Claims
- 1. A composition for reducing the light reflection in a photoresist pattern formation comprising:(a) a polymer of Chemical Formula 1, wherein each of R1and R2 is independently hydrogen, hydroxy, —CH2OH or —(CH2)nCH3; R3 is wherein R4 is hydrogen, —OCH3, —(CH2)nCH3, —(CH2)n—OH, and R5 is —COO— or —(CH2)nCH2—;n is an integer from 0 to 3; and x and y represent the relative amounts of each monomer, wherein the mole ratio of x:y is 0.0-0.9:0.1-1.0; provided that when x=0, then R3 is and R4 is (b) a thermal acid generator selected from the group consisting of: (c) an organic solvent; and optionally (d) a polymer having hydroxyl group as a functional group.
- 2. The composition according to claim 1, wherein the polymer of Chemical Formula 1 is selected from the group consisting of:poly(glycidyl methacrylate/α-methyl styrene); poly(glycidyl acrylate/acryloyl phenoxy bis(-4-hydroxy phenyl)ethane); poly(glycidyl methacrylate/glycidyl methyl styrene); polyglycidyl methyl styrene; poly(styrene/glycidyl methyl styrene); poly(glycidyl methacrylate/vinylanisole); and poly(glycidyl methacrylate/vinylbenzoate).
- 3. The composition according to claim 1, wherein the polymer of Chemical Formula 1 has a weight average molecular weight of 2,000 to 50,000.
- 4. The composition according to claim 1, wherein the thermal acid generator is used in an amount ranging from about 2 to about 30 wt % of the polymer of Chemical Formula 1.
- 5. The composition according to claim 1, wherein the organic solvent is selected from the group consisting of propylene glycol methyl ether acetate (PGMEA), methyl 3-methoxypropionate (MMP), ethyl 3-ethoxypropionate (EEP), cyclohexanone and mixtures thereof.
- 6. The composition according to claim 1, wherein the organic solvent is used in an amount ranging from about 3000 to about 7000 wt % of the polymer of Chemical Formula 1.
- 7. The composition according to claim 1, wherein the polymer having hydroxyl group further comprises phenyl group.
- 8. The composition according to claim 1, wherein the polymer having hydroxyl group comprises a repeating unit of polyvinyl phenol represented by the following Chemical Formula 11:
- 9. The composition according to claim 1, wherein the polymer comprising hydroxyl group is used in an amount of about 50 to about 200 wt % of the polymer of Chemical Formula 1.
Priority Claims (1)
Number |
Date |
Country |
Kind |
99-31300 |
Jul 1999 |
KR |
|
CROSS-REFERENCES TO RELATED APPLICATIONS
This is a Continuation-In-Part application of U.S. patent application Ser. No. 09/627,713, filed Jul. 28, 2000 now abandoned, which claims priority benefit of Korean Patent Application No. 99-31300, filed Jul. 30, 1999, all of which are incorporated herein by reference in their entirety.
US Referenced Citations (14)
Foreign Referenced Citations (5)
Number |
Date |
Country |
3601 423 |
Jul 1987 |
DE |
57-52049 |
Mar 1982 |
JP |
57-185036 |
Nov 1982 |
JP |
06043653 |
Feb 1994 |
JP |
11072921 |
Mar 1999 |
JP |
Continuation in Parts (1)
|
Number |
Date |
Country |
Parent |
09/627713 |
Jul 2000 |
US |
Child |
10/189056 |
|
US |