SEMICONDUCTOR INTEGRATED CIRCUIT

Abstract

A semiconductor integrated circuit according to the present invention includes a cell array composed of elements, conductive lines with a pattern of a line & space arranged on the cell array, connecting lines formed upper than the conductive lines, and contact holes which connect the conductive lines to the connecting lines. One end side of the conductive lines sequentially departs from an end of the cell array when heading from one of the conductive lines to another one, the contact holes are arranged at one end side of the conductive lines, and size of the contact holes is larger than width of the conductive lines.

Description

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING

FIG. 1 is a block diagram showing a principal part of a NAND-type flash memory;

FIG. 2 is a view showing a layout of a memory cell array part;

FIG. 3 is a view showing a layout of a cell unit;

FIG. 4 is a view showing a circuit example of a memory cell array part;

FIG. 5 is a view showing a layout as a reference example;

FIG. 6 is a view showing a contact part between a word line and a connecting line;

FIG. 7 is a view showing a layout as a first embodiment;

FIG. 8 is a view showing a contact part between a word line and a connecting line;

FIG. 9 is a view showing a contact part between a word line and a connecting line;

FIG. 10 is a view showing a layout as a second embodiment;

FIG. 11 is a cross-sectional view along a line XI-XI of FIG. 10;

FIG. 12 is a cross-sectional view along a line XII-XII of FIG. 10;

FIG. 13 is a cross-sectional view along a line XIII-XIII of FIG. 10;

FIG. 14 is a view showing a layout as a third embodiment;

FIG. 15 is a view showing a layout as the third embodiment;

FIG. 16 is a view showing a layout as a fourth embodiment;

FIG. 17 is a view showing a layout as the fourth embodiment;

FIG. 18 is a view showing a cross-sectional shape of a contact part;

FIG. 19 is a view showing a cross-sectional shape of a contact part; and

FIG. 20 is a view showing a cross-sectional shape of a contact part.

Claims

1. A semiconductor integrated circuit comprising: a cell array composed of elements;conductive lines with a pattern of a line & space arranged on the cell array;connecting lines formed upper than the conductive lines; andcontact holes which connect the conductive lines to the connecting lines,wherein one end side of the conductive lines sequentially departs from an end of the cell array when heading from one of the conductive lines to another one, the contact holes are arranged at one end side of the conductive lines, and size of the contact holes is larger than width of the conductive lines.

2. The semiconductor integrated circuit according to claim 1, wherein each center point of the contact holes deviates to one side where each one end of the conductive lines gradually approaches an end of the cell array with respect to a center line of the conductive lines.

3. The semiconductor integrated circuit according to claim 1, wherein the cell array is composed of blocks, and one end side of the conductive lines in each block sequentially departs from an end of the cell array when heading from one of the conductive lines to another one.

4. The semiconductor integrated circuit according to claim 3, wherein layout of the conductive lines within each block is identical.

5. The semiconductor integrated circuit according to claim 3, wherein layout of the conductive lines within the neighboring two blocks is symmetrical.

6. The semiconductor integrated circuit according to claim 1, wherein layout of one end side of the conductive lines is the same as layout of the other end side.

7. The semiconductor integrated circuit according to claim 1, wherein layout of one end side of the conductive lines is different from layout of the other end side.

8. The semiconductor integrated circuit according to claim 1, wherein drivers which drive the conductive lines are arranged at two ends of the cell array, and one end side of the conductive lines is connected to one of the drivers.

9. The semiconductor integrated circuit according to claim 1, wherein a fringe is not formed at each one end of the conductive lines.

10. The semiconductor integrated circuit according to claim 1, wherein dummy conductive lines are arranged at respective distal ends from each one end of the conductive lines with the same width as the conductive lines while being separated from the conductive lines.

11. A semiconductor integrated circuit comprising: a cell array having blocks composed of elements;conductive lines having a pattern of line & space arranged on the cell array;connecting lines formed upper than the conductive lines; andcontact holes which connect the conductive lines to the connecting lines,wherein one end side of the conductive lines has one of a single-edge shape and a double-sided edge shape, the contact holes are arranged at one end side of the conductive lines, and size of the contact holes is larger than width of the conductive lines.

12. The semiconductor integrated circuit according to claim 11, wherein each center point of the contact holes deviates to one side where one end side of the conductive lines gradually approaches an end of the cell array with respect to a center line of the conductive lines.

13. The semiconductor integrated circuit according to claim 11, wherein layout of the conductive lines within each block is identical.

14. The semiconductor integrated circuit according to claim 11, wherein layout of the conductive lines within the neighboring two blocks is symmetrical.

15. The semiconductor integrated circuit according to claim 11, wherein layout of one end side of the conductive lines is the same as layout of the other end side.

16. The semiconductor integrated circuit according to claim 11, wherein layout of one end side of the conductive lines is different from layout of the other end side.

17. The semiconductor integrated circuit according to claim 11, wherein drivers which drive the conductive lines is arranged at two ends of the cell array, and each one end of the conductive lines is connected to one of the drivers.

18. The semiconductor integrated circuit according to claim 11, wherein a fringe is not formed at one end side of the conductive lines.

19. The semiconductor integrated circuit according to claim 11, where fringes are formed at one end side of the conductive lines.

20. The semiconductor integrated circuit according to claim 11, wherein dummy conductive lines with the same width as the conductive lines are arranged at distal ends from each one end of the conductive lines while being separated from the conductive lines.