Claims
- 1. In an electronic apparatus wherein there is at least one chip package mounted on a circuit card, having circuit connections on one package face connected into the circuitry of said card and having an essentially parallel second package face, separated from said first package face by a height dimension, in contact with a heat sink having first and second faces said first heat sink face being in contact with said second package face, the process of mounting said heat sink in removable compressive contact with said second package face comprising the steps of:
- providing said heat sink with a plurality of holes extending from said first heat sink face to said second heat sink face,
- providing a plurality of post type fastener members each said fastener member having a body with first and second end regions defined by first and second shoulders respectively, said shoulders being separated along the length of said body by a dimension slightly less than said height dimension, each said post type fastener member further having spring means on said first end operable to apply force to said heat sink when positioned in said heat sink in the direction of said first shoulder and each said post type fastener member on said second end having expansion and retention construction features operable to retain said post type fastener member in a hole in said circuit card with said second shoulder in contact with said circuit card,
- positioning each said post type fastener with said first end region extending to said first shoulder, into a separate one of said holes in said heat sink and,
- positioning each said post type fastener with said second end region extending to said second shoulder into a separate hole in said circuit card.
- 2. The process of claim 1 wherein said plurality of post type fasteners is four.
- 3. The process of claim 2 wherein in each said post type fastener member said spring means is a plurality of spring fingers that fit through a corresponding one of said holes through said heat sink.
- 4. The process of claim 3 including the step of making each said post type fastener member spring means a separable spring finger unit and attaching the unit to said first end of said fastener member after said fastener member is in position through one of said holes in said heat sink.
- 5. A process for removably retaining a thermal transfer face of a heat sink in compressive contact with a first, thermal transfer face of a chip package said chip package having a second face separated from said first face by a height dimension and mounted in contact with a circuit card, comprising the steps of:
- providing said heat sink with a plurality of holes extending from said heat sink thermal transfer face to a second heat sink face,
- providing a plurality of post type fastener members each having a body with first and second end regions, said body having a first shoulder at said first end region with an insertion portion extending from said first shoulder, said insertion portion having expansion and retention construction features operable to retain said first end region of said body with said first shoulder in contact with said circuit card in a separate hole in said circuit card, said body having a second shoulder, separated along said body from said first shoulder, by a dimension slightly less than said height dimension of said chip package, said body further having at said second end region, a spring means extending through a separate hole through said heat sink and providing compressive spring force in the region of said heat sink surrounding said hole through said heat sink in the direction of said circuit card,
- positioning each said post type fastener with said second end region extending to said second shoulder, into a separate one of said holes in said heat sink and,
- positioning each said post type fastener with said first end region extending to said first shoulder into a separate hole in said circuit card.
- 6. The process of claim 5 including the step of assembling said plurality of post type fastener members in a frame surrounding said chip package.
- 7. The process of claim 6 wherein said plurality of post type fastener members is four.
- 8. The process of claim 7 including the step of making each said post type fastener member spring means a separable spring finger unit and attaching the unit to said second end of said fastener member after said fastener member is in position through one of said holes in said heat sink.
Parent Case Info
This is a divisional application of Ser. No. 08/405,069, filed Mar. 16, 1995, now U.S. Pat. No. 5,586,005.
US Referenced Citations (18)
Foreign Referenced Citations (3)
Number |
Date |
Country |
5160588A |
Jun 1993 |
JPX |
776746 |
Jun 1957 |
GBX |
1541448 |
Jun 1975 |
GBX |
Divisions (1)
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Number |
Date |
Country |
Parent |
405069 |
Mar 1995 |
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