Patent Application
20170025330
Field
The subject matter herein generally relates to a semiconductor device.
Background
A semiconductor device for adjusting an output voltage, such as buck integrated circuit (IC) or boost IC, includes a center semiconductor chip, a plurality of lead fingers, and a lead frame. The center semiconductor chip includes a plurality of die pads. The lead frame is used for establishing an electrical connection between the die pads and the lead fingers. The lead fingers connected with an external indicator outputs an adjusted voltage. Some of the lead fingers are electrically connected with each other via external electrical components, such as an external indicator, external capacitors, and external resistances.
Implementations of the present technology will now be described, by way of example only, with reference to the attached figures.
It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different figures to indicate corresponding or analogous elements. In addition, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein. However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details. In other instances, methods, procedures, and components have not been described in detail so as not to obscure the related relevant feature being described. The drawings are not necessarily to scale and the proportions of certain parts may be exaggerated to better illustrate details and features. The description is not to be considered as limiting the scope of the embodiments described herein.
The term “substantially” is defined to be essentially conforming to the particular dimension, shape or other word that substantially modifies, such that the component need not be exact. For example, substantially cylindrical means that the object resembles a cylinder, but can have one or more deviations from a true cylinder. The term “comprising” means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in a so-described combination, group, series and the like.
The semiconductor chip 10 is substantially a rectangular shaped. The center semiconductor chip 10 includes a plurality of die pads 12 mounted on a surface of the center semiconductor chip 10. The semiconductor chip 10 is capable of forming an inside coiled indicator with a series of concentric squares (as shown in
The lead frame 20 separated from each other encapsulates the center semiconductor chip 10. Some of the lead frame 20 is bent to form a lead finger 40.
The connecting component 50 connects between the die pad 12 and the lead frame 20, or connect between two die pad 12. In at least one embodiment, the connecting component 50 is a bonding wire. In other embodiments, the connecting component 50 can be a cooper pillar bump.
Based on the structure of the semiconductor device 100, any of the center semiconductor chip 10, the lead finger 40, or the connecting component 50 can form an internal indicator. Therefore, the semiconductor device 100 directly outputs a voltage without external electrical components, and an availability of the lead fingers 40 is improved.
Based on the structure of the semiconductor device 100, any of the center semiconductor chip 10, the lead finger 70, or the connecting component 50 can form an internal indicator. Therefore, the semiconductor device 100 directly outputs a voltage without external electrical components, and an availability of the lead fingers 40 is improved
Based on the structure of the semiconductor device 100, any of the center semiconductor chip 10, the lead finger 80, or the connecting component 50 can form an internal indicator. Therefore, the semiconductor device 100 directly outputs a voltage without external electrical components, and an availability of the lead fingers 40 is improved
Based on the structure of the semiconductor device 100, any of the center semiconductor chip, the lead finger, or the connecting component can form an internal indicator. Therefore, the semiconductor device 100 directly outputs a voltage without external electrical components, and an availability of the lead fingers is improved.
While various exemplary and preferred embodiments have been described, the disclosure is not limited thereto. On the contrary, various modifications and similar arrangements (as would be apparent to those skilled in the art) are intended to also be covered. Therefore, the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements.
