Marks applied to semiconductor devices or parts

Industry

CPC
H01L23/544

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/544Marks applied to semiconductor devices or parts

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Wafer assembly having alignment marks, method for forming same, and...
- Patent number 12,368,110
- Issue date Jul 22, 2025
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Guoliang Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer structure for semiconductor package including peripheral...
- Patent number 12,368,109
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and semiconductor package including the same
- Patent number 12,362,286
- Issue date Jul 15, 2025
- Samsung Electronics Co., Ltd.
- Byeonguk Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment structure for semiconductor device and method of forming...
- Patent number 12,362,285
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Sheng Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
- Patent number 12,362,326
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a chip package
- Patent number 12,362,178
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensing device including light reception alignment marks
- Patent number 12,364,029
- Issue date Jul 15, 2025
- SK hynix Inc.
- Seok Jae Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module
- Patent number 12,356,538
- Issue date Jul 8, 2025
- Murata Manufacturing Co., Ltd.
- Tadashi Nomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with overlay mark
- Patent number 12,354,970
- Issue date Jul 8, 2025
- NANYA TECHNOLOGY CORPORATION
- Chun-Yen Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure, method for manufacturing same and memory
- Patent number 12,354,971
- Issue date Jul 8, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Shaowen Qiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-receiving device
- Patent number 12,356,752
- Issue date Jul 8, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Kentaro Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices and corresponding sem...
- Patent number 12,354,886
- Issue date Jul 8, 2025
- STMicroelectronics S.r.l.
- Andrea Albertinetti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing the same
- Patent number 12,354,899
- Issue date Jul 8, 2025
- Samsung Electronics Co., Ltd.
- Taeyong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional (3D) memory device and fabrication method
- Patent number 12,347,787
- Issue date Jul 1, 2025
- Yangtze Memory Technologies Co., Ltd.
- Chuanhai Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with crack-blocking three-dimensional struc...
- Patent number 12,347,790
- Issue date Jul 1, 2025
- Murata Manufacturing Co., Ltd.
- Frédéric Voiron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device including a panel alignment mark
- Patent number 12,347,786
- Issue date Jul 1, 2025
- Samsung Display Co., Ltd.
- Chung Seok Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Backside metal patterning die singulation system and related methods
- Patent number 12,341,069
- Issue date Jun 24, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin shaping device
- Patent number 12,341,036
- Issue date Jun 24, 2025
- BONDTECH CO., LTD.
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 12,341,067
- Issue date Jun 24, 2025
- United Microelectronics Corp.
- Meng-Ting Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Identification system
- Patent number 12,332,480
- Issue date Jun 17, 2025
- GLOBALFOUNDRIES U.S. Inc.
- Arpan Dasgupta
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Physical unclonable function
- Patent number 12,327,798
- Issue date Jun 10, 2025
- International Business Machines Corporation
- Kangguo Cheng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Probe pad with built-in interconnect structure
- Patent number 12,327,770
- Issue date Jun 10, 2025
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Robust mold integrated substrate
- Patent number 12,327,801
- Issue date Jun 10, 2025
- Intel Corporation
- Jimin Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Large die wafer, large die and method of forming the same
- Patent number 12,322,707
- Issue date Jun 3, 2025
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Sheng Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,322,708
- Issue date Jun 3, 2025
- Renesas Electronics Corporation
- Takehirou Mariko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package using a coreless signal distribution structure
- Patent number 12,322,731
- Issue date Jun 3, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Do Hyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate alignment systems and related methods
- Patent number 12,322,632
- Issue date Jun 3, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shifted via-chain electrical-test measurements for hybrid bonding a...
- Patent number 12,322,661
- Issue date Jun 3, 2025
- Tokyo Electron Limited
- Kevin Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and laser marking method
- Patent number 12,322,709
- Issue date Jun 3, 2025
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Kosuke Masuzawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip with fuse structure in scribe lane and method of...
- Patent number 12,315,800
- Issue date May 27, 2025
- Samsung Electronics Co., Ltd.
- Donghwa Lee
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250239463
- Publication date Jul 24, 2025
- UNITED MICROELECTRONICS CORP.
- Chien-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250239569
- Publication date Jul 24, 2025
- Advanced Semiconductor Engineering, Inc.
- Chih-Ming HUNG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ALIGNMENT MARK AND METHOD
- Publication number 20250237966
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Chung CHIEN
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
DIE ATTACH SYSTEMS, AND METHODS FOR INTEGRATED ACCURACY VERIFICATIO...
- Publication number 20250233000
- Publication date Jul 17, 2025
- Assembleon B.V.
- Alain De Bock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE CLEANING SYSTEMS AND RELATED METHODS
- Publication number 20250233021
- Publication date Jul 17, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER ALIGNMENT MARK STRUCTURE
- Publication number 20250233078
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Wei YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE INCLUDING MARK STRUCTU...
- Publication number 20250233079
- Publication date Jul 17, 2025
- NANYA TECHNOLOGY CORPORATION
- CHIH-HSUAN YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING DISPLAY DEVICE AND APPARATUS FOR MANUFACTU...
- Publication number 20250226243
- Publication date Jul 10, 2025
- SAMSUNG DISPLAY CO., LTD.
- Dong Woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFRACTION-BASED OVERLAY MARK DESIGN
- Publication number 20250226333
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Wei TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESS PACK POWER SEMICONDUCTOR DEVICE WITH LOCATOR STRIP
- Publication number 20250218971
- Publication date Jul 3, 2025
- LITTELFUSE, INC.
- Thomas Spann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE AND SEMICONDUCTOR EPITAXIAL SUBSTRATE
- Publication number 20250218972
- Publication date Jul 3, 2025
- Sumitomo Electric Industries, Ltd.
- Takashi SAKURADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR SOLAR PANEL TRACKING
- Publication number 20250221084
- Publication date Jul 3, 2025
- Terabase Energy, Inc.
- Allan Daly
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGE STRUCTURE INCLUDING A PACKAGE SUBSTRATE AND METHODS OF FORM...
- Publication number 20250210484
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chia-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT APPLIED INTERPOSER FOR CO-PACKAGED OPTICS
- Publication number 20250210613
- Publication date Jun 26, 2025
- Applied Materials, Inc.
- Guan-Shian CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING RECOGNITION MARKS
- Publication number 20250210539
- Publication date Jun 26, 2025
- SK HYNIX INC.
- Hyun Chul SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS FOR IMPROVED PLACEMENT OF REDISTRIBUTION LAYERS IN MULTI-DI...
- Publication number 20250210486
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jhih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING METAL GATE AND TRENCH CONTACT...
- Publication number 20250212450
- Publication date Jun 26, 2025
- Intel Corporation
- Leonard P. GULER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250210537
- Publication date Jun 26, 2025
- NOVATEK MICROELECTRONICS CORP.
- Chiang-Chi Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS, SYSTEM, AND METHOD FOR UNIQUELY IDENTIFYING INDIVIDUAL D...
- Publication number 20250210538
- Publication date Jun 26, 2025
- ADVANCED MICRO DEVICES, INC.
- Richard Martin Born
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250210465
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250210487
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Hyeonjeong Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS WITH CIRCUIT-LOCATING MECHANISM
- Publication number 20250201331
- Publication date Jun 19, 2025
- Micron Technology, Inc.
- Itamar Lavy
- G11 - INFORMATION STORAGE
Information Patent Application
MODULAR PACKAGE STRUCTURES WITH INTERPOSERS HAVING ALIGNMENT FEATURES
- Publication number 20250192064
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250192065
- Publication date Jun 12, 2025
- Mitsubishi Electric Corporation
- Haruki MURAKAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Nanosheet FET with Controlled Overlay Mark
- Publication number 20250194180
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Min Gyu Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250192029
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Wonkeun CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING ALIGNMENT PATTERN AND MANUFACTURING...
- Publication number 20250192104
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Hung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER WITH RECESSED PORTIONS AT A SCRIBE AREA
- Publication number 20250192066
- Publication date Jun 12, 2025
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20250183168
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR FABRICATION OF INFRARED TRANSPARENT WINDOW...
- Publication number 20250185393
- Publication date Jun 5, 2025
- DRS Network & Imaging Systems, LLC
- Thomas Schimert
- H01 - BASIC ELECTRIC ELEMENTS

Marks applied to semiconductor devices or parts

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wafer assembly having alignment marks, method for forming same, and...

Interposer structure for semiconductor package including peripheral...

Printed circuit board and semiconductor package including the same

Alignment structure for semiconductor device and method of forming...

Semiconductor package and method of manufacturing semiconductor pac...

Method for fabricating a chip package

Image sensing device including light reception alignment marks

Electronic component module

Semiconductor device structure with overlay mark

Semiconductor structure, method for manufacturing same and memory

Light-receiving device

Method of manufacturing semiconductor devices and corresponding sem...

Semiconductor devices and methods of manufacturing the same

Three dimensional (3D) memory device and fabrication method

Semiconductor structure with crack-blocking three-dimensional struc...

Display device including a panel alignment mark

Backside metal patterning die singulation system and related methods

Resin shaping device

Manufacturing method of semiconductor device

Identification system

Physical unclonable function

Probe pad with built-in interconnect structure

Robust mold integrated substrate

Large die wafer, large die and method of forming the same

Semiconductor device

Semiconductor package using a coreless signal distribution structure

Substrate alignment systems and related methods

Shifted via-chain electrical-test measurements for hybrid bonding a...

Semiconductor device and laser marking method

Semiconductor chip with fuse structure in scribe lane and method of...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

ALIGNMENT MARK AND METHOD

DIE ATTACH SYSTEMS, AND METHODS FOR INTEGRATED ACCURACY VERIFICATIO...

DIE CLEANING SYSTEMS AND RELATED METHODS

MULTI-LAYER ALIGNMENT MARK STRUCTURE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE INCLUDING MARK STRUCTU...

METHOD FOR MANUFACTURING DISPLAY DEVICE AND APPARATUS FOR MANUFACTU...

DIFFRACTION-BASED OVERLAY MARK DESIGN

PRESS PACK POWER SEMICONDUCTOR DEVICE WITH LOCATOR STRIP

SEMICONDUCTOR SUBSTRATE AND SEMICONDUCTOR EPITAXIAL SUBSTRATE

SYSTEMS AND METHODS FOR SOLAR PANEL TRACKING

PACKAGE STRUCTURE INCLUDING A PACKAGE SUBSTRATE AND METHODS OF FORM...

DIRECT APPLIED INTERPOSER FOR CO-PACKAGED OPTICS

SEMICONDUCTOR DEVICES INCLUDING RECOGNITION MARKS

SYSTEMS FOR IMPROVED PLACEMENT OF REDISTRIBUTION LAYERS IN MULTI-DI...

INTEGRATED CIRCUIT STRUCTURES HAVING METAL GATE AND TRENCH CONTACT...

SEMICONDUCTOR DEVICE

APPARATUS, SYSTEM, AND METHOD FOR UNIQUELY IDENTIFYING INDIVIDUAL D...

PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

APPARATUS WITH CIRCUIT-LOCATING MECHANISM

MODULAR PACKAGE STRUCTURES WITH INTERPOSERS HAVING ALIGNMENT FEATURES

SEMICONDUCTOR DEVICE

Nanosheet FET with Controlled Overlay Mark

SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE HAVING ALIGNMENT PATTERN AND MANUFACTURING...

SEMICONDUCTOR WAFER WITH RECESSED PORTIONS AT A SCRIBE AREA

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

METHODS AND SYSTEMS FOR FABRICATION OF INFRARED TRANSPARENT WINDOW...