Plurality of lead frames mounted in one device

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H01L23/49537

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49537Plurality of lead frames mounted in one device

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 12,354,934
- Issue date Jul 8, 2025
- Amkor Technology Singapore Holding Pte Ltd.
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Information Patent Grant
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Information Patent Grant
Packaged electronic device with film isolated power stack
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- Issue date Mar 4, 2025
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Information Patent Grant
Packaged stackable electronic power device for surface mounting and...
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Information Patent Grant
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- Issue date Feb 4, 2025
- Infineon Technologies Austria AG
- Edward Fuergut
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Information Patent Grant
Power semiconductor package having first and second lead frames
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- Issue date Jan 28, 2025
- Infineon Technologies AG
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Information Patent Grant
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Information Patent Grant
Electronic component package and manufacuring method thereof
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Information Patent Grant
Multi-channel gate driver package with grounded shield metal
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Information Patent Grant
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Information Patent Grant
Method of forming a semiconductor package with connection lug
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- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame assembly having a plurality of dicing holes
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- Issue date Oct 8, 2024
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- Chia-Neng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of transistors attached to a heat sink with a periphery n...
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Information Patent Grant
Package with electrically insulated carrier and at least one step o...
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Information Patent Grant
Package with different types of semiconductor dies attached to a fl...
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- Xikun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Custom leadframe from standard plus printed leadframe portion
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- Issue date Sep 3, 2024
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- Jo Bito
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Information Patent Grant
Semiconductor package having routable encapsulated conductive subst...
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- Won Bae Bang
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Information Patent Grant
Semiconductor device including source pad region and drain pad regi...
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- ANCORA SEMICONDUCTORS INC.
- Li-Fan Lin
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Information Patent Grant
Multichip packaged semiconductor device
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- Issue date Aug 6, 2024
- MagnaChip Semiconductor, Ltd.
- Hyun Dong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,040,301
- Issue date Jul 16, 2024
- Rohm Co., Ltd.
- Katsuhiko Yoshihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure having a lead frame and a passive c...
- Patent number 12,033,923
- Issue date Jul 9, 2024
- Advanced Semiconductor Engineering, Inc.
- Chi-Tsung Chiu
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Information Patent Grant
Semiconductor device and electronic device
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- Issue date Jul 9, 2024
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- Akihiro Fukatsu
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Information Patent Grant
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- Ikumi Fukuda
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Information Patent Grant
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Information Patent Grant
Semiconductor package, semiconductor module and methods for manufac...
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- Issue date May 7, 2024
- Infineon Technologies Austria AG
- Sergey Yuferev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of overlapping power terminals in a semiconductor module
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- Issue date Apr 30, 2024
- Fuji Electric Co., Ltd.
- Masashi Hoya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component apparatus having a first lead frame and a seco...
- Patent number 11,955,410
- Issue date Apr 9, 2024
- Shinko Electric Industries Co., Ltd.
- Yukinori Hatori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-embedded board
- Patent number 11,948,849
- Issue date Apr 2, 2024
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- Koo Woong Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit module having a plurality of lead frames connected to a sub...
- Patent number 11,935,819
- Issue date Mar 19, 2024
- Murata Manufacturing Co., Ltd.
- Hideshi Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of lead frames for cooling a power device
- Patent number 11,929,307
- Issue date Mar 12, 2024
- Hitachi Astemo, Ltd.
- Yusuke Takagi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

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ELECTRONIC MODULE HAVING A CLIP CONNECTED TO A SEMICONDUCTOR PACKAGE
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SEMICONDUCTOR PACKAGE
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CUSTOM LEADFRAME FROM STANDARD PLUS PRINTED LEADFRAME PORTION
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Plurality of lead frames mounted in one device

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacturing a semiconductor device

Molded inductor with magnetic core having mold flow enhancing channels

Packaged electronic device with film isolated power stack

Packaged stackable electronic power device for surface mounting and...

Electronic module comprising a semiconductor package with integrate...

Power semiconductor package having first and second lead frames

Method for forming a semiconductor package

Electronic component package and manufacuring method thereof

Multi-channel gate driver package with grounded shield metal

Semiconductor device

Method of forming a semiconductor package with connection lug

Lead frame assembly having a plurality of dicing holes

Plurality of transistors attached to a heat sink with a periphery n...

Package with electrically insulated carrier and at least one step o...

Package with different types of semiconductor dies attached to a fl...

Custom leadframe from standard plus printed leadframe portion

Semiconductor package having routable encapsulated conductive subst...

Semiconductor device including source pad region and drain pad regi...

Multichip packaged semiconductor device

Semiconductor device

Semiconductor package structure having a lead frame and a passive c...

Semiconductor device and electronic device

Semiconductor module

Semiconductor device

Semiconductor package, semiconductor module and methods for manufac...

Plurality of overlapping power terminals in a semiconductor module

Electronic component apparatus having a first lead frame and a seco...

Package-embedded board

Circuit module having a plurality of lead frames connected to a sub...

Plurality of lead frames for cooling a power device

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE, POWER SEMICONDUCTOR MODULE AND MANUFACTURING...

SEMICONDUCTOR DEVICE

LEADFRAME-BASED INTEGRATED TRANSFORMER PACKAGES

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE

ELECTRONIC MODULE HAVING A CLIP CONNECTED TO A SEMICONDUCTOR PACKAGE

POWER SUPPLY MODULE WITH HIGH HEAT DISSIPATION CAPABILITY AND HIGH...

EMBEDDED SEMICONDUCTOR PACKAGING DEVICE

DUAL SWITCHING POWER DEVICE

POWER SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

POWER MODULE HAVING A LEAD FRAME THAT PROVIDES SUBSTRATE SUPPORT AN...

SEMICONDUCTOR FRAME AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR MODULE

METHOD OF MANUFACTURING SEMICONDUCTOR ASSEMBLIES

ELECTRONIC MODULE COMPRISING AT LEAST ONE POWER SEMICONDUCTOR, AND...

CUSTOM LEADFRAME FROM STANDARD PLUS PRINTED LEADFRAME PORTION

CERAMIC SUBSTRATE FOR POWER MODULE, METHOD FOR MANUFACTURING SAME,...

SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBST...

PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP O...

ELECTRONIC COMPONENT PACKAGE AND MANUFACURING METHOD THEREOF

LEADFRAME COMPRISING A LEAD WITH AN ELEVATION FOR INCREASING MECHAN...

POWER SEMICONDUCTOR DEVICE WITH A STRESS-FREE JOINT BETWEEN METAL P...

CHIP-ON-CHIP POWER CARD HAVING IMMERSION COOLING

SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE

Methods for Manufacturing a Semiconductor Package and a Semiconduct...

SEMICONDUCTOR DEVICE

BONDING PAD, INTEGRATED CIRCUIT ELEMENT, AND INTEGRATED CIRCUIT DEVICE

Thermal Enhanced Power Semiconductor Package