characterised by the die pad

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H01L23/49503

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49503characterised by the die pad

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing leadless semiconductor package with wettab...
- Patent number 12,255,076
- Issue date Mar 18, 2025
- STMicroelectronics, Inc.
- Ian Harvey Arellano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device arrangement with compressible adhesive
- Patent number 12,249,561
- Issue date Mar 11, 2025
- Infineon Technologies AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and manufacturing method thereof
- Patent number 12,243,811
- Issue date Mar 4, 2025
- Dai Nippon Printing Co., Ltd.
- Masahiro Nagata
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor package with wettable flank and related methods
- Patent number 12,243,810
- Issue date Mar 4, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Hui Min Ler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming micro interconnect struc...
- Patent number 12,230,559
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with grooved die pad
- Patent number 12,224,229
- Issue date Feb 11, 2025
- Kabushiki Kaisha Toshiba
- Kyo Tanabiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module comprising a semiconductor package with integrate...
- Patent number 12,218,030
- Issue date Feb 4, 2025
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Miniature sensor cavities
- Patent number 12,203,776
- Issue date Jan 21, 2025
- Texas Instruments Incorporated
- Sreenivasan Kalyani Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor package
- Patent number 12,205,869
- Issue date Jan 21, 2025
- Mediatek Inc.
- You-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component package
- Patent number 12,205,873
- Issue date Jan 21, 2025
- TDK Corporation
- Yosuke Komasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-channel gate driver package with grounded shield metal
- Patent number 12,191,259
- Issue date Jan 7, 2025
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal isolator having enhanced creepage characteristics
- Patent number 12,183,662
- Issue date Dec 31, 2024
- ALLEGRO MICROSYSTEMS, LLC
- Robert A. Briano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated magnetic assembly with conductive field plates
- Patent number 12,183,693
- Issue date Dec 31, 2024
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package with multiple heat channels
- Patent number 12,176,274
- Issue date Dec 24, 2024
- Texas Instruments Incorporated
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Open cavity bridge co-planar placement architectures and processes
- Patent number 12,176,268
- Issue date Dec 24, 2024
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with wettable flank
- Patent number 12,176,272
- Issue date Dec 24, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Hui Min Ler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,176,269
- Issue date Dec 24, 2024
- Rohm Co., Ltd.
- Katsutoki Shirai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with photonic die and method
- Patent number 12,176,270
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for improving adhesive fillets on semiconductor die corners
- Patent number 12,170,240
- Issue date Dec 17, 2024
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,165,960
- Issue date Dec 10, 2024
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor light emitting device and method for manufacturing th...
- Patent number 12,166,162
- Issue date Dec 10, 2024
- Rohm Co., Ltd.
- Masahiko Kobayakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond damage detector including a detection bond pad over a fir...
- Patent number 12,159,808
- Issue date Dec 3, 2024
- Texas Instruments Incorporated
- Hung-Yun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip packaged semiconductor device
- Patent number 12,159,818
- Issue date Dec 3, 2024
- Nexperia B.V.
- Ricardo Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated magnetic assembly
- Patent number 12,148,556
- Issue date Nov 19, 2024
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having mold locking feature
- Patent number 12,142,548
- Issue date Nov 12, 2024
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for a package for a semiconductor device, semiconductor...
- Patent number 12,142,552
- Issue date Nov 12, 2024
- STMicroelectronics S.r.l.
- Fulvio Vittorio Fontana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat slug attached to a die pad for semiconductor package
- Patent number 12,136,588
- Issue date Nov 5, 2024
- Texas Instruments Incorporated
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for a die
- Patent number 12,136,587
- Issue date Nov 5, 2024
- Texas Instruments Incorporated
- Dolores Babaran Milo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,131,983
- Issue date Oct 29, 2024
- Rohm Co., Ltd.
- Katsutoki Shirai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package structure with reduced vertical stress regions
- Patent number 12,131,982
- Issue date Oct 29, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Tae Kyung Hwang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20250105226
- Publication date Mar 27, 2025
- NEXPERIA B.V.
- Ricardo Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUAD FLAT NO-LEAD PACKAGE WITH ENHANCED CORNER PADS FOR BOARD LEVEL...
- Publication number 20250105104
- Publication date Mar 27, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Li Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING INTERPOSER AND METHOD OF MAKING THE SAME
- Publication number 20250096081
- Publication date Mar 20, 2025
- Alpha and Omega Semiconductor International LP
- Madhur Bobde
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ENHANCED SOLDERABILITY AND METHOD THEREFOR
- Publication number 20250096077
- Publication date Mar 20, 2025
- NXP B.V.
- Yen-Chih Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLD COMPOUND TRENCHES TO FACILITATE PACKAGE SINGULATION
- Publication number 20250079247
- Publication date Mar 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Makoto SHIBUYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL PACKAGE SWITCHING POWER DEVICE
- Publication number 20250079268
- Publication date Mar 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH TRANSISTOR CHIP BETWEEN CARRIER AND CONDUCTIVE STRUCTU...
- Publication number 20250079275
- Publication date Mar 6, 2025
- INFINEON TECHNOLOGIES AG
- Wolfgang SCHOLZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME FOR A PACKAGE FOR A SEMICONDUCTOR DEVICE, SEMICONDUCTOR...
- Publication number 20250070000
- Publication date Feb 27, 2025
- STMicroelectronics S.r.l
- Fulvio Vittorio Fontana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH EMBEDDED LEADFRAME AND METHOD THEREFOR
- Publication number 20250069903
- Publication date Feb 27, 2025
- NXP B.V.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH PHOTONIC DIE AND METHOD
- Publication number 20250069993
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING COMPONENTS FOR SEMICONDU...
- Publication number 20250062196
- Publication date Feb 20, 2025
- Vishay Silliconix LLC
- Lim CHEE CHIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING TH...
- Publication number 20250063876
- Publication date Feb 20, 2025
- ROHM CO., LTD.
- Masahiko KOBAYAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250062199
- Publication date Feb 20, 2025
- ROHM CO., LTD.
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method Using Lead Frame Interposer in Bump...
- Publication number 20250054902
- Publication date Feb 13, 2025
- STATS ChipPAC Pte Ltd.
- Peik Eng Ooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SEMICONDUCTOR DEVICE, AND A STRUCTURE FORMED B...
- Publication number 20250046685
- Publication date Feb 6, 2025
- Siliconix Incorporated
- Barry LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE STRUCTURE
- Publication number 20250029899
- Publication date Jan 23, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Tae Kyung HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250029898
- Publication date Jan 23, 2025
- Rohm Co., Ltd.
- Katsutoki SHIRAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME FOR A DIE
- Publication number 20250022776
- Publication date Jan 16, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Dolores Babaran MILO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SLUG ATTACHED TO A DIE PAD FOR SEMICONDUCTOR PACKAGE
- Publication number 20250022782
- Publication date Jan 16, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Package With Galvanic Isolation
- Publication number 20250014971
- Publication date Jan 9, 2025
- Infineon Technologies Austria AG
- Richard Knipper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING PRE-MO...
- Publication number 20250014982
- Publication date Jan 9, 2025
- STMicroelectronics International N.V.
- Mauro MAZZOLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH ROUGHENED CONDUCTIVE COMPONENTS
- Publication number 20240429134
- Publication date Dec 26, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Yee Gin TEA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH REDISTRIBUTION LAYER PLATE FORMED VIA TEMPO...
- Publication number 20240421019
- Publication date Dec 19, 2024
- MICROCHIP TECHNOLOGY INCORPORATED
- Mankit Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
- Publication number 20240421049
- Publication date Dec 19, 2024
- ROHM CO., LTD.
- Takeshi OKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE PADDLE
- Publication number 20240404923
- Publication date Dec 5, 2024
- NEXPERIA B.V.
- Ricardo Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND MANUFACTURING METHOD THEREOF
- Publication number 20240404928
- Publication date Dec 5, 2024
- DAI NIPPON PRINTING CO., LTD.
- Masahiro NAGATA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APRIORI APPLICATION WITH DYNAMIC DIGITAL CORRECTION (DDC) FUNCTION
- Publication number 20240404893
- Publication date Dec 5, 2024
- Applied Materials, Inc.
- Shih-Hao KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE WITH MOLDED VIA AND DUAL SIDE PRESS-FIT PIN
- Publication number 20240404926
- Publication date Dec 5, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Heejo CHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTI-WHISKER COUNTER MEASURE USING A METHOD FOR MULTIPLE LAYER PLAT...
- Publication number 20240395680
- Publication date Nov 28, 2024
- STMicroelectronics S.r.l
- Paolo CREMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP O...
- Publication number 20240395646
- Publication date Nov 28, 2024
- INFINEON TECHNOLOGIES AG
- Edward FUERGUT
- H01 - BASIC ELECTRIC ELEMENTS

characterised by the die pad

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for manufacturing leadless semiconductor package with wettab...

Semiconductor device arrangement with compressible adhesive

Lead frame and manufacturing method thereof

Semiconductor package with wettable flank and related methods

Semiconductor device and method of forming micro interconnect struc...

Semiconductor device with grooved die pad

Electronic module comprising a semiconductor package with integrate...

Miniature sensor cavities

Method for forming a semiconductor package

Electronic component package

Multi-channel gate driver package with grounded shield metal

Signal isolator having enhanced creepage characteristics

Integrated magnetic assembly with conductive field plates

Multi-die package with multiple heat channels

Open cavity bridge co-planar placement architectures and processes

Semiconductor package with wettable flank

Semiconductor device

Package structure with photonic die and method

Lead frame for improving adhesive fillets on semiconductor die corners

Semiconductor device

Semiconductor light emitting device and method for manufacturing th...

Wire bond damage detector including a detection bond pad over a fir...

Multi-chip packaged semiconductor device

Integrated magnetic assembly

Semiconductor package having mold locking feature

Lead frame for a package for a semiconductor device, semiconductor...

Heat slug attached to a die pad for semiconductor package

Lead frame for a die

Semiconductor device

Electronic package structure with reduced vertical stress regions

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGE AND METHOD OF MANUFACTURING THEREOF

QUAD FLAT NO-LEAD PACKAGE WITH ENHANCED CORNER PADS FOR BOARD LEVEL...

SEMICONDUCTOR PACKAGE HAVING INTERPOSER AND METHOD OF MAKING THE SAME

SEMICONDUCTOR DEVICE WITH ENHANCED SOLDERABILITY AND METHOD THEREFOR

MOLD COMPOUND TRENCHES TO FACILITATE PACKAGE SINGULATION

DUAL PACKAGE SWITCHING POWER DEVICE

PACKAGE WITH TRANSISTOR CHIP BETWEEN CARRIER AND CONDUCTIVE STRUCTU...

LEAD FRAME FOR A PACKAGE FOR A SEMICONDUCTOR DEVICE, SEMICONDUCTOR...

SEMICONDUCTOR DEVICE WITH EMBEDDED LEADFRAME AND METHOD THEREFOR

PACKAGE STRUCTURE WITH PHOTONIC DIE AND METHOD

SEMICONDUCTOR DEVICE AND METHOD OF FORMING COMPONENTS FOR SEMICONDU...

SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING TH...

SEMICONDUCTOR DEVICE

Semiconductor Device and Method Using Lead Frame Interposer in Bump...

METHOD FOR FORMING A SEMICONDUCTOR DEVICE, AND A STRUCTURE FORMED B...

ELECTRONIC PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE

LEAD FRAME FOR A DIE

HEAT SLUG ATTACHED TO A DIE PAD FOR SEMICONDUCTOR PACKAGE

Power Package With Galvanic Isolation

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING PRE-MO...

SEMICONDUCTOR PACKAGES WITH ROUGHENED CONDUCTIVE COMPONENTS

ELECTRONIC PACKAGE WITH REDISTRIBUTION LAYER PLATE FORMED VIA TEMPO...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

DIE PADDLE

LEAD FRAME AND MANUFACTURING METHOD THEREOF

APRIORI APPLICATION WITH DYNAMIC DIGITAL CORRECTION (DDC) FUNCTION

POWER MODULE PACKAGE WITH MOLDED VIA AND DUAL SIDE PRESS-FIT PIN

ANTI-WHISKER COUNTER MEASURE USING A METHOD FOR MULTIPLE LAYER PLAT...

PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP O...