Marks applied to semiconductor devices or parts

Industry

CPC
H01L23/544

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/544Marks applied to semiconductor devices or parts

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Large die wafer, large die and method of forming the same
- Patent number 12,322,707
- Issue date Jun 3, 2025
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Sheng Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,322,708
- Issue date Jun 3, 2025
- Renesas Electronics Corporation
- Takehirou Mariko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package using a coreless signal distribution structure
- Patent number 12,322,731
- Issue date Jun 3, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Do Hyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate alignment systems and related methods
- Patent number 12,322,632
- Issue date Jun 3, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shifted via-chain electrical-test measurements for hybrid bonding a...
- Patent number 12,322,661
- Issue date Jun 3, 2025
- Tokyo Electron Limited
- Kevin Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and laser marking method
- Patent number 12,322,709
- Issue date Jun 3, 2025
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Kosuke Masuzawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Image pickup unit, endoscope, and method of manufacturing image pic...
- Patent number 12,317,629
- Issue date May 27, 2025
- Olympus Medical Systems Corp.
- Junya Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer positioning method and apparatus
- Patent number 12,315,753
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Cheng Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor chip with fuse structure in scribe lane and method of...
- Patent number 12,315,800
- Issue date May 27, 2025
- Samsung Electronics Co., Ltd.
- Donghwa Lee
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor die
- Patent number 12,315,767
- Issue date May 27, 2025
- United Microelectronics Corp.
- Po-Yu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,315,823
- Issue date May 27, 2025
- Kabushiki Kaisha Toshiba
- Yoshiharu Takada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 12,315,840
- Issue date May 27, 2025
- Intel Corporation
- Shawna M. Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing display device and apparatus for manufactu...
- Patent number 12,308,259
- Issue date May 20, 2025
- Samsung Display Co., Ltd.
- Dong Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous integration of components onto compact devices using...
- Patent number 12,308,275
- Issue date May 20, 2025
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Overlay mark
- Patent number 12,308,324
- Issue date May 20, 2025
- Winbond Electronics Corp.
- Kuang-Chung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structures having a watermark
- Patent number 12,300,627
- Issue date May 13, 2025
- GLOBALFOUNDRIES U.S. Inc.
- Alain Loiseau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Element chip manufacturing method and substrate processing method
- Patent number 12,300,482
- Issue date May 13, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hidehiko Karasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor element and semiconductor ele...
- Patent number 12,300,547
- Issue date May 13, 2025
- Nichia Corporation
- Kazuki Yamaguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a bonded semiconductor structure
- Patent number 12,300,660
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grindable heat sink for multiple die packaging
- Patent number 12,300,570
- Issue date May 13, 2025
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment mark and method
- Patent number 12,292,694
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Chung Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit stack verification method and system for perform...
- Patent number 12,293,141
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng Wei Kuo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor chip, processed wafer, and method for manufacturing s...
- Patent number 12,288,720
- Issue date Apr 29, 2025
- Denso Corporation
- Masatake Nagaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of operating die attach systems
- Patent number 12,288,711
- Issue date Apr 29, 2025
- Assembleon B.V.
- Alain De Bock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tiled display device
- Patent number 12,288,772
- Issue date Apr 29, 2025
- Samsung Display Co., Ltd.
- Sang Seop Kum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Material processing method and material processing system for perfo...
- Patent number 12,280,445
- Issue date Apr 22, 2025
- Carl Zeiss Microscopy GmbH
- Stephan Hiller
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer bonding alignment
- Patent number 12,283,568
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsi-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite and transistor
- Patent number 12,283,633
- Issue date Apr 22, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus and method of manufacturing the same
- Patent number 12,283,550
- Issue date Apr 22, 2025
- Samsung Display Co., Ltd.
- Dong Hwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic component with two-dimensional code on its surface,...
- Patent number 12,278,194
- Issue date Apr 15, 2025
- Osram Opto Semiconductors GmbH
- Michael Brandl
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20250183168
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION SCHEME DESIGN FOR WAFER SINGULATION
- Publication number 20250183192
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR FABRICATION OF INFRARED TRANSPARENT WINDOW...
- Publication number 20250185393
- Publication date Jun 5, 2025
- DRS Network & Imaging Systems, LLC
- Thomas Schimert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM OF OPTICAL NANOSCALE ALIGNMENT
- Publication number 20250183080
- Publication date Jun 5, 2025
- Institut National de la Recherche Scientifique
- Jinyang LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING DEVICE, SEMICONDUCTOR CHIP MANUFACTURING METHOD, AND SEMICON...
- Publication number 20250174473
- Publication date May 29, 2025
- YAMAHA HATSUDOKI KABUSHIKI KAISHA
- Yoshikuni SUZUKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250174556
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Jitaek OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING STRETCHABLE DISPLAY DEVICE USING SELF-ASSE...
- Publication number 20250176309
- Publication date May 29, 2025
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Doo-Hee CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER, METHOD OF FABRICATING THE SAME, AND SEMICONDUCTOR PACKA...
- Publication number 20250174571
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Sungwoo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Comprising Vertically-Stacked Decks
- Publication number 20250174619
- Publication date May 29, 2025
- Micron Technology, Inc.
- Werner Juengling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250174572
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Hyun Ung Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR CHIPS HAVING PROTECTED IDENTIFICATION MARKS...
- Publication number 20250174573
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Yeongkwon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET ALIGNMENT AND REPAIR IN MICRO DEVICE TRANSFER
- Publication number 20250167033
- Publication date May 22, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES COMPRISING OVERLAY MARKS
- Publication number 20250167130
- Publication date May 22, 2025
- Micron Technology, Inc.
- Rohit Kothari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE AND TRANSISTOR
- Publication number 20250169114
- Publication date May 22, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURE OVERLAY MARK USING LASER MARKING PROCESS FOR...
- Publication number 20250167129
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250167054
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Duckgyu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION MEMBER, AND METHOD...
- Publication number 20250167065
- Publication date May 22, 2025
- SK HYNIX INC.
- Jun Young KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET ALIGNMENT AND REPAIR IN MICRO DEVICE TRANSFER
- Publication number 20250167032
- Publication date May 22, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRIP SUBSTRATE AND SEMICONDUCTOR PACKAGE
- Publication number 20250167097
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Sunnyeong JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A SOLDER BALL
- Publication number 20250167128
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Junghoon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING A PLURALIT...
- Publication number 20250157922
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Yuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOLITHOGRAPHY ALIGNMENT PROCESS FOR BONDED WAFERS
- Publication number 20250157943
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yeong-Jyh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250157942
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Jisoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST JIG, TESTING METHOD, AND METHOD OF MANUFACTURING SEMICONDUCTOR...
- Publication number 20250155490
- Publication date May 15, 2025
- Fuji Electric Co., Ltd.
- Mitsuru YOSHIDA
- G01 - MEASURING TESTING
Information Patent Application
Light-Emitting Substrate, Backlight Module and Display Device
- Publication number 20250160099
- Publication date May 15, 2025
- Hefei BOE Ruisheng Technology Co., Ltd.
- Kangli Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DICING A SEMICONDUCTOR WAFER STRUCTURE
- Publication number 20250149384
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149424
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE CLEANING SYSTEMS AND RELATED METHODS
- Publication number 20250149386
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250149464
- Publication date May 8, 2025
- KIOXIA Corporation
- Yoichi MIZUTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250148994
- Publication date May 8, 2025
- InnoLux Corporation
- Kuan-Feng LEE
- G06 - COMPUTING CALCULATING COUNTING

Marks applied to semiconductor devices or parts

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Large die wafer, large die and method of forming the same

Semiconductor device

Semiconductor package using a coreless signal distribution structure

Substrate alignment systems and related methods

Shifted via-chain electrical-test measurements for hybrid bonding a...

Semiconductor device and laser marking method

Image pickup unit, endoscope, and method of manufacturing image pic...

Wafer positioning method and apparatus

Semiconductor chip with fuse structure in scribe lane and method of...

Semiconductor die

Semiconductor device

Microelectronic assemblies

Method for manufacturing display device and apparatus for manufactu...

Heterogeneous integration of components onto compact devices using...

Overlay mark

Integrated circuit structures having a watermark

Element chip manufacturing method and substrate processing method

Method of manufacturing semiconductor element and semiconductor ele...

Method of forming a bonded semiconductor structure

Grindable heat sink for multiple die packaging

Alignment mark and method

Integrated circuit stack verification method and system for perform...

Semiconductor chip, processed wafer, and method for manufacturing s...

Methods of operating die attach systems

Tiled display device

Material processing method and material processing system for perfo...

Wafer bonding alignment

Composite and transistor

Electronic apparatus and method of manufacturing the same

Optoelectronic component with two-dimensional code on its surface,...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

PASSIVATION SCHEME DESIGN FOR WAFER SINGULATION

METHODS AND SYSTEMS FOR FABRICATION OF INFRARED TRANSPARENT WINDOW...

METHOD AND SYSTEM OF OPTICAL NANOSCALE ALIGNMENT

DICING DEVICE, SEMICONDUCTOR CHIP MANUFACTURING METHOD, AND SEMICON...

SEMICONDUCTOR PACKAGE

METHOD FOR MANUFACTURING STRETCHABLE DISPLAY DEVICE USING SELF-ASSE...

INTERPOSER, METHOD OF FABRICATING THE SAME, AND SEMICONDUCTOR PACKA...

Integrated Assemblies Comprising Vertically-Stacked Decks

SEMICONDUCTOR PACKAGE

PACKAGED SEMICONDUCTOR CHIPS HAVING PROTECTED IDENTIFICATION MARKS...

OFFSET ALIGNMENT AND REPAIR IN MICRO DEVICE TRANSFER

ELECTRONIC DEVICES COMPRISING OVERLAY MARKS

COMPOSITE AND TRANSISTOR

METHOD OF MANUFACTURE OVERLAY MARK USING LASER MARKING PROCESS FOR...

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION MEMBER, AND METHOD...

OFFSET ALIGNMENT AND REPAIR IN MICRO DEVICE TRANSFER

STRIP SUBSTRATE AND SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING A SOLDER BALL

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING A PLURALIT...

PHOTOLITHOGRAPHY ALIGNMENT PROCESS FOR BONDED WAFERS

SEMICONDUCTOR DEVICE

TEST JIG, TESTING METHOD, AND METHOD OF MANUFACTURING SEMICONDUCTOR...

Light-Emitting Substrate, Backlight Module and Display Device

METHOD FOR DICING A SEMICONDUCTOR WAFER STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

DIE CLEANING SYSTEMS AND RELATED METHODS

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC DEVICE