenance processes. Hence, this approach of placing additional cooling machines for heat dissipation will lead to occurrence of many unnecessary problems.
As such, it should be an optimal solution in case that a circulating cooling device can be combined with the test arm having a test head such that it is possible to allow the circulating cooling device to directly perform heat exchanges on heat energy generated by a DUT tightly stressed by downward pressure applied with the test arm so as to dissipate the generated heat energy.
One aspect of the present invention relates to a radiator module system, which includes a test arm and a closed-loop circulating cooling device disposed on the test arm. The test arm includes a test head to perform a test on a device under test (DUT), and an internal channel is formed within the test head such that the internal channel passes through the test head. The closed-loop circulating cooling device includes: an inlet and an outlet, respectively connected to the internal channel; a conduit connecting the inlet and the outlet, such that the conduit and the internal channel form a closed-loop circulating channel, where a working fluid flows within the closed-loop circulating channel; a cooling device in contact with the conduit, configured to perform heat dissipation to the working fluid flowing within the conduit; and a driving source configured to drive the working fluid to flow within the closed-loop circulating channel. The test arm and the closed-loop circulating cooling device are synchronously movable such that the closed-loop circulating channel is not entangled due to movement of the test arm. The working fluid is driven by the driving source to flow within the closed-loop circulating channel by way of: flowing through the internal channel within the test head to absorb heat generated at the test head during the test on the DUT, entering the conduit from the internal channel through the inlet, flowing through the conduit such that the cooling device performs heat dissipation to dissipate the heat, and re-entering the internal channel within the test head from the conduit through the outlet.
In certain embodiments, the closed-loop circulating cooling device further includes a set of fans disposed in a parallel direction relative to the cooling device.
In certain embodiments, the closed-loop circulating cooling device further includes a housing, where the inlet and the outlet, the conduit, the cooling device, the driving source and the set of fans are all installed inside the housing.
In certain embodiments, the cooling device includes a set of heat sinks in contact with the conduit within the cooling device.
In certain embodiments, the conduit is arranged between the cooling device and the driving source.
A further aspect of the present invention realtes to an automatic test equipment for performing tests on a device under test (DUT). In certain embodiments, the automatic test equipment includes a test mechanism, which includes a plurality of test arms; and a plurality of closed-loop circulating cooling devices, each disposed correspondingly on one of the test arms. Each of the test arms includes a test head to perform the tests on the DUT, and an internal channel is formed within the test head such that the internal channel passes through the test head. Each of the closed-loop circulating cooling devices includes: an inlet and an outlet, respectively connected to the internal channel within the corresponding test head; a conduit connecting the inlet and the outlet, such that the conduit and the internal channel within the corresponding test head form a closed-loop circulating channel for the corresponding test head, where a working fluid flows within the closed-loop circulating channel; a cooling device in contact with the conduit, configured to perform heat dissipation to the working fluid flowing within the conduit; and a driving source configured to drive the working fluid to flow within the closed-loop circulating channel. For each of the test arms, the test arm and the closed-loop circulating cooling device disposed on the test arm are synchronously movable such that the closed-loop circulating channel for the corresponding test head is not entangled due to movement of the test arm For each of the closed-loop circulating cooling devices, the working fluid is driven by the driving source to flow within the closed-loop circulating channel by way of: flowing through the internal channel within the corresponding test head to absorb heat generated at the corresponding test head during the tests on the DUT, entering the conduit from the internal channel through the inlet, flowing through the conduit such that the cooling device performs heat dissipation to dissipate the heat, and re-entering the internal channel within the test head from the conduit through the outlet.
In certain embodiments, each of the closed-loop circulating cooling devices further includes: a set of fans disposed in a parallel direction relative to the cooling device.
In certain embodiments, each of the closed-loop circulating cooling devices further includes: a housing, wherein the inlet and the outlet, the conduit, the cooling device, the driving source and the set of fans are all installed inside the housing.
In certain embodiments, for each of the closed-loop circulating cooling devices, the cooling device includes: a set of heat sinks in contact with the conduit within the cooling device.
In certain embodiments, for each of the closed-loop circulating cooling devices, the conduit is arranged between the cooling device and the driving source.
In certain embodiments, for each of the closed-loop circulating cooling devices, the test head is configured to perform the tests on the DUT when the DUT is disposed in a test area.
In certain embodiments, the automatic test equipment further includes: a plurality of transport devices, configured to transport the DUT into and out of the test area. In certain embodiments, each of the transport devices has a test socket for insertion of the DUT.
In certain embodiments, the automatic test equipment further includes: a set of pick-up arms, configured to move the DUT from a first carrier tray at an entry area to the transport devices, and to move the DUT from the transport devices to a second carrier tray at an exit area. In certain embodiments, the set of pick-up arms is a set of X-Y-axis pickup arms.
In certain embodiments, each of the test arms is a Z-axis test arm movable along a direction substantially perpendicular to a moving direction of the set of X-Y-axis pick-up arms, such that the test head tightly presses the DUT to perform the tests.
These and other aspects of the present invention will become apparent from the following description of the preferred embodiment taken in conjunction with the following drawings, although variations and modifications therein may be effected without departing from the spirit and scope of the novel concepts of the disclosure.
The accompanying drawings illustrate one or more embodiments of the invention and together with the written description, serve to explain the principles of the invention. Wherever possible, the same reference numbers are used throughout the drawings to refer to the same or like elements of an embodiment, and wherein:
The present invention is more particularly described in the following examples that are intended as illustrative only since numerous modifications and variations therein will be apparent to those skilled in the art. Various embodiments of the invention are now described in detail. Referring to the drawings, like numbers indicate like components throughout the views.
As used in the description herein and throughout the claims that follow, the meaning of “a”, “an”, and “the” includes plural reference unless the context clearly dictates otherwise. Moreover, titles or subtitles may be used in the specification for the convenience of a reader, which shall have no influence on the scope of the present invention.
The meaning of the technical and scientific terms as described herein can be clearly understood by a person of ordinary skill in the art.
As shown in the partial disassembly structure view of
In certain embodiments, the cooling device 323 further includes a set of heat sinks 3230 and in contact with the conduit (not shown) within the cooling device 323 for heat dissipation. As shown in
As the working fluid enters into the conduit inside the cooling device 323 via the inlet 322, since heat energy generated in tests has been absorbed by the working fluid, the closed-loop circulating cooling device 32 circulates and exchanges heat energy generated during tests by the DUT tightly contacted and pressed by the test head 311. Following this, such heat energy can be exchanged and dissipated by the heat sinks 3230 installed on the conduit between the outlet 321 and the inlet 322 and the fans 324 can be activated to create airflows to discharge heat energy.
In certain embodiments, as shown in
Because the present invention is essentially applied to the automatic test equipment, to specifically demonstrate the innovative design with regards to the radiator module system for automatic test equipment according to the present invention, a test operation view is shown as below for illustrations from entry, test to exit phases.
As shown in
Following this, as shown in
In comparison with other conventional technologies, the radiator module system for automatic test equipment according to certain embodiments of the present invention provides the following beneficial features:
1. in certain embodiments of the present invention, a closed-loop circulating cooling device is combined with the test arm having a test head such that it is possible to allow the closed-loop circulating cooling device to directly perform heat exchanges on heat energy generated by a DUT tightly stressed by downward pressure applied with the test arm so as to dissipate the generated heat energy;
2. certain embodiments of the present invention do not require installations of additional and expensive cooling machines for heat sinking, thus further resolving issues concerning operation and maintenance processes due to line complexity caused by the conventional cooling machine;
3. through combining the closed-loop circulating cooling device onto the test arm, the present invention allows the closed-loop circulating cooling device to synchronously move in the Z-axis direction of the test arm when the test arm shifts in order to improve the conventional approach of connecting pipelines or conduits of an external cooling device thereto, thus preventing occurrence of pipeline entanglement when the test arm moves in the Z-axis direction which may lead to loose or falloff problems.
The foregoing description of the exemplary embodiments of the invention has been presented only for the purposes of illustration and description and is not intended to be exhaustive or to limit the invention to the precise forms disclosed. Many modifications and variations are possible in light of the above teaching.
The embodiments are chosen and described in order to explain the principles of the invention and their practical application so as to activate others skilled in the art to utilize the invention and various embodiments and with various modifications as are suited to the particular use contemplated. Alternative embodiments will become apparent to those skilled in the art to which the present invention pertains without departing from its spirit and scope. Accordingly, the scope of the present invention is defined by the appended claims rather than the foregoing description and the exemplary embodiments described therein.
Number | Date | Country | Kind |
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100142741 A | Nov 2011 | TW | national |
This application is a continuation application of U.S. patent application Ser. No. 13/415,254, filed Mar. 8, 2012, entitled “RADIATOR MODULE SYSTEM FOR AUTOMATIC TEST EQUIPMENT” by Xin-Yi Wu, Jui-Che Chou, Meng-Kung Lu, and Chin-Yi Ou Yang, which itself claims the priority to and the benefit of Taiwan Patent Application No. 100142741, filed Nov. 22, 2011. The disclosures of the above identified applications are incorporated herein by reference in their entirety. Some references, if any, which may include patents, patent applications and various publications, may be cited and discussed in the description of this invention. The citation and/or discussion of such references, if any, is provided merely to clarify the description of the present invention and is not an admission that any such reference is “prior art” to the invention described herein. All references listed, cited and/or discussed in this specification are incorporated herein by reference in their entireties and to the same extent as if each reference was individually incorporated by reference.
Number | Name | Date | Kind |
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5205132 | Fu | Apr 1993 | A |
5977785 | Burward-Hoy | Nov 1999 | A |
20040189280 | Mirkhani | Sep 2004 | A1 |
Number | Date | Country | |
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20150198659 A1 | Jul 2015 | US |
Number | Date | Country | |
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Parent | 13415254 | Mar 2012 | US |
Child | 14669783 | US |