Geometry of the lead-frame

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H01L23/49541

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/49541Geometry of the lead-frame

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Patents Grantslast 30 patents

Information Patent Grant
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- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
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Information Patent Grant
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- Alexander Heinrich
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Information Patent Grant
Lead frame and manufacturing method thereof
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Packaged stackable electronic power device for surface mounting and...
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Semiconductor package having side wall plating
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- SILICONIX INCORPORATED
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Integrated mult-device chip and package
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- Tsung-Wen Mou
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Information Patent Grant
Laser-cut lead-frame for integrated circuit (IC) packages
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Pre-molded leadframes in semiconductor devices
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Information Patent Grant
Leadframes in semiconductor devices
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Floating die package
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Semiconductor package with wettable flank
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Semiconductor device
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Information Patent Grant
Lead frame for improving adhesive fillets on semiconductor die corners
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Information Patent Grant
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Information Patent Grant
Semiconductor package having mold locking feature
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Patents Applicationslast 30 patents

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- Publication number 20250149412
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SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250149410
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- Publication number 20250149425
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HYBRID QUAD FLAT PACKAGE ELECTRONIC DEVICE
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QFN PACKAGED SEMICONDUCTOR DEVICE AND METHOD
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SEMICONDUCTOR PACKAGE WITH WETTABLE FLANK
- Publication number 20250118635
- Publication date Apr 10, 2025
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PACKAGE CARRIER WITH LARGE BACK SIDE AREA
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FLAT SEMICONDUCTOR PACKAGE WITH COPLANAR LEADS
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- Chung-Hsiung Ho
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LEAD FRAME FOR A PACKAGE FOR A SEMICONDUCTOR DEVICE, SEMICONDUCTOR...
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SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
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- Masahiko KOBAYAKAWA
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PACKAGE AND SEMICONDUCTOR DEVICE
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- Tae Kyung HWANG
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LEAD FRAME AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
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Geometry of the lead-frame

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Concealed gate terminal semiconductor packages and related methods

Method of forming a packaged semiconductor device having enhanced w...

Thin semiconductor packaging unit having a plurality of bridging la...

Semiconductor device and method for manufacturing the same

Electronic device packaging with galvanic isolation

Semiconductor device having lead connecting a semiconductor chip to...

Semiconductor device package with isolated semiconductor die and el...

Semiconductor package having a metal clip and related methods of ma...

Method for manufacturing leadless semiconductor package with wettab...

Semiconductor device and method for manufacturing the same

Electronic device with multi-layer contact and system

Lead frame and manufacturing method thereof

Semiconductor package with wettable flank and related methods

Semiconductor device and method of forming micro interconnect struc...

Packaged stackable electronic power device for surface mounting and...

Semiconductor package having side wall plating

Integrated mult-device chip and package

Laser-cut lead-frame for integrated circuit (IC) packages

Semiconductor device

Method of manufacturing semiconductor devices and corresponding sem...

Semiconductor light-emitting device

Pre-molded leadframes in semiconductor devices

Leadframes in semiconductor devices

Floating die package

Semiconductor package with wettable flank

Semiconductor device

Lead frame for improving adhesive fillets on semiconductor die corners

Semiconductor light emitting device and method for manufacturing th...

Microelectronic devices designed with mold patterning to create pac...

Semiconductor package having mold locking feature

Patents Applicationslast 30 patents

BATTERY PROTECTION PACKAGE HAVING CO-PACKED TRANSISTORS AND INTEGRA...

SEMICONDUCTOR DEVICE FABRICATION METHOD AND LEAD FRAME WITH SIDE PO...

LEADFRAME PACKAGE WITH INCREASED ROUTING CAPABILITY

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

LEADLESS SEMICONDUCTOR PACKAGES, LEADFRAMES THEREFOR, AND METHODS O...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

HYBRID QUAD FLAT PACKAGE ELECTRONIC DEVICE

QFN PACKAGED SEMICONDUCTOR DEVICE AND METHOD

CHIP ON FILM, MANUFACTURING METHOD THEREOF, AND DISPLAY APPARATUS

SEMICONDUCTOR PACKAGE WITH WETTABLE FLANK

PACKAGE CARRIER WITH LARGE BACK SIDE AREA

FLAT SEMICONDUCTOR PACKAGE WITH COPLANAR LEADS

SEMICONDUCTOR DEVICE WITH IMPROVED HEAT DISSIPATION

QUAD FLAT NO-LEAD PACKAGE WITH ENHANCED CORNER PADS FOR BOARD LEVEL...

POWER MODULE

LEAD FRAME FOR A PACKAGE FOR A SEMICONDUCTOR DEVICE, SEMICONDUCTOR...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

POWER MODULE FOR VEHICLE AND MOTOR DRIVING APPARATUS INCLUDING THE...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE FABRICATION METHOD

SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING TH...

PACKAGE AND SEMICONDUCTOR DEVICE

WIREBOND ELECTROPLATING STRUCTURE FOR FULL CUT WETTABLE FLANK STRUC...

ELECTRONIC PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE

LEAD FRAME AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGES WITH WETTABLE FLANKS AND RELATED METHODS

HEAT SLUG ATTACHED TO A DIE PAD FOR SEMICONDUCTOR PACKAGE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING PRE-MO...