the coating being directly applied to the semiconductor body

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/3171the coating being directly applied to the semiconductor body

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Patents Grantslast 30 patents

Information Patent Grant
Nanosheet transistor
- Patent number 12,369,379
- Issue date Jul 22, 2025
- Adeia Semiconductor Solutions LLC
- Kangguo Cheng
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor device and method
- Patent number 12,368,120
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices related to radio frequency devices
- Patent number 12,362,191
- Issue date Jul 15, 2025
- Infineon Technologies Dresden GmbH & Co. KG
- Hans Taddiken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 12,362,274
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor die package
- Patent number 12,364,038
- Issue date Jul 15, 2025
- STMicroelectronics Ltd.
- David Gani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer features
- Patent number 12,354,959
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Chun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked devices and methods of fabrication
- Patent number 12,347,820
- Issue date Jul 1, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nitride semiconductor module
- Patent number 12,348,220
- Issue date Jul 1, 2025
- Rohm Co., Ltd.
- Hirotaka Otake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
X-ray detector and method for forming the same
- Patent number 12,349,477
- Issue date Jul 1, 2025
- BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD.
- Fanli Meng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package cavities with polymer films
- Patent number 12,347,738
- Issue date Jul 1, 2025
- Texas Instruments Incorporated
- Sreenivasan Kalyani Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-electron mobility transistor and fabrication method thereof
- Patent number 12,342,561
- Issue date Jun 24, 2025
- United Microelectronics Corp.
- Chih-Tung Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming method of semiconductor structure and semiconductor structure
- Patent number 12,341,073
- Issue date Jun 24, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Huiwen Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including an encapsulant
- Patent number 12,341,118
- Issue date Jun 24, 2025
- Samsung Electronics Co., Ltd.
- Seungwan Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,334,409
- Issue date Jun 17, 2025
- Fuji Electric Co., Ltd.
- Yasufumi Hara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 12,334,434
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High electron mobility transistor and method for fabricating the same
- Patent number 12,336,245
- Issue date Jun 17, 2025
- United Microelectronics Corp.
- Yen-Tsai Yi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with protective film for reducing aluminum sli...
- Patent number 12,334,410
- Issue date Jun 17, 2025
- Renesas Electronics Corporation
- Takashi Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an integrated circuit package having a padding la...
- Patent number 12,322,726
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Hsien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge encapsulation for high voltage devices
- Patent number 12,315,770
- Issue date May 27, 2025
- MACOM Technology Solutions Holdings, Inc.
- Timothy Boles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing semiconductor device with composite passivatio...
- Patent number 12,315,796
- Issue date May 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with improved interposer structure
- Patent number 12,308,313
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die, manufacturing method thereof, and semiconductor...
- Patent number 12,308,298
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Moat coverage with dielectric film for device passivation and singu...
- Patent number 12,300,548
- Issue date May 13, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Mark Anand Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package including stress buffering layer
- Patent number 12,300,677
- Issue date May 13, 2025
- Advanced Semiconductor Engineering, Inc.
- Chien-Mei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor device structure with angled wire bonds
- Patent number 12,300,564
- Issue date May 13, 2025
- Wolfspeed, Inc.
- Kyoung-Keun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diode and manufacturing method therefor
- Patent number 12,295,167
- Issue date May 6, 2025
- ENKRIS SEMICONDUCTOR, INC.
- Kai Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,293,925
- Issue date May 6, 2025
- Renesas Electronics Corporation
- Yuki Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED chip and manufacturing method of the same
- Patent number 12,288,775
- Issue date Apr 29, 2025
- SEOUL VIOSYS CO., LTD.
- Jong Min Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,289,901
- Issue date Apr 29, 2025
- INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
- Yi-Lun Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic integrated package and method forming same
- Patent number 12,283,492
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
IMPROVED HEMT DEVICE, IN PARTICULAR DEPLETION MODE DEVICE, AND MANU...
- Publication number 20250240997
- Publication date Jul 24, 2025
- STMicroelectronics International N.V.
- Cristina MICCOLI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250239463
- Publication date Jul 24, 2025
- UNITED MICROELECTRONICS CORP.
- Chien-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL WIRING OF A SEMICONDUCTOR COMPONENT
- Publication number 20250239489
- Publication date Jul 24, 2025
- Siemens Healthineers AG
- Michael HOSEMANN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250239571
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Jaejun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR BODY HAVING A TYPE III-NI...
- Publication number 20250240993
- Publication date Jul 24, 2025
- INFINEON TECHNOLOGIES AG
- Albert Birner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250234615
- Publication date Jul 17, 2025
- STMicroelectronics International N.V.
- Daniele CAPELLI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250218995
- Publication date Jul 3, 2025
- UNITED MICROELECTRONICS CORP.
- Chen-Hsiao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250218996
- Publication date Jul 3, 2025
- UNITED MICROELECTRONICS CORP.
- Chen-Hsiao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250218997
- Publication date Jul 3, 2025
- UNITED MICROELECTRONICS CORP.
- Chen-Hsiao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250218994
- Publication date Jul 3, 2025
- UNITED MICROELECTRONICS CORP.
- Chen-Hsiao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC INTEGRATED PACKAGE AND METHOD FORMING SAME
- Publication number 20250218799
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MOUNTING SUBSTRATE
- Publication number 20250210436
- Publication date Jun 26, 2025
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Mitsuaki SAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING PACKAGE ON PACKAGE STRUCTURE AND METHOD...
- Publication number 20250201784
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Jeonghyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20250201640
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NITRIDE-BASED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE...
- Publication number 20250194208
- Publication date Jun 12, 2025
- INNOSCIENCE (SUZHOU) SEMICONDUCTOR CO., LTD.
- Xiao ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250192109
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250194214
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Junhyuk PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER WITH RECESSED PORTIONS AT A SCRIBE AREA
- Publication number 20250192066
- Publication date Jun 12, 2025
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250183109
- Publication date Jun 5, 2025
- Siliconware Precision Industries Co., Ltd.
- Chien-Wei HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250183212
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- CHEOL KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT DIE WITH CHAMFERED PASSIVATION LAYER
- Publication number 20250183108
- Publication date Jun 5, 2025
- NXP USA, Inc.
- Darrell Glenn Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION SCHEME DESIGN FOR WAFER SINGULATION
- Publication number 20250183192
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA INDUCED DAMAGE DETECTION OF A MEMORY DIE
- Publication number 20250180640
- Publication date Jun 5, 2025
- Micron Technology, Inc.
- Aryo Santosa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TYPE III-V SEMICONDUCTOR DEVICE WITH STRUCTURED PASSIVATION
- Publication number 20250176206
- Publication date May 29, 2025
- Infineon Technologies Austria AG
- Simone Lavanga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250174585
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Hyeonjae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES AND METHODS OF...
- Publication number 20250174604
- Publication date May 29, 2025
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING CRACK-RESISTANT BACKSIDE...
- Publication number 20250169070
- Publication date May 22, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Kota FUNAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250157961
- Publication date May 15, 2025
- DENSO CORPORATION
- Shiro MIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20250157868
- Publication date May 15, 2025
- United Microelectronics Corp.
- Chen-Hsiao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ELECTRON MOBILITY TRANSISTOR DEVICE
- Publication number 20250151360
- Publication date May 8, 2025
- XIAMEN SAN'AN INTEGRATED CIRCUIT CO., LTD.
- Wenjie SONG
- H01 - BASIC ELECTRIC ELEMENTS

the coating being directly applied to the semiconductor body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Nanosheet transistor

Semiconductor device and method

Methods and devices related to radio frequency devices

Package structure and method of forming the same

Sensor die package

Redistribution layer features

Stacked devices and methods of fabrication

Nitride semiconductor module

X-ray detector and method for forming the same

Sensor package cavities with polymer films

High-electron mobility transistor and fabrication method thereof

Forming method of semiconductor structure and semiconductor structure

Semiconductor package including an encapsulant

Semiconductor module

Package structure and method of forming the same

High electron mobility transistor and method for fabricating the same

Semiconductor device with protective film for reducing aluminum sli...

Method of forming an integrated circuit package having a padding la...

Edge encapsulation for high voltage devices

Method for preparing semiconductor device with composite passivatio...

Semiconductor package with improved interposer structure

Semiconductor die, manufacturing method thereof, and semiconductor...

Moat coverage with dielectric film for device passivation and singu...

Semiconductor device package including stress buffering layer

Transistor device structure with angled wire bonds

Diode and manufacturing method therefor

Semiconductor device and method of manufacturing the same

LED chip and manufacturing method of the same

Semiconductor device and method for manufacturing the same

Photonic integrated package and method forming same

Patents Applicationslast 30 patents

IMPROVED HEMT DEVICE, IN PARTICULAR DEPLETION MODE DEVICE, AND MANU...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

VERTICAL WIRING OF A SEMICONDUCTOR COMPONENT

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR BODY HAVING A TYPE III-NI...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME

COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME

COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME

COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME

PHOTONIC INTEGRATED PACKAGE AND METHOD FORMING SAME

SEMICONDUCTOR DEVICE AND MOUNTING SUBSTRATE

SEMICONDUCTOR DEVICE HAVING PACKAGE ON PACKAGE STRUCTURE AND METHOD...

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

NITRIDE-BASED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR WAFER WITH RECESSED PORTIONS AT A SCRIBE AREA

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

CIRCUIT DIE WITH CHAMFERED PASSIVATION LAYER

PASSIVATION SCHEME DESIGN FOR WAFER SINGULATION

PLASMA INDUCED DAMAGE DETECTION OF A MEMORY DIE

TYPE III-V SEMICONDUCTOR DEVICE WITH STRUCTURED PASSIVATION

SEMICONDUCTOR DIE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES AND METHODS OF...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING CRACK-RESISTANT BACKSIDE...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE

HIGH ELECTRON MOBILITY TRANSISTOR DEVICE