Claims
- 1. A semiconductor manufacturing facility characterized by:semiconductor manufacturing equipment (1); a cooling jacket unit (5; 7) which cools the semiconductor manufacturing equipment (1); a heat recovery part (2) which recovers heat from warmed exhaust water, which is cooling water absorbing heat passing through the cooling jacket unit (5; 7) and being released from said semiconductor manufacturing equipment (1); and a supply pipe (3) which supplies the warmed exhaust water, which has recovers heat in said heat recovery part (2), to said cooling jacket unit (5; 7), wherein the heat recovered by said heat recovery part (2) is utilized as a heat source used in a semiconductor manufacturing plant.
- 2. The semiconductor manufacturing facility as claimed in claim 1, characterized by comprising: a temperature detecting part (43) detecting a temperature of a cooling water outlet port of said cooling jacket unit (5; 7); and a flow control part (44) controlling a flow of the cooling water flowing through the cooling jacket unit (5; 7) so that a temperature detection value by temperature detecting part becomes equal to a setting temperature.
- 3. The semiconductor manufacturing facility as claimed in claim 1 or 2, characterized by comprising:a bypass passage (72) connecting between an inlet port and an outlet port of the cooling jacket unit (7) so as to allow a flow from the outlet port toward the inlet port by bypassing the cooling jacket unit (7); and a flow control part (73) provided to the bypass passage (72) so as to control an amount of the cooling water.
- 4. The semiconductor manufacturing facility as claimed in claim 3, characterized by comprising detecting means (T2, T3) for detecting a temperature difference between the inlet port and the outlet port of said cooling jacket unit (7), and wherein an amount of the cooling water flowing through said cooling jacket unit (7) via said flow control part (73) provided to said bypass passage (72) in accordance with the temperature difference detected by the detecting means.
- 5. The semiconductor manufacturing facility as claimed in claim 1 or 2, characterize by comprising a heat exchanger (20a) for cooling the warmed exhaust water flowing through the supply pipe (3) so as to produce the cooling water, and wherein the cooling water exiting from the heat exchanger is supplied to said cooling jacket unit (5; 7).
- 6. The semiconductor manufacturing facility as claimed in claim 1 or 2, characterized in that said cooling jacket unit comprises:an inner fluid passage (51) formed so as to surround a periphery of a heat generating part of the semiconductor manufacturing equipment (1) and having an outlet port (62) of the cooling water; an outer fluid passage (52) communicated with said inner fluid passage (51) and having an inlet port (61) of the cooling water, the outer fluid passage being formed so as to surround a periphery of the inner fluid passage and is capable of exchanging heat with the cooling water in the inner fluid passage (51).
- 7. The semiconductor manufacturing facility as claimed in claim 1 or 2, characterized in that: a temperature of the cooling water supplied to said cooling jacket unit (5; 7) is equal to or higher than 10° C. and less than 45° C.; a temperature flowing out of said cooling jacket unit (5; 7) is less than 98° C.; and a temperature difference between the cooling water to be supplied to said cooling jacket unit (5; 7) and the cooling water flowing out of said cooling jacket unit (5; 7) is set equal to or greater than 35° C.
- 8. The semiconductor manufacturing facility as claimed in claim 1 or 2, characterized in that the cooling water supplied to said cooling jacket unit (5; 7) is deoxidized and a reducing agent is dissolved therein.
- 9. The semiconductor manufacturing facility as claimed in claim 8, characterized in that the reducing agent is hydrogen, and an amount of the dissolved hydrogen relative to the cooling water is equal to or greater than 0.4 ppm.
- 10. The semiconductor manufacturing facility as claimed in claim 1 or 2, characterized in that surfaces of said cooling jacket unit (5; 7) and at least a part of an outlet port pipe from the outlet port (62) of the cooling jacket unit to a part contacting air in a clean room are covered by a heat insulator which does not generate a gaseous contaminant.
Priority Claims (1)
Number |
Date |
Country |
Kind |
11-189747 |
Jul 1999 |
JP |
|
Parent Case Info
This application is a continuation of PCT/JP 00/04312 filed Jun. 29, 2000.
Foreign Referenced Citations (6)
Number |
Date |
Country |
02308558 |
Dec 1990 |
JP |
7-24295 |
Jan 1995 |
JP |
7-284675 |
Oct 1995 |
JP |
09246363 |
Sep 1997 |
JP |
9-251959 |
Sep 1997 |
JP |
3061067 |
Jun 1999 |
JP |
Continuations (1)
|
Number |
Date |
Country |
Parent |
PCT/JP00/04312 |
Jun 2000 |
US |
Child |
09/670343 |
|
US |