Marks applied to semiconductor devices or parts

Industry

CPC
H01L23/544

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/544Marks applied to semiconductor devices or parts

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package and method for manufacturing the same
- Patent number 12,272,671
- Issue date Apr 8, 2025
- Advanced Semiconductor Engineering, Inc.
- Chih-Ming Hung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package and manufacturing method thereof
- Patent number 12,272,622
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging substrate and manufacturing method thereof
- Patent number 12,272,653
- Issue date Apr 8, 2025
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Chao-Tsung Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for fabricating fiducials using selective area gr...
- Patent number 12,272,654
- Issue date Apr 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Clifford Drowley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus with circuit-locating mechanism
- Patent number 12,266,411
- Issue date Apr 1, 2025
- Micron Technology, Inc.
- Itamar Lavy
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device with decoupling unit
- Patent number 12,266,600
- Issue date Apr 1, 2025
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,261,126
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Hsien Chiang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of designing an alignment mark
- Patent number 12,259,664
- Issue date Mar 25, 2025
- ASML Netherlands B.V.
- Jigang Ma
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 12,261,131
- Issue date Mar 25, 2025
- Fuji Electric Co., Ltd.
- Tsuneyuki Matsushima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for manufacturing semiconductor devices using MOIRÉ patterns
- Patent number 12,259,662
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Woohyeok Jeong
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Display device
- Patent number 12,261,971
- Issue date Mar 25, 2025
- WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Peng Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for sealing a silicon IC
- Patent number 12,261,132
- Issue date Mar 25, 2025
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded high-z marker material and process for alignment of multil...
- Patent number 12,255,047
- Issue date Mar 18, 2025
- HRL Laboratories, LLC
- Christopher Bohn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Splash resistant laser wafer singulation by crack length control
- Patent number 12,255,097
- Issue date Mar 18, 2025
- Texas Instruments Incorporated
- Yang Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
CMP safe alignment mark
- Patent number 12,255,150
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Huang-Jen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation scheme design for wafer singulation
- Patent number 12,249,580
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with air gap in pattern- dense region and m...
- Patent number 12,249,512
- Issue date Mar 11, 2025
- NANYA TECHNOLOGY CORPORATION
- Jar-Ming Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,249,287
- Issue date Mar 11, 2025
- Innolux Corporation
- Kuan-Feng Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of manufacture overlay mark using laser marking process for...
- Patent number 12,249,581
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies comprising vertically-stacked decks with inte...
- Patent number 12,249,598
- Issue date Mar 11, 2025
- Micron Technology, Inc.
- Werner Juengling
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for manufacturing semiconductor device structure with overla...
- Patent number 12,243,832
- Issue date Mar 4, 2025
- NANYA TECHNOLOGY CORPORATION
- Chun-Yen Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radiation detector, radiation CT apparatus, and method of manufactu...
- Patent number 12,243,903
- Issue date Mar 4, 2025
- Canon Kabushiki Kaisha
- Takashi Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and method of manufacturing semiconductor chip
- Patent number 12,243,831
- Issue date Mar 4, 2025
- JVCKENWOOD CORPORATION
- Takayuki Iwasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for dynamically provisioning cyber training environments
- Patent number 12,237,199
- Issue date Feb 25, 2025
- Circadence Corporation
- Laura Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module and method of manufacturing the same
- Patent number 12,237,271
- Issue date Feb 25, 2025
- Murata Manufacturing Co., Ltd.
- Tadashi Nomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor mark, and semiconductor mark
- Patent number 12,230,584
- Issue date Feb 18, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chuang Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die cleaning systems and related methods
- Patent number 12,230,543
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for dicing a semiconductor wafer structure
- Patent number 12,230,542
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer registration and overlay measurement systems and related methods
- Patent number 12,230,546
- Issue date Feb 18, 2025
- Micron Technology, Inc.
- Nikolay A. Mirin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming micro interconnect struc...
- Patent number 12,230,559
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HEAT DISSIPATION SUBSTRATE FOR A POWER SEMICONDUCTOR MODULE, A POWE...
- Publication number 20250118680
- Publication date Apr 10, 2025
- LX Semicon Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF A HEAT DISSIPATION SUBSTRATE FOR A POWER SE...
- Publication number 20250118573
- Publication date Apr 10, 2025
- LX Semicon Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD EFFECT TRANSISTOR WITH ALIGNMENT MARK AND RELATED METHODS
- Publication number 20250118679
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE INCLUDING THE SEMICONDUCTO...
- Publication number 20250118681
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250118682
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING REGISTRATION MARKS FOR DUAL-SI...
- Publication number 20250112150
- Publication date Apr 3, 2025
- Intel Corporation
- Hwichan JUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DESIGN LITHOGRAPHIC SEAM IMPLEMENTATION METHODOLOGY F...
- Publication number 20250112167
- Publication date Apr 3, 2025
- Intel Corporation
- Kimberly Pierce
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEMS, AND METHODS OF BONDING A SEMICONDUCTOR ELEMENT TO...
- Publication number 20250112201
- Publication date Apr 3, 2025
- KULICKE AND SOFFA INDUSTRIES, INC.
- Andreas Marte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING WITH EMBEDDED ALIGNMENT MARKERS
- Publication number 20250112168
- Publication date Apr 3, 2025
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MISALIGNMENT MEASUREMENT METHOD FOR SEMICO...
- Publication number 20250105062
- Publication date Mar 27, 2025
- LAPIS Semiconductor Co., Ltd.
- Takumi TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor structure and alignment method thereof
- Publication number 20250105166
- Publication date Mar 27, 2025
- UNITED MICROELECTRONICS CORP.
- Chiao-Yi Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250105213
- Publication date Mar 27, 2025
- Macronix International Co., Ltd.
- Shao-En Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING WAFER
- Publication number 20250105167
- Publication date Mar 27, 2025
- Disco Corporation
- Naoko YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE
- Publication number 20250105179
- Publication date Mar 27, 2025
- Mitsubishi Electric Corporation
- Chikara INADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250105127
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Dohyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS
- Publication number 20250098325
- Publication date Mar 20, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR DIE
- Publication number 20250095987
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Chi FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A SILICON CARBIDE PORTION AND A GLASS STR...
- Publication number 20250096149
- Publication date Mar 20, 2025
- INFINEON TECHNOLOGIES AG
- Rudolf Elpelt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOELECTRIC CONVERSION APPARATUS, PHOTOELECTRIC CONVERSION SYSTEM...
- Publication number 20250098341
- Publication date Mar 20, 2025
- Canon Kabushiki Kaisha
- HIROSHI SEKINE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OVERLAY MARK
- Publication number 20250096147
- Publication date Mar 20, 2025
- Macronix International Co., Ltd.
- Chiung Jung Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MARKING SEMICONDUCTOR PACKAGE
- Publication number 20250096148
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Kanggyune LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOLITHOGRAPHY METHOD AND STRUCTURES THEREOF
- Publication number 20250096146
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao Chu Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR BONDING WAFERS OF KNOWN GOOD DIES, AND ASSEMBLIES RESUL...
- Publication number 20250096171
- Publication date Mar 20, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUSES FOR MICROFABRICATION AND LASER WRITING ALIG...
- Publication number 20250085644
- Publication date Mar 13, 2025
- IonQ, Inc.
- Jason Madjdi AMINI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DIODE CHIP AND LIGHT-EMITTING DEVICE
- Publication number 20250087594
- Publication date Mar 13, 2025
- Xiamen San'An Optoelectronics Co., Ltd.
- Jenlung YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dicing Street Design for Hybrid Bonding
- Publication number 20250087629
- Publication date Mar 13, 2025
- International Business Machines Corporation
- Roy R. Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250087592
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Geng-Ming CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250087593
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Juil CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Display Substrate and Preparation Method Therefor, and Display Appa...
- Publication number 20250081610
- Publication date Mar 6, 2025
- BOE TECHNOLOGY GROUP CO., LTD.
- Li XIAO
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
EMBEDDED CHIP-PACKAGE, SEMICONDUCTOR PACKAGE, METHOD OF FORMING AN...
- Publication number 20250079330
- Publication date Mar 6, 2025
- INFINEON TECHNOLOGIES AG
- Mahadi-Ul HASSAN
- H01 - BASIC ELECTRIC ELEMENTS

Marks applied to semiconductor devices or parts

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device package and method for manufacturing the same

Package and manufacturing method thereof

Semiconductor packaging substrate and manufacturing method thereof

Method and system for fabricating fiducials using selective area gr...

Apparatus with circuit-locating mechanism

Semiconductor device with decoupling unit

Semiconductor package

Method of designing an alignment mark

Semiconductor device and method of manufacturing semiconductor device

Methods for manufacturing semiconductor devices using MOIRÉ patterns

Display device

Structure and method for sealing a silicon IC

Embedded high-z marker material and process for alignment of multil...

Splash resistant laser wafer singulation by crack length control

CMP safe alignment mark

Passivation scheme design for wafer singulation

Semiconductor structure with air gap in pattern- dense region and m...

Electronic device

Method of manufacture overlay mark using laser marking process for...

Integrated assemblies comprising vertically-stacked decks with inte...

Method for manufacturing semiconductor device structure with overla...

Radiation detector, radiation CT apparatus, and method of manufactu...

Semiconductor wafer and method of manufacturing semiconductor chip

System for dynamically provisioning cyber training environments

Module and method of manufacturing the same

Method for manufacturing semiconductor mark, and semiconductor mark

Die cleaning systems and related methods

Method for dicing a semiconductor wafer structure

Wafer registration and overlay measurement systems and related methods

Semiconductor device and method of forming micro interconnect struc...

Patents Applicationslast 30 patents

HEAT DISSIPATION SUBSTRATE FOR A POWER SEMICONDUCTOR MODULE, A POWE...

MANUFACTURING METHOD OF A HEAT DISSIPATION SUBSTRATE FOR A POWER SE...

FIELD EFFECT TRANSISTOR WITH ALIGNMENT MARK AND RELATED METHODS

SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE INCLUDING THE SEMICONDUCTO...

PACKAGE STRUCTURE

INTEGRATED CIRCUIT STRUCTURES HAVING REGISTRATION MARKS FOR DUAL-SI...

SEMICONDUCTOR DESIGN LITHOGRAPHIC SEAM IMPLEMENTATION METHODOLOGY F...

BONDING SYSTEMS, AND METHODS OF BONDING A SEMICONDUCTOR ELEMENT TO...

HYBRID BONDING WITH EMBEDDED ALIGNMENT MARKERS

SEMICONDUCTOR DEVICE AND MISALIGNMENT MEASUREMENT METHOD FOR SEMICO...

Semiconductor structure and alignment method thereof

SEMICONDUCTOR DEVICE

METHOD OF PROCESSING WAFER

SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS

METHOD FOR FORMING SEMICONDUCTOR DIE

SEMICONDUCTOR DEVICE WITH A SILICON CARBIDE PORTION AND A GLASS STR...

PHOTOELECTRIC CONVERSION APPARATUS, PHOTOELECTRIC CONVERSION SYSTEM...

OVERLAY MARK

METHOD OF MARKING SEMICONDUCTOR PACKAGE

PHOTOLITHOGRAPHY METHOD AND STRUCTURES THEREOF

METHODS FOR BONDING WAFERS OF KNOWN GOOD DIES, AND ASSEMBLIES RESUL...

METHODS AND APPARATUSES FOR MICROFABRICATION AND LASER WRITING ALIG...

LIGHT-EMITTING DIODE CHIP AND LIGHT-EMITTING DEVICE

Dicing Street Design for Hybrid Bonding

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR PACKAGE

Display Substrate and Preparation Method Therefor, and Display Appa...

EMBEDDED CHIP-PACKAGE, SEMICONDUCTOR PACKAGE, METHOD OF FORMING AN...