Marks applied to semiconductor devices or parts

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H01L23/544

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/544Marks applied to semiconductor devices or parts

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Radiation detector, radiation CT apparatus, and method of manufactu...
- Patent number 12,243,903
- Issue date Mar 4, 2025
- Canon Kabushiki Kaisha
- Takashi Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device structure with overla...
- Patent number 12,243,832
- Issue date Mar 4, 2025
- NANYA TECHNOLOGY CORPORATION
- Chun-Yen Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and method of manufacturing semiconductor chip
- Patent number 12,243,831
- Issue date Mar 4, 2025
- JVCKENWOOD CORPORATION
- Takayuki Iwasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for dynamically provisioning cyber training environments
- Patent number 12,237,199
- Issue date Feb 25, 2025
- Circadence Corporation
- Laura Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module and method of manufacturing the same
- Patent number 12,237,271
- Issue date Feb 25, 2025
- Murata Manufacturing Co., Ltd.
- Tadashi Nomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor mark, and semiconductor mark
- Patent number 12,230,584
- Issue date Feb 18, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chuang Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die cleaning systems and related methods
- Patent number 12,230,543
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for dicing a semiconductor wafer structure
- Patent number 12,230,542
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer registration and overlay measurement systems and related methods
- Patent number 12,230,546
- Issue date Feb 18, 2025
- Micron Technology, Inc.
- Nikolay A. Mirin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming micro interconnect struc...
- Patent number 12,230,559
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photolithography alignment process for bonded wafers
- Patent number 12,230,585
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yeong-Jyh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and semiconductor dies formed therefrom includi...
- Patent number 12,224,248
- Issue date Feb 11, 2025
- SanDisk Technologies, Inc.
- Chin-Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer structure and semiconductor device
- Patent number 12,224,256
- Issue date Feb 11, 2025
- Samsung Electronics Co., Ltd.
- Hyunsu Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device including metal-oxide semiconductor trans...
- Patent number 12,224,282
- Issue date Feb 11, 2025
- Samsung Electronics Co., Ltd.
- Jinhyeok Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming fin structure in fin field effect transistor pro...
- Patent number 12,224,176
- Issue date Feb 11, 2025
- Shanghai Huali Integrated Circuit Corporation
- Xiaobo Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a workpiece and system for processing a workpiece
- Patent number 12,224,207
- Issue date Feb 11, 2025
- Disco Corporation
- Hitoshi Hoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package module comprising marking and shield films and method of ma...
- Patent number 12,224,249
- Issue date Feb 11, 2025
- Murata Manufacturing Co., Ltd.
- Toru Komatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device including a pluralit...
- Patent number 12,218,051
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Yuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding to alignment marks with dummy alignment marks
- Patent number 12,218,097
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 12,218,096
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Yeongkwon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier structure
- Patent number 12,219,693
- Issue date Feb 4, 2025
- Siliconware Precision Industries Co., Ltd.
- Chin-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor marks and forming methods thereof
- Patent number 12,218,073
- Issue date Feb 4, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Shengan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer, semiconductor package including the same, and method of...
- Patent number 12,218,043
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,218,072
- Issue date Feb 4, 2025
- Kioxia Corporation
- Yoichi Mizuta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate comprising a binding region having a binding zone a...
- Patent number 12,218,154
- Issue date Feb 4, 2025
- CHONGQING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Xiaoyuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus, bonding system, and bonding method
- Patent number 12,217,963
- Issue date Feb 4, 2025
- Tokyo Electron Limited
- Yutaka Yamasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Strip substrate having protection pattern on sidewall of conductive...
- Patent number 12,211,783
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Sunnyeong Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 12,211,802
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jhih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical measurement tool containing chromatic aberration enhancemen...
- Patent number 12,211,724
- Issue date Jan 28, 2025
- SanDisk Technologies LLC
- Michio Ohi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor structure including interconnection to probe pad with...
- Patent number 12,205,856
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EMBEDDED CHIP-PACKAGE, SEMICONDUCTOR PACKAGE, METHOD OF FORMING AN...
- Publication number 20250079330
- Publication date Mar 6, 2025
- INFINEON TECHNOLOGIES AG
- Mahadi-Ul HASSAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING WAFER
- Publication number 20250079331
- Publication date Mar 6, 2025
- Disco Corporation
- Nobuki KAKIUCHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250079355
- Publication date Mar 6, 2025
- SK HYNIX INC.
- Woo Sung MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Display Substrate and Preparation Method Therefor, and Display Appa...
- Publication number 20250081610
- Publication date Mar 6, 2025
- BOE TECHNOLOGY GROUP CO., LTD.
- Li XIAO
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
ALIGNMENT STRUCTURES FOR DIE PICK-AND-PLACEMENT AND METHODS OF USIN...
- Publication number 20250079329
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jhih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20250081700
- Publication date Mar 6, 2025
- Seoul Viosys Co., Ltd.
- Nam Goo CHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED STEALTH LASER FOR WAFER EDGE TRIMMING PROCESS
- Publication number 20250079150
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Tung Wu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT, CIRCUIT BOARD AND METHOD
- Publication number 20250070040
- Publication date Feb 27, 2025
- Murata Manufacturing Co., Ltd.
- Sami NURMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICES AND METHODS FOR MANUFACTURING THE SAME
- Publication number 20250070041
- Publication date Feb 27, 2025
- InnoLux Corporation
- Jia-Yuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES
- Publication number 20250070056
- Publication date Feb 27, 2025
- Intel Corporation
- Dae-Woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250070039
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Kwangyong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SEAL RING STRUCTURE AND METHOD FOR FORMIN...
- Publication number 20250070052
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ke-Gang Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER ALIGNMENT SYSTEM AND WAFER ALIGNMENT METHOD
- Publication number 20250060685
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Sangyun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER AND METHOD OF WAFER THINNING
- Publication number 20250062114
- Publication date Feb 20, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEM AND METHOD
- Publication number 20250054798
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STIFFENER ASSEMBLY AND METHOD FOR MAKING A SEMICONDUCTOR ASSEMBLY
- Publication number 20250054819
- Publication date Feb 13, 2025
- Intel Corporation
- Seok Ling LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING TOPSIDE COOLED SEMICONDUCTOR PACKAGES BY FIL...
- Publication number 20250054831
- Publication date Feb 13, 2025
- INFINEON TECHNOLOGIES AG
- Chee Yang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20250054875
- Publication date Feb 13, 2025
- DENSO CORPORATION
- MASASHI UECHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OVERLAY METROLOGY TARGET FOR DIE-TO-WAFER OVERLAY METROLOGY
- Publication number 20250054872
- Publication date Feb 13, 2025
- KLA Corporation
- Shlomo Eisenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING AN ALIGNMENT MARK AND METHODS OF FOR...
- Publication number 20250054873
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Hsin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL SELF-REFERENCE MARKING FEATURES
- Publication number 20250054874
- Publication date Feb 13, 2025
- International Business Machines Corporation
- Daniel Piper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS FOR VISIBLE WAVELENGTH MEASUREMENT OF OVERLAY OF WAFER-ON-W...
- Publication number 20250054871
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Han-Jong Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND WAFER-ATTACHED STRUCTURE
- Publication number 20250046657
- Publication date Feb 6, 2025
- ROHM CO., LTD.
- Masatoshi AKETA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS WITH IMPLANTED ALIGNMENT MARK AND METHODS OF MANUFACTURIN...
- Publication number 20250046730
- Publication date Feb 6, 2025
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR WAFER A...
- Publication number 20250046732
- Publication date Feb 6, 2025
- Rohm Co., Ltd.
- Ryuta KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SEMICONDUCTOR DEVICE, AND A STRUCTURE FORMED B...
- Publication number 20250046685
- Publication date Feb 6, 2025
- Siliconix Incorporated
- Barry LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BEFORE SEMICONDUCTOR PROCESS AND SEMICONDUCTOR CHIP MANUFACTU...
- Publication number 20250046727
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Jeongdu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250046728
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Dongwon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DETERMINING PROBING PARAMETERS FOR PROBE SYSTEM TO TEST D...
- Publication number 20250044350
- Publication date Feb 6, 2025
- MPI Corporation
- Andrej Rumiantsev
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC DEVICE
- Publication number 20250046623
- Publication date Feb 6, 2025
- InnoLux Corporation
- Yeong-E CHEN
- H01 - BASIC ELECTRIC ELEMENTS

Marks applied to semiconductor devices or parts

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Radiation detector, radiation CT apparatus, and method of manufactu...

Method for manufacturing semiconductor device structure with overla...

Semiconductor wafer and method of manufacturing semiconductor chip

System for dynamically provisioning cyber training environments

Module and method of manufacturing the same

Method for manufacturing semiconductor mark, and semiconductor mark

Die cleaning systems and related methods

Method for dicing a semiconductor wafer structure

Wafer registration and overlay measurement systems and related methods

Semiconductor device and method of forming micro interconnect struc...

Photolithography alignment process for bonded wafers

Semiconductor wafer and semiconductor dies formed therefrom includi...

Wafer structure and semiconductor device

Integrated circuit device including metal-oxide semiconductor trans...

Method for forming fin structure in fin field effect transistor pro...

Method of processing a workpiece and system for processing a workpiece

Package module comprising marking and shield films and method of ma...

Method of manufacturing a semiconductor device including a pluralit...

Bonding to alignment marks with dummy alignment marks

Semiconductor package and method of forming the same

Carrier structure

Semiconductor marks and forming methods thereof

Interposer, semiconductor package including the same, and method of...

Semiconductor device and method for manufacturing the same

Array substrate comprising a binding region having a binding zone a...

Bonding apparatus, bonding system, and bonding method

Strip substrate having protection pattern on sidewall of conductive...

Package structure and method of fabricating the same

Optical measurement tool containing chromatic aberration enhancemen...

Semiconductor structure including interconnection to probe pad with...

Patents Applicationslast 30 patents

EMBEDDED CHIP-PACKAGE, SEMICONDUCTOR PACKAGE, METHOD OF FORMING AN...

METHOD OF MANUFACTURING WAFER

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Display Substrate and Preparation Method Therefor, and Display Appa...

ALIGNMENT STRUCTURES FOR DIE PICK-AND-PLACEMENT AND METHODS OF USIN...

DISPLAY DEVICE

INTEGRATED STEALTH LASER FOR WAFER EDGE TRIMMING PROCESS

ELECTRONIC COMPONENT, CIRCUIT BOARD AND METHOD

DISPLAY DEVICES AND METHODS FOR MANUFACTURING THE SAME

METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE WITH SEAL RING STRUCTURE AND METHOD FOR FORMIN...

WAFER ALIGNMENT SYSTEM AND WAFER ALIGNMENT METHOD

SEMICONDUCTOR WAFER AND METHOD OF WAFER THINNING

BONDING SYSTEM AND METHOD

STIFFENER ASSEMBLY AND METHOD FOR MAKING A SEMICONDUCTOR ASSEMBLY

METHOD FOR FABRICATING TOPSIDE COOLED SEMICONDUCTOR PACKAGES BY FIL...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

OVERLAY METROLOGY TARGET FOR DIE-TO-WAFER OVERLAY METROLOGY

SEMICONDUCTOR DEVICE INCLUDING AN ALIGNMENT MARK AND METHODS OF FOR...

THREE-DIMENSIONAL SELF-REFERENCE MARKING FEATURES

SYSTEMS FOR VISIBLE WAVELENGTH MEASUREMENT OF OVERLAY OF WAFER-ON-W...

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND WAFER-ATTACHED STRUCTURE

APPARATUS WITH IMPLANTED ALIGNMENT MARK AND METHODS OF MANUFACTURIN...

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR WAFER A...

METHOD FOR FORMING A SEMICONDUCTOR DEVICE, AND A STRUCTURE FORMED B...

WAFER BEFORE SEMICONDUCTOR PROCESS AND SEMICONDUCTOR CHIP MANUFACTU...

SEMICONDUCTOR PACKAGE

METHOD OF DETERMINING PROBING PARAMETERS FOR PROBE SYSTEM TO TEST D...

METHOD FOR MANUFACTURING ELECTRONIC DEVICE