Claims
- 1. An integrated circuit package, comprising:
- a package which has a first surface and an opposite second surface;
- a plurality of contacts on said first surface of said package; and,
- a lid attached to said first surface of said package, said lid having an outer surface with a recessed indicia.
- 2. The package as recited in claim 1, wherein said lid is constructed from a ceramic material.
- 3. An integrated circuit package, comprising:
- a package which has a first surface and an opposite second surface;
- an integrated circuit within said package;
- a plurality of contacts on said first surface of said package; and,
- a lid that is approximately 0.030 inch thick and is attached to said first surface of said package, said lid having an outer surface with a recessed indicia that is pressed into said outer surface, said indicia having a depth of at least 0.002 inch and a width of at least 0.016 inch.
- 4. The package as recited in claim 3, wherein said lid is constructed from a ceramic material.
Parent Case Info
This is a Continuation Application of application Ser. No. 08/565,056, filed Nov. 30, 1995, now abandoned.
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4626960 |
Hamano et al. |
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JPX |
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Continuations (1)
|
Number |
Date |
Country |
Parent |
565056 |
Nov 1995 |
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