SEMICONDUCTOR DEVICE MANUFACTURING APPARATUS INCLUDING TEMPERATURE MEASURING UNIT

Abstract

A semiconductor device manufacturing apparatus comprises a chamber for processing a wafer, a wafer loading unit configured to load a wafer into and out of the chamber, a heating unit coupled with a chamber wall and a temperature measuring unit located between the chamber wall and the wafer loading unit and apart from the chamber wall.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention will become readily apparent to those of ordinary skill in the art when descriptions of exemplary embodiments thereof are read with reference to the accompanying drawings.

FIG. 1 is an exploded perspective view of a semiconductor device manufacturing apparatus according to an exemplary embodiment of the present invention.

FIG. 2 is a longitudinal cross-sectional view schematically showing a chamber for manufacturing a semiconductor device according to an exemplary embodiment of the present invention.

FIG. 3 is a transverse cross-sectional view schematically showing a chamber for manufacturing a semiconductor device according to an exemplary embodiment of the present invention.

FIG. 4 is a structural perspective view showing a chamber for manufacturing a semiconductor device according to an exemplary embodiment of the present invention.

FIG. 5 is an exploded perspective view schematically showing a chamber for manufacturing a semiconductor device according to an exemplary embodiment of the present invention.

FIG. 6 is a diagram illustrating a temperature measuring unit for a semiconductor device manufacturing apparatus according to an exemplary embodiment of the present invention.

FIG. 7 is a graph showing a change in temperature that is measured while a process of manufacturing a semiconductor device is performed using a semiconductor device manufacturing apparatus according to an exemplary embodiment of the present invention.

FIG. 8 is a graph showing a change in temperature that is measured while a process of manufacturing a semiconductor device is performed using a semiconductor device manufacturing apparatus according to an exemplary embodiment of the present invention.

Claims

1. A semiconductor device manufacturing apparatus comprising: a chamber for processing a wafer;a wafer loading unit configured to load a wafer into and out of the chamber;a heating unit coupled with a chamber wall; anda temperature measuring unit located between the chamber wall and the wafer loading unit and apart from the chamber wall.

2. The semiconductor device manufacturing apparatus of claim 1, wherein: the chamber comprises a gas inlet port for introducing gases into the chamber, and a gas outlet port for exhausting gases out of the chamber and located to oppose the gas inlet port, andthe temperature measuring unit is located closer to the gas outlet port than to the gas inlet port.

3. The semiconductor device manufacturing apparatus of claim 1, wherein the temperature measuring unit is a substantially cylindrical shape including an exterior of a protective tube.

4. The semiconductor device manufacturing apparatus of claim 3, wherein a thickness of the protective tube is 2 mm or less.

5. The semiconductor device manufacturing apparatus of claim 3, wherein the protective tube comprises at least one of quartz, anodized aluminum, or a compound thereof.

6. The semiconductor device manufacturing apparatus of claim 1, wherein the temperature measuring unit is a thermocouple type including electrodes formed of a nickel-chromium alloy and at least three temperature-measuring points for measuring a temperature through contact points between a positive (+) electrode and a negative (−) electrode.

7. The semiconductor device manufacturing apparatus of claim 1, wherein the wafer loading unit includes at least three supports and is capable of rotating and moving in a substantially vertical direction with a plurality of wafers loaded thereon.

8. The semiconductor device manufacturing apparatus of claim 1, wherein the heating unit includes a lamp located to be exposed at the chamber wall.

9. The semiconductor device manufacturing apparatus of claim 1, wherein the chamber includes a cooling system for cooling the chamber wall.

10. The semiconductor device manufacturing apparatus of claim 1, further comprising a blocking panel disposed at the periphery of the gas outlet port to guide a gas flow.

11. The semiconductor device manufacturing apparatus of claim 10, wherein the blocking panel is located to be depressed from the chamber wall.

12. The semiconductor device manufacturing apparatus of claim 10, wherein the temperature measuring unit is located at the middle of the blocking panel to be vertically apart therefrom.

13. The semiconductor device manufacturing apparatus of claim 10, wherein the temperature measuring unit is located to be apart from the blocking panel and the chamber wall and on the same concentric circle as the chamber wall from a central axis of the chamber.

14. A chamber for manufacturing a semiconductor device, the chamber comprising: a chamber wall forming an enclosed area;a gas inlet port disposed on a first surface of the chamber wall to introduce gases;a gas dispersing unit located adjacent to the gas inlet port to disperse gases introduced through the gas inlet port;a wafer loading unit for loading a wafer;a heating unit for heating inside the chamber;a temperature measuring unit located to be apart from the chamber wall between the chamber wall and the wafer loading unit to measure a temperature inside the chamber; anda gas outlet port disposed on a second surface of the chamber wall to discharge gases.

15. The chamber of claim 14, where n: the gas inlet port and the gas outlet port are located opposing each other, andthe temperature measuring unit is located closer to the gas outlet port than to the gas inlet port.

16. The chamber of claim 14, wherein the heating unit is a halogen lamp located to be exposed at the chamber wall.

17. The chamber of claim 14, further comprising a blocking panel disposed at the periphery of the gas outlet port to be depressed from the chamber wall to guide a gas flow.

18. The chamber of claim 14, further comprising a cooling system for cooling the chamber wall.

19. The chamber of claim 14, wherein the temperature measuring unit includes electrodes formed of a nickel-chromium alloy, and at least three temperature-measuring points for measuring a temperature through contact points between a positive (+) electrode and a negative (−) electrode.

20. The chamber of claim 14, wherein the temperature measuring unit is located closer to a central axis of the chamber than the camber wall.