Geometry of the lead-frame

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H01L23/49541

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49541Geometry of the lead-frame

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Lead frame for improving adhesive fillets on semiconductor die corners
- Patent number 12,170,240
- Issue date Dec 17, 2024
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor light emitting device and method for manufacturing th...
- Patent number 12,166,162
- Issue date Dec 10, 2024
- Rohm Co., Ltd.
- Masahiko Kobayakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices designed with mold patterning to create pac...
- Patent number 12,155,133
- Issue date Nov 26, 2024
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for a package for a semiconductor device, semiconductor...
- Patent number 12,142,552
- Issue date Nov 12, 2024
- STMicroelectronics S.r.l.
- Fulvio Vittorio Fontana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having mold locking feature
- Patent number 12,142,548
- Issue date Nov 12, 2024
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die assembly
- Patent number 12,137,618
- Issue date Nov 5, 2024
- Melexis Technologies SA
- Arnaud Laville
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat slug attached to a die pad for semiconductor package
- Patent number 12,136,588
- Issue date Nov 5, 2024
- Texas Instruments Incorporated
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,131,983
- Issue date Oct 29, 2024
- Rohm Co., Ltd.
- Katsutoki Shirai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package structure with reduced vertical stress regions
- Patent number 12,131,982
- Issue date Oct 29, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Tae Kyung Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module for vehicle and motor driving apparatus including the...
- Patent number 12,122,244
- Issue date Oct 22, 2024
- Myung Ill You
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Lead frame assembly, method for producing a plurality of components...
- Patent number 12,125,773
- Issue date Oct 22, 2024
- Osram Opto Semiconductors GmbH
- Matthias Hien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate via structure and method of manufacture
- Patent number 12,119,294
- Issue date Oct 15, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Press-fit power module and related methods
- Patent number 12,119,576
- Issue date Oct 15, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jie Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with roughened conductive components
- Patent number 12,119,289
- Issue date Oct 15, 2024
- Texas Instruments Incorporated
- Yee Gin Tea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices, and package molds for forming packa...
- Patent number 12,119,239
- Issue date Oct 15, 2024
- Wolfspeed, Inc.
- Soon Lee Liew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with electrically insulated carrier and at least one step o...
- Patent number 12,094,793
- Issue date Sep 17, 2024
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
QFN device having a mechanism that enables an inspectable solder jo...
- Patent number 12,087,673
- Issue date Sep 10, 2024
- Texas Instruments Incorporated
- Abram Castro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spring bar leadframe, method and packaged electronic device with ze...
- Patent number 12,087,674
- Issue date Sep 10, 2024
- Texas Instruments Incorporated
- Lee Han Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and mounting structure thereof
- Patent number 12,087,675
- Issue date Sep 10, 2024
- Rohm Co., Ltd.
- Ippei Yasutake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having a plurality of offsets in leads suppor...
- Patent number 12,087,676
- Issue date Sep 10, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Jae Min Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Custom leadframe from standard plus printed leadframe portion
- Patent number 12,080,633
- Issue date Sep 3, 2024
- Texas Instruments Incorporated
- Jo Bito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Suspended semiconductor dies
- Patent number 12,074,095
- Issue date Aug 27, 2024
- Texas Instruments Incorporated
- Barry Jon Male
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including source pad region and drain pad regi...
- Patent number 12,062,716
- Issue date Aug 13, 2024
- ANCORA SEMICONDUCTORS INC.
- Li-Fan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit lead frame and semiconductor device thereof
- Patent number 12,062,598
- Issue date Aug 13, 2024
- Realtek Semiconductor Corp.
- Yu-Hsin Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and semiconductor device
- Patent number 12,062,600
- Issue date Aug 13, 2024
- Shinko Electric Industries Co., Ltd.
- Shintaro Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 12,057,378
- Issue date Aug 6, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Gi Jeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip packaged semiconductor device
- Patent number 12,057,377
- Issue date Aug 6, 2024
- MagnaChip Semiconductor, Ltd.
- Hyun Dong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging of a semiconductor device with a plurality of leads
- Patent number 12,046,541
- Issue date Jul 23, 2024
- Rohm Co., Ltd.
- Katsuhiro Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and fabrication method of the same, graphite plate, an...
- Patent number 12,046,532
- Issue date Jul 23, 2024
- Rohm Co., Ltd.
- Maiko Hatano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with die mounted to an insulating substrate an...
- Patent number 12,040,263
- Issue date Jul 16, 2024
- STMicroelectronics S.r.l.
- Roberto Tiziani
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND ULTRASOUND SYSTEM HAVING SAME
- Publication number 20240413057
- Publication date Dec 12, 2024
- INFINEON TECHNOLOGIES AG
- Horst THEUSS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CUSTOM LEADFRAME FROM STANDARD PLUS PRINTED LEADFRAME PORTION
- Publication number 20240413058
- Publication date Dec 12, 2024
- TEXAS INSTRUMENTS INCORPORATED
- JO BITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND MANUFACTURING METHOD THEREOF
- Publication number 20240404928
- Publication date Dec 5, 2024
- DAI NIPPON PRINTING CO., LTD.
- Masahiro NAGATA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP O...
- Publication number 20240395646
- Publication date Nov 28, 2024
- INFINEON TECHNOLOGIES AG
- Edward FUERGUT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MOUNTING STRUCTURE THEREOF
- Publication number 20240395675
- Publication date Nov 28, 2024
- Rohm Co., Ltd.
- Ippei YASUTAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240387333
- Publication date Nov 21, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Gi Jeong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240379383
- Publication date Nov 14, 2024
- TOWA CORPORATION
- Yudai TAKAMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240379507
- Publication date Nov 14, 2024
- ROHM CO., LTD.
- Akinori NII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND LEAD FRAME
- Publication number 20240371658
- Publication date Nov 7, 2024
- TOWA CORPORATION
- Syuho HANASAKA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD FRAME
- Publication number 20240371733
- Publication date Nov 7, 2024
- Ohkuchi Materials Co., Ltd.
- Keiichi Otaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURING SEMI...
- Publication number 20240371738
- Publication date Nov 7, 2024
- STMicroelectronics S.r.l
- Roberto TIZIANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH VOLTAGE INTEGRATED CIRCUIT PACKAGES WITH DIAGONALIZED LEAD CON...
- Publication number 20240363498
- Publication date Oct 31, 2024
- ALLEGRO MICROSYSTEMS, LLC
- Maurizio Salato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH POST MOLD PLATED NICKEL TUNGSTEN AND TIN BIL...
- Publication number 20240363504
- Publication date Oct 31, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIDE-WETTABLE SEMICONDUCTOR PACKAGE DEVICE WITH HEAT DISSIPATION SU...
- Publication number 20240355716
- Publication date Oct 24, 2024
- PANJIT INTERNATIONAL INC.
- CHUNG-HSIUNG HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH MULTIPLE INTERCONNECTS
- Publication number 20240347425
- Publication date Oct 17, 2024
- TEXAS INSTRUMENTS INCORPORATED
- HUAY YANN TAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240347426
- Publication date Oct 17, 2024
- ROHM CO., LTD.
- Katsuhiro IWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240339385
- Publication date Oct 10, 2024
- NEPES LAWEH CORPORATION
- Byungcheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED PACKAGE WITH AN INTERCHANGEABLE LEADFRAME
- Publication number 20240339382
- Publication date Oct 10, 2024
- TEXAS INSTRUMENTS INCORPORATED
- YOU CHYE HOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BARCODE READABILITY ENHANCEMENT STRUCTURES AND METHOD
- Publication number 20240339416
- Publication date Oct 10, 2024
- INFINEON TECHNOLOGIES AG
- Charles Rimbert-Riviere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND FABRICATION METHOD OF THE SAME, GRAPHITE PLATE, AN...
- Publication number 20240332122
- Publication date Oct 3, 2024
- ROHM CO., LTD.
- Maiko HATANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240332137
- Publication date Oct 3, 2024
- ROHM CO., LTD.
- Ryohei UMENO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240332138
- Publication date Oct 3, 2024
- ROHM CO., LTD.
- Ryohei UMENO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL FRAME CHIP EMBEDDED PACKAGING SUBSTRATE AND MANUFACTURING MET...
- Publication number 20240312879
- Publication date Sep 19, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- XIANMING CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240304526
- Publication date Sep 12, 2024
- RENESAS ELECTRONICS CORPORATION
- Masato NUMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING METHOD
- Publication number 20240297101
- Publication date Sep 5, 2024
- RICHTEK TECHNOLOGY CORPORATION
- Yu-Lin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME
- Publication number 20240297103
- Publication date Sep 5, 2024
- ADVANCED ASSEMBLY MATERIALS ANHUI LIMITED
- Ching Leung Lawrence KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SUBSTRATE VIA STRUCTURE AND METHOD OF MANUFACTURE
- Publication number 20240297106
- Publication date Sep 5, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME SHEET AND OPTOELECTRONIC SEMICONDUCTOR DEVICE
- Publication number 20240290696
- Publication date Aug 29, 2024
- ams-OSRAM International GmbH
- Choo Kean Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240282682
- Publication date Aug 22, 2024
- ROHM CO., LTD.
- Yuki NAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240282678
- Publication date Aug 22, 2024
- ROHM CO., LTD.
- Ryotaro KAKIZAKI
- H01 - BASIC ELECTRIC ELEMENTS

Geometry of the lead-frame

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Lead frame for improving adhesive fillets on semiconductor die corners

Semiconductor light emitting device and method for manufacturing th...

Microelectronic devices designed with mold patterning to create pac...

Lead frame for a package for a semiconductor device, semiconductor...

Semiconductor package having mold locking feature

Stacked die assembly

Heat slug attached to a die pad for semiconductor package

Semiconductor device

Electronic package structure with reduced vertical stress regions

Power module for vehicle and motor driving apparatus including the...

Lead frame assembly, method for producing a plurality of components...

Through-substrate via structure and method of manufacture

Press-fit power module and related methods

Semiconductor packages with roughened conductive components

Packaged semiconductor devices, and package molds for forming packa...

Package with electrically insulated carrier and at least one step o...

QFN device having a mechanism that enables an inspectable solder jo...

Spring bar leadframe, method and packaged electronic device with ze...

Semiconductor device and mounting structure thereof

Semiconductor devices having a plurality of offsets in leads suppor...

Custom leadframe from standard plus printed leadframe portion

Suspended semiconductor dies

Semiconductor device including source pad region and drain pad regi...

Integrated circuit lead frame and semiconductor device thereof

Lead frame and semiconductor device

Semiconductor devices and methods of manufacturing semiconductor de...

Multichip packaged semiconductor device

Packaging of a semiconductor device with a plurality of leads

Power module and fabrication method of the same, graphite plate, an...

Semiconductor device with die mounted to an insulating substrate an...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND ULTRASOUND SYSTEM HAVING SAME

CUSTOM LEADFRAME FROM STANDARD PLUS PRINTED LEADFRAME PORTION

LEAD FRAME AND MANUFACTURING METHOD THEREOF

PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP O...

SEMICONDUCTOR DEVICE AND MOUNTING STRUCTURE THEREOF

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND LEAD FRAME

LEAD FRAME

SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURING SEMI...

HIGH VOLTAGE INTEGRATED CIRCUIT PACKAGES WITH DIAGONALIZED LEAD CON...

ELECTRONIC DEVICE WITH POST MOLD PLATED NICKEL TUNGSTEN AND TIN BIL...

SIDE-WETTABLE SEMICONDUCTOR PACKAGE DEVICE WITH HEAT DISSIPATION SU...

INTEGRATED CIRCUIT PACKAGE WITH MULTIPLE INTERCONNECTS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

MOLDED PACKAGE WITH AN INTERCHANGEABLE LEADFRAME

SUBSTRATE BARCODE READABILITY ENHANCEMENT STRUCTURES AND METHOD

POWER MODULE AND FABRICATION METHOD OF THE SAME, GRAPHITE PLATE, AN...

ELECTRONIC DEVICE

ELECTRONIC DEVICE

METAL FRAME CHIP EMBEDDED PACKAGING SUBSTRATE AND MANUFACTURING MET...

SEMICONDUCTOR DEVICE

PACKAGING METHOD

LEADFRAME

THROUGH-SUBSTRATE VIA STRUCTURE AND METHOD OF MANUFACTURE

LEAD FRAME SHEET AND OPTOELECTRONIC SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE