the coating being directly applied to the semiconductor body

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/3171the coating being directly applied to the semiconductor body

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Patents Grantslast 30 patents

Information Patent Grant
LED chip and manufacturing method of the same
- Patent number 12,288,775
- Issue date Apr 29, 2025
- SEOUL VIOSYS CO., LTD.
- Jong Min Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,289,901
- Issue date Apr 29, 2025
- INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
- Yi-Lun Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic integrated package and method forming same
- Patent number 12,283,492
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective laser annealing method
- Patent number 12,278,275
- Issue date Apr 15, 2025
- Infineon Technologies AG
- Albert Birner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-bump sidewall protection
- Patent number 12,272,663
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an optical unit that comprises an array of...
- Patent number 12,266,670
- Issue date Apr 1, 2025
- Tower Semiconductor Ltd.
- Naor Inbar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 12,261,088
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,261,105
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Myungsam Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having package on package structure and method...
- Patent number 12,261,157
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Jeonghyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation scheme design for wafer singulation
- Patent number 12,249,580
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protection structures for bonded wafers
- Patent number 12,243,772
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ssu-Chiang Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma treatment on metal-oxide TFT
- Patent number 12,237,406
- Issue date Feb 25, 2025
- Applied Materials, Inc.
- Soo Young Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with improved interposer structure
- Patent number 12,237,262
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Type III-V semiconductor device with structured passivation
- Patent number 12,230,700
- Issue date Feb 18, 2025
- Infineon Technologies Austria AG
- Simone Lavanga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a thermally and electrically conductiv...
- Patent number 12,224,222
- Issue date Feb 11, 2025
- Infineon Technologies AG
- Christian Neugirg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 12,218,207
- Issue date Feb 4, 2025
- INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
- Qiyue Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation structure with planar top surfaces
- Patent number 12,218,022
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional stacking semiconductor assemblies and methods of...
- Patent number 12,218,101
- Issue date Feb 4, 2025
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer and semiconductor package including the same
- Patent number 12,218,099
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Jungsoo Byun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor packages
- Patent number 12,205,860
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Hsien Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric sidewall protection and sealing for semiconductor device...
- Patent number 12,198,998
- Issue date Jan 14, 2025
- NXP B.V.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High electron mobility transistor and method of manufacturing the same
- Patent number 12,199,174
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Junhyuk Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for forminginsulating structure of high electr...
- Patent number 12,199,175
- Issue date Jan 14, 2025
- United Microelectronics Corp.
- Chun-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for producing the same
- Patent number 12,199,066
- Issue date Jan 14, 2025
- Kioxia Corporation
- Gen Toyota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,191,238
- Issue date Jan 7, 2025
- Samsung Electronics Co., Ltd.
- Aenee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective passivation and selective deposition
- Patent number 12,170,197
- Issue date Dec 17, 2024
- ASM IP Holding B.V.
- Eva E. Tois
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor devices and methods of forming same
- Patent number 12,170,207
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating redistribution circuit structure
- Patent number 12,170,223
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nitride-based multi-channel switching semiconductor device and meth...
- Patent number 12,159,871
- Issue date Dec 3, 2024
- INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
- Hui Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
GaN/two-dimensional AlN heterojunction rectifier on silicon substra...
- Patent number 12,154,990
- Issue date Nov 26, 2024
- South China University of Technology
- Wenliang Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH MULTI-STEP GATE AND RECESSED MULTI-STEP F...
- Publication number 20250142924
- Publication date May 1, 2025
- NXP USA, Inc.
- Bernhard Grote
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUP III-NITRIDE HIGH-ELECTRON MOBILITY TRANSISTORS CONFIGURED WIT...
- Publication number 20250142918
- Publication date May 1, 2025
- Wolfspeed, Inc.
- Saptha Sriram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250140755
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- Jungsoo BYUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION STRUCTURE WITH PLANAR TOP SURFACES
- Publication number 20250140627
- Publication date May 1, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250140629
- Publication date May 1, 2025
- Fuji Electric Co., Ltd.
- Shingo HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250132215
- Publication date Apr 24, 2025
- XIAMEN SAN'AN INTEGRATED CIRCUIT CO., LTD.
- Jiebin ZHONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL GATE HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD OF MANUFACTU...
- Publication number 20250126825
- Publication date Apr 17, 2025
- National Yang Ming Chiao Tung University
- Heng-Tung HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DEVICE
- Publication number 20250120105
- Publication date Apr 10, 2025
- XIAMEN SAN'AN INTEGRATED CIRCUIT CO., LTD.
- Yonghong TAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250118685
- Publication date Apr 10, 2025
- RENESAS ELECTRONICS CORPORATION
- Takashi MORIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEMT TRANSISTOR
- Publication number 20250118613
- Publication date Apr 10, 2025
- STMicroelectronics International N.V.
- Paolo COLPANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250105082
- Publication date Mar 27, 2025
- JCET Management Co., Ltd.
- Xiao GU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250098201
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Junhyuk PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A SILICON CARBIDE PORTION AND A GLASS STR...
- Publication number 20250096149
- Publication date Mar 20, 2025
- INFINEON TECHNOLOGIES AG
- Rudolf Elpelt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES WITH LOW-PROFILE POLYIMIDE LAYERS
- Publication number 20250096156
- Publication date Mar 20, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Katleen Fajardo TIMBOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING SILICON SUBSTRATE WITH POROUS PORTION
- Publication number 20250096090
- Publication date Mar 20, 2025
- QUALCOMM Incorporated
- Ranadeep DUTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250096088
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Aenee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURRENT COLLAPSE REDUCTION USING ALUMINUM NITRIDE BACK BARRIER AND...
- Publication number 20250089290
- Publication date Mar 13, 2025
- Soctera, Inc.
- Austin Hickman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
- Publication number 20250089351
- Publication date Mar 13, 2025
- Fuji Electric Co., Ltd.
- Soichi YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250079360
- Publication date Mar 6, 2025
- MEDIATEK INC.
- Cheng Lin HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR IMPROVING SHORT-CIRCUIT CAPABILITY OF ENHANCEMENT-MODE G...
- Publication number 20250081574
- Publication date Mar 6, 2025
- Peking University
- Jin WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250079249
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Yeongbeom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL FABRICATION OF ELECTROSTATIC DISCHARGE DEVICES
- Publication number 20250079401
- Publication date Mar 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Rongwei ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING A SEMICONDUCTOR CO...
- Publication number 20250081575
- Publication date Mar 6, 2025
- ROBERT BOSCH GmbH
- Kevin Dannecker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Fabricating Redistribution Circuit Structure
- Publication number 20250069951
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE PASSIVATION AND SELECTIVE DEPOSITION
- Publication number 20250069885
- Publication date Feb 27, 2025
- ASM IP HOLDING B.V.
- Eva E. Tois
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE AND METHOD OF PRODUCING A SUBSTRATE
- Publication number 20250062175
- Publication date Feb 20, 2025
- INFINEON TECHNOLOGIES AG
- Charles Rimbert-Riviere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JET ABLATION DIE SINGULATION SYSTEMS AND RELATED METHODS
- Publication number 20250062162
- Publication date Feb 20, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NITRIDE-BASED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE...
- Publication number 20250048668
- Publication date Feb 6, 2025
- INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
- Liuchang MENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR IMPROVING PASSIVATION LAYER DURABILITY
- Publication number 20250046665
- Publication date Feb 6, 2025
- STMicroelectronics International N.V.
- Gabriele BELLOCCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE POWER DEVICE WITH IMPROVED ROBUSTNESS AND CORRESPON...
- Publication number 20250038060
- Publication date Jan 30, 2025
- STMicroelectronics S.r.l.
- Simone RASCUNA'
- H01 - BASIC ELECTRIC ELEMENTS

the coating being directly applied to the semiconductor body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

LED chip and manufacturing method of the same

Semiconductor device and method for manufacturing the same

Photonic integrated package and method forming same

Selective laser annealing method

Metal-bump sidewall protection

Method for manufacturing an optical unit that comprises an array of...

Package structure and method of forming the same

Semiconductor package

Semiconductor device having package on package structure and method...

Passivation scheme design for wafer singulation

Protection structures for bonded wafers

Plasma treatment on metal-oxide TFT

Semiconductor package with improved interposer structure

Type III-V semiconductor device with structured passivation

Semiconductor package having a thermally and electrically conductiv...

Method for manufacturing semiconductor device

Passivation structure with planar top surfaces

Three-dimensional stacking semiconductor assemblies and methods of...

Interposer and semiconductor package including the same

Sensor packages

Dielectric sidewall protection and sealing for semiconductor device...

High electron mobility transistor and method of manufacturing the same

Manufacturing method for forminginsulating structure of high electr...

Semiconductor device and method for producing the same

Semiconductor package

Selective passivation and selective deposition

Stacked semiconductor devices and methods of forming same

Method of fabricating redistribution circuit structure

Nitride-based multi-channel switching semiconductor device and meth...

GaN/two-dimensional AlN heterojunction rectifier on silicon substra...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH MULTI-STEP GATE AND RECESSED MULTI-STEP F...

GROUP III-NITRIDE HIGH-ELECTRON MOBILITY TRANSISTORS CONFIGURED WIT...

INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

PASSIVATION STRUCTURE WITH PLANAR TOP SURFACES

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

DUAL GATE HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD OF MANUFACTU...

POWER DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

HEMT TRANSISTOR

PACKAGING STRUCTURE AND METHOD FOR FORMING THE SAME

HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE WITH A SILICON CARBIDE PORTION AND A GLASS STR...

PACKAGES WITH LOW-PROFILE POLYIMIDE LAYERS

INTEGRATED DEVICE COMPRISING SILICON SUBSTRATE WITH POROUS PORTION

SEMICONDUCTOR PACKAGE

CURRENT COLLAPSE REDUCTION USING ALUMINUM NITRIDE BACK BARRIER AND...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

METHOD FOR IMPROVING SHORT-CIRCUIT CAPABILITY OF ENHANCEMENT-MODE G...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

WAFER-LEVEL FABRICATION OF ELECTROSTATIC DISCHARGE DEVICES

SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING A SEMICONDUCTOR CO...

Method of Fabricating Redistribution Circuit Structure

SELECTIVE PASSIVATION AND SELECTIVE DEPOSITION

SUBSTRATE AND METHOD OF PRODUCING A SUBSTRATE

JET ABLATION DIE SINGULATION SYSTEMS AND RELATED METHODS

NITRIDE-BASED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE...

METHODS FOR IMPROVING PASSIVATION LAYER DURABILITY

SILICON CARBIDE POWER DEVICE WITH IMPROVED ROBUSTNESS AND CORRESPON...