Number | Name | Date | Kind |
---|---|---|---|
3226608 | Coffin | Dec 1965 | |
3248615 | Weisshaar | Apr 1966 | |
3271638 | Murad | Sep 1966 | |
3328642 | Haumesser et al. | Jun 1967 | |
4129881 | Reichei et al. | Dec 1978 |
Entry |
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IBM Technical Disclosure Bulletin, vol. 19, No. 5, Oct. 1976, Inner Fin Air Cooled Module by Cupta, p. 1804. |
IBM Technical Disclosure Bulletin, vol. 20, No. 10, Mar. 1978; by Johnson, Device cooling, pp. 3919 & 3920. |
IBM Technical Disclosure Bulletin, vol. 21, No. 1, Jun. 1978, by Blake, Packaging Structure, pp. 183 & 184. |
IBM Technical Disclosure Bulletin, vol. 16, No. 3, Aug. 1973, by Van Vestrout; Floating Backbond Mounting for a Chip Device. |