Patent Application
20190123011
The present invention relates to a semiconductor device having a structure in which a metal pattern and a semiconductor element are joined by solder.
Conventionally, a semiconductor device having a structure in which a metal pattern and a semiconductor element are joined by solder has been known. In the semiconductor device, when the solder provided directly below the semiconductor element melts, a thickness of the solder cannot be kept uniform, and there is a problem that the semiconductor element after bonding may be tilted.
As a countermeasure against such a problem, there has been proposed a method in which a wire bond is provided in advance at a place where a semiconductor element is arranged to ensure a thickness corresponding to a diameter of the wire bond. Further, a semiconductor device including a resist provided so as to surround the solder has been disclosed (see, for example, Japanese Patent Application Laid-Open No. 2006-49777).
However, in the method of securing the thickness corresponding to the diameter of the wire bond, it is necessary to add a process of providing the wire bond, which causes problems such as a long production time and high production costs. In addition, in Japanese Patent Application Laid-Open No. 2006-49777, inclination of a semiconductor element cannot be suppressed.
The present invention has been made to solve such problems, and an object thereof is to provide a semiconductor device capable of suppressing inclination of a semiconductor element.
In order to solve the above problem, a semiconductor device according to the present invention includes a resist provided so as to have an opening on a metal pattern, the resist having a protrusion part protruding into the opening, and the semiconductor device further includes a semiconductor element having an outside dimension smaller than an outside dimension of the opening excluding the protrusion, and solder that is provided in the opening to join the metal pattern and the semiconductor element, wherein the protrusion part of the resist includes a plurality of protrusions that overlap with the semiconductor element in a plan view and regulate a thickness direction of the semiconductor element.
An object of the present invention is to provide a semiconductor device capable of suppressing inclination of a semiconductor element. A semiconductor device according to the present invention includes a resist provided so as to have an opening on a metal pattern, the resist having a protrusion part protruding into the opening, and the semiconductor device further includes a semiconductor element having an outside dimension smaller than an outside dimension of the opening excluding the protrusion, and solder that is provided in the opening to join the metal pattern and the semiconductor element, wherein the protrusion part of the resist includes a plurality of protrusions that overlap with the semiconductor element in a plan view and regulate a thickness direction of the semiconductor element.
These and other objects, features, aspects and advantages of the present invention will become more apparent from the following detailed description of the present invention when taken in conjunction with the accompanying drawings.
Embodiments of the present invention will be described below with reference to the drawings.
As shown in
The solder 3 is provided in the opening of the resist 4 and joins the metal pattern 1 and the semiconductor element 5. In other words, the resist 4 is provided around the solder 3, which is provided directly below the semiconductor element 5, so as to suppress spreading of wetting of the solder 3.
The resist 4 has a plurality of protrusions protruding into the opening. More specifically, the resist 4 has one protrusion on each side of the opening. Each protrusion overlaps with the semiconductor element 5 in a plan view and regulates a thickness direction of the semiconductor element 5.
In the examples of
Each protrusion of the resist 4 and the semiconductor element 5 may be in direct contact with each other or may be in contact via the solder 3. The number of the control electrode pads 6 is not limited to four and at least one control electrode pad 6 may be provided.
According to the first preferred embodiment, as described above, the protrusion of the resist 4 overlaps with the semiconductor element 5 in a plan view and regulates the thickness direction of the semiconductor element 5, and therefore, a distance by which the semiconductor element 5 sinks into the solder 3 can be limited. That is, the distance in the thickness direction between the metal pattern 1 and the semiconductor element 5 can be ensured for the thickness of the resist 4, and therefore the inclination of the semiconductor element 5 can be suppressed. In addition, the thickness of the solder 3 directly below the semiconductor element 5 is uniform, and therefore deterioration of local heat dissipation properties when heat generated in the semiconductor element 5 is dissipated can be suppressed, and the local crack propagation in the solder 3 due to long-term use and the like can also be suppressed.
Note that semiconductor elements with small outside dimensions such as semiconductor elements using SiC may have a large inclination, and therefore, the above configuration is more effective in semiconductor devices including such semiconductor elements.
As shown in
In the example of
From the above, according to the second preferred embodiment, the same effects as those of the first preferred embodiment can be obtained. In addition, the resist 4 has protrusions at each of at least two corners of the opening, and thus the resist 4 has a structure in which heat generated in the semiconductor element 5 is easily dissipated. That is, the semiconductor device according to the second preferred embodiment has a structure with better heat dissipation performance as compared to the semiconductor device according to the first preferred embodiment.
In the above description, the structure of the semiconductor device in which the resist 4 has protrusions at each of at least two corners of the opening has been described, but the second preferred embodiment is not limited to such an example. The structure of the semiconductor device according to the second preferred embodiment may be, for example, a structure arbitrarily combining the structure of the semiconductor device according to the first preferred embodiment shown in
As shown in
From the above, according to the third preferred embodiment, effects similar to those of the first preferred embodiment can be obtained. In addition, since the protrusion of the resist 4 has a shape formed by chamfering the inner corner of the opening, an overlapping area of the protrusion and the semiconductor element 5 in a plan view becomes small. Accordingly, the semiconductor device according to the third preferred embodiment has a structure with better heat dissipation performance as compared to the semiconductor device according to the second preferred embodiment.
As shown in
In the example of
From the above, according to the fourth preferred embodiment, the same effects as those of the first preferred embodiment can be obtained. Further, since the resist 4 has the protrusion overlapping with the control electrode pad 6 which generates little heat during operation of the semiconductor element 5, the resist 4 has a structure in which the heat generated in the semiconductor element 5 is easily dissipated. That is, the semiconductor device according to the fourth preferred embodiment has a structure with better heat dissipation performance as compared to the semiconductor device according to the first to third preferred embodiments.
In the above description, the structure of the semiconductor device in which the resist 4 has at least the protrusion overlapping with the control electrode pad 6 in a plan view has been described, but the fourth preferred embodiment is not limited to such an example. The structure of the semiconductor device according to the fourth preferred embodiment may be, for example, a structure arbitrarily combining the structure of the semiconductor device according to the first preferred embodiment shown in
As shown in
In a direction in which the protrusion of the resist 4 protrudes, a distance T over which the protrusion and the non-heat generation region 8 overlap with each other in a plan view is shorter than a distance L of the non-heat generation region 8. In particular, if the heat generated in the heat generation region 7 is assumed to spread from the heat generation region 7 at an angle of 45°, the distance T over which the protrusion and the non-heat generation region 8 overlap with each other in a plan view satisfies the relationship of 0<T≤L−d. Here, d is the thickness of the solder 3 directly below the semiconductor element 5.
From the above, according to the fifth preferred embodiment, the same effects as those of the first preferred embodiment can be obtained. Further, by restricting the distance in which the protrusion and the non-heat generation region 8 overlap with each other in a plan view in the direction in which the protrusion of the resist 4 protrudes, a structure in which the heat generated in the semiconductor element 5 is easily dissipated is obtained. That is, the semiconductor device according to the fifth preferred embodiment has a structure with better heat dissipation performance as compared to the semiconductor device according to the first to fourth preferred embodiments.
In the above, the description has been provided based on the first preferred embodiment, but the fifth preferred embodiment is not limited to such a description. The structure of the semiconductor device according to the fifth preferred embodiment may be, for example, a structure arbitrarily combining the structure of the semiconductor device according to the first preferred embodiment shown in
It should be noted that in the present invention, each preferred embodiment can freely be combined or each preferred embodiment can be modified or omitted as appropriate within the scope of the invention.
While the invention has been shown and described in detail, the foregoing description is in all aspects illustrative and not restrictive. It is therefore understood that numerous modifications and variations can be devised without departing from the scope of the invention.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2017-205037 | Oct 2017 | JP | national |
