BACKGROUND
Technical Field
The present disclosure relates to a semiconductor structure, and more particularly to a semiconductor structure including a landing pad.
Description of the Related Art
With the scaling and miniaturization of semiconductor structures, forming interconnections, such as contact structures, in a semiconductor structure becomes more and more difficult. For example, the miniaturization of semiconductor structure results in very thin conductive films in the semiconductor structure, and it is difficult to stop the etching process for forming interconnections at very thin conductive films. Therefore, an over-etching problem occurs frequently and loss of yield happens.
It is important to provide technology for semiconductor structures with improved interconnections.
SUMMARY
The present disclosure relates to a semiconductor structure including a landing pad and a method for manufacturing the same. Specifically, the semiconductor structure can be used in a staircase region of a memory device.
According to an embodiment of the present disclosure, a semiconductor structure is provided. The semiconductor structure includes a staircase structure and a first landing pad. The staircase structure includes a first stair layer and a second stair layer on the first stair layer. The first stair layer includes a first conductive film. The first landing pad is disposed on the first conductive film. The first landing pad has a first pad sidewall facing toward the second stair layer, and a second pad sidewall opposite to the first pad sidewall. The second pad sidewall includes an inclined sidewall portion.
The above and other embodiments of the disclosure will become better understood with regard to the following detailed description of the non-limiting embodiment(s). The following description is made with reference to the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
FIGS. 1-6 illustrate a method for manufacturing a semiconductor structure according to an embodiment of the present disclosure.
FIG. 7 illustrates a schematic view of a semiconductor structure according to an embodiment of the present disclosure.
FIG. 8 illustrates a schematic view of a semiconductor structure according to an embodiment of the present disclosure.
FIGS. 9-13 illustrate a method for manufacturing a semiconductor structure according to an embodiment of the present disclosure.
FIG. 14 illustrates a schematic view of a semiconductor structure according to an embodiment of the present disclosure.
FIG. 15 illustrates a schematic view of a semiconductor structure according to an embodiment of the present disclosure.
DETAILED DESCRIPTION
Various embodiments will be described more fully hereinafter with reference to accompanying drawings, which are provided for illustrative and explaining purposes rather than a limiting purpose. For clarity, the components may not be drawn to scale. In addition, some components and/or reference numerals may be omitted from some drawings. It is contemplated that the elements and features of one embodiment can be beneficially incorporated in another embodiment without further recitation.
FIGS. 1-6 illustrate a method for manufacturing a semiconductor structure according to an embodiment of the present disclosure.
Referring to FIG. 1, a staircase stack 100 is provided. The staircase stack 100 includes insulating stair layers arranged one on top of another. Each of the insulating stair layers includes an insulating film and a dielectric film on the insulating film. For example, the staircase stack 100 includes an insulating stair layer 111, an insulating stair layer 112 on the insulating stair layer 111, an insulating stair layer 113 on the insulating stair layer 112, and an insulating stair layer 114 on the insulating stair layer 113. The insulating stair layer 111 includes an insulating film 101 and a dielectric film 102 on the insulating film 101; the insulating stair layer 112 includes an insulating film 103 and a dielectric film 104 on the insulating film 103; the insulating stair layer 113 includes an insulating film 105 and a dielectric film 106 on the insulating film 105; the insulating stair layer 114 includes an insulating film 107 and a dielectric film 108 on the insulating film 107. The staircase stack 100 may include more or fewer insulating stair layers. A lower insulating stair layer of the insulating stair layers has an area larger than an area of an upper insulating stair layer of the insulating stair layers. The staircase stack 100 may further include an upper stair layer 115 on the insulating stair layer 114. The upper stair layer 115 includes an oxide film 109 and a hard mask film 110 on the oxide film 109. In an embodiment, the insulating film may include oxide, such as silicon oxide. The dielectric film may include nitride, such as silicon nitride. The oxide film 109 may include silicon oxide. The hard mask film 110 may include silicon, such as polysilicon. The insulating film and the dielectric film in the same insulating stair layer may have a coplanar stair sidewall. The oxide film 109 and the hard mask film 110 may have a coplanar stair sidewall.
Referring to FIG. 2, spacers 201, 202, 203 and 204 are then formed on the insulating stair layers 111, 112, 113 and 114 respectively. The spacer 201 is formed on the insulating stair layer 111 and on a sidewall of the insulating stair layer 112. The spacer 202 is formed on the insulating stair layer 112 and on a sidewall of the insulating stair layer 113. The spacer 203 is formed on the insulating stair layer 113 and on a sidewall of the insulating stair layer 114. The spacer 204 is formed the insulating stair layer 114 and on a sidewall of the upper stair layer 115. In an embodiment, the spacer may be formed by a deposition process and a reactive-ion etch (RIE) process. The spacer may include a material different from the insulating stair layer and having etch selectivity as compared with the insulating stair layer. For example, the spacer may include a conductive material, such as metal, or a semiconductor material, such as polysilicon. The spacer 201/202/203/204 has a first spacer sidewall 201A/202A/203A/204A and a second spacer sidewall 201B/202B/203B/204B opposite to the first spacer sidewall 201A/202A/203A/204A. The first spacer sidewall 201A/202A/203A of the spacer 201/202/203 faces away from the sidewall of the insulating stair layer 112/113/114, where the spacer 201/202/203 is formed. The first spacer sidewall 204A of the spacer 204 faces away from the sidewall of the upper stair layer 115, where the spacer 204 is formed. The second spacer sidewall 201B/202B/203B of the spacer 201/202/203 faces toward, or be in contact with, the sidewall of the insulating stair layer 112/113/114, where the spacer 201/202/203 is formed. The second spacer sidewall 204B of the spacer 204 faces toward, or be in contact with, the sidewall of the upper stair layer 115, where the spacer 204 is formed. The first spacer sidewall 201A/202A/203A/204A of the spacer 201/202/203/204 may include a curved sidewall portion. In an embodiment, the first spacer sidewall 201A/202A/203A/204A of the spacer 201/202/203/204 may include a rounded corner. In an embodiment, the first spacer sidewall 201A/202A/203A/204A of the spacer 201/202/203/204 may include a convex sidewall portion.
Referring to FIG. 3, sacrificial layers 301, 302, 303 and 304 are then formed on the insulating stair layers 111, 112, 113 and 114 respectively. For example, the sacrificial layers 301, 302, 303 and 304 may be formed by a dielectric on dielectric process for selective growth of the sacrificial layer. The sacrificial layers 301, 302, 303 and 304 are separated from each other. The sacrificial layer is separated from the insulating stair layer in the same stair of the staircase stack 100 by the spacer in the same stair. For example, the sacrificial layer 302 is separated from the insulating stair layer 113 by the spacer 202 in the same stair. The sacrificial layers 301, 302, 303 and 304 may be formed on the first spacer sidewalls 201A, 202A, 203A and 204A of the spacers 201, 202, 203 and 204 respectively. In an embodiment, the sacrificial layers 301, 302, 303 and 304 may be formed conformally on the first spacer sidewalls 201A, 202A, 203A and 204A of the spacers 201, 202, 203 and 204 respectively. A sacrificial layer sidewall of the sacrificial layer 301/302/303/304 may be shape complementary to at least part of the first spacer sidewall 201A/202A/203A/204A of the spacer 201/202/203/204, on which the sacrificial layer sidewall of the sacrificial layer 301/302/303/304 is formed. For example, as exemplarily shown in FIG. 3, the sacrificial layer sidewall 303A of the sacrificial layer 303 may have a concave curved shape complementary to part of the first spacer sidewall 203A of the spacer 203. A bottom surface of the sacrificial layer 301/302/303/304 may extend beyond the insulating stair layer 111/112/113/114, which is next to and below the sacrificial layer 301/302/303/304. For example, the bottom surface of the sacrificial layer 303 may extend beyond the insulating stair layer 113 and be in contact with the spacer 202.
In FIG. 3, the sacrificial layers 301, 302, 303 and 304 may have heights smaller than heights of the insulating stair layers 112, 113 and 114 and the upper stair layer 115 respectively, while not limited thereto. The height of the sacrificial layer 301/302/303/304 may be adjustable on the basis of process window; for example, the height of the sacrificial layer 301/302/303 may be higher than, equal to or smaller than the height of the insulating stair layer 112/113/114 in the same stair of the staircase stack 100, and the height of the sacrificial layer 304 may be higher than, equal to or smaller than the height of the upper stair layer 115. The sacrificial layer 301/302/303/304 may include nitride, such as silicon nitride.
Referring to FIG. 4, the spacers 201, 202, 203 and 204 and hard mask film 110 are then removed, for example by using SC1 or TMAH chemistry, to form recesses 401, 402, 403 and 404. A dielectric structure 405 is formed on the sacrificial layers 301-304, the insulating stair layers 111-114 and the oxide film 109 and filling the recesses 401-404. The dielectric structure 405 may comprise an oxide such as silicon oxide.
Referring to FIG. 5, the dielectric films 102, 104, 106 and 108 are removed, for example, by applying an etching process, to form spaces, and such spaces are filled with materials of conductive films 501, 502, 503 and 504, for example, by a deposition process. Consequently, the dielectric films 102, 104, 106 and 108 are replaced with the conductive films 501, 502, 503 and 504. Similarly, the sacrificial layers 301-304 are removed, for example, by applying an etching process, to form spaces, and such spaces are filled with materials of landing pads 505, 506, 507 and 508, for example, by a deposition process. Consequently, the sacrificial layers 301, 302, 303 and 304 are replaced with the landing pads 505-508. The formations of the conductive films 501-504 and the landing pads 505-508 may be performed at the same time. The conductive films 501-504 may include tungsten (W) or titanium/tungsten (Ti/W). The landing pads 505-508 may include W or Ti/W.
Through performing the method shown in FIGS. 1-5, a semiconductor structure 10 is provided. The semiconductor structure 10 includes a staircase structure 600, the landing pads 505-508 and the dielectric structure 405 on the staircase structure 600 and the landing pads 505-508. The staircase structure 600 includes a stair layer 601, a stair layer 602 on the stair layer 601, a stair layer 603 on the stair layer 602, a stair layer 604 on the stair layer 603, and the oxide film 109 on the stair layer 604. The stair layer 601 includes the insulating film 101 and the conductive film 501 on the insulating film 101. The stair layer 602 includes the insulating film 103 and the conductive film 502 on the insulating film 103. The stair layer 603 includes the insulating film 105 and the conductive film 503 on the insulating film 105. The stair layer 604 includes the insulating film 107 and the conductive film 504 on the insulating film 107. A lower stair layer of the stair layers has an area larger than an area of an upper stair layer of the stair layers. The landing pads 505, 506, 507 and 508 are on the stair layers 601, 602, 603 and 604 respectively. The landing pads 505, 506, 507 and 508 are separated from the stair layers 602, 603 and 604 and the oxide film 109 respectively.
In an embodiment, the insulating film and the conductive film in the same stair layer may have a coplanar stair sidewall. For example, the insulating film 107 and the conductive film 504 may have a coplanar stair sidewall 604A. In an embodiment, the insulating film sidewall of the insulating film and the conductive film sidewall of the conductive film in the same stair layer may be vertical and aligned with each other. For example, the insulating film sidewall 107A of the insulating film 107 and the conductive film sidewall 504A of the conductive film 504 may be vertical and aligned with each other.
The shapes of the landing pads 505, 506, 507 and 508 may depend on the shapes of the sacrificial layers 301, 302, 303 and 304. For example, the landing pad 506 disposed on the conductive film 502 (e.g. first conductive film) of the stair layer 602 (e.g. first stair layer) has a first pad sidewall 506A facing toward the stair layer 603 (e.g. second stair layer) on the stair layer 602. The landing pad 506 has a second pad sidewall 506B opposite to the first pad sidewall 506A. The first pad sidewall 506A may include a concave sidewall portion 506A1 facing toward the stair layer 603 (e.g. second stair layer). The concave sidewall portion 506A1 of the first pad sidewall 506A of the landing pad 506 may be in an upper portion of the first pad sidewall 506A. As shown in FIG. 5, the concave sidewall portion 506A1 of the first pad sidewall 506A of the landing pad 506 may be a curved portion. The first pad sidewall 506A may further include a straight sidewall portion 506A2 facing toward the stair layer 603 (e.g. second stair layer), and the straight sidewall portion 506A2 is below the concave sidewall portion 506A1. The second pad sidewall 506B of the landing pad 506 may include an inclined sidewall portion, that is, the second pad sidewall 506B may not be vertical. In this embodiment, an internal angle of the landing pad between the second pad sidewall and a bottom surface of the landing pad may be an acute angle. For example, the internal angle IA of the landing pad 506 between the second pad sidewall 506B and the bottom surface 506C of the landing pad 506 is an acute angle.
The bottom surface 506C of the landing pad 506 may extend beyond a conductive film sidewall 502A of the conductive film 502. In an embodiment, the insulating film 103 and the conductive film 502 of the stair layer 602 may have a coplanar stair sidewall 602A, and the bottom surface 506C of the landing pad 506 may extend beyond the coplanar stair sidewall 602A of the stair layer 602.
Lateral gap distances between the first pad sidewall of the landing pad and the stair layer may have several values since the first pad sidewall may include the concave sidewall portion. For example, the lateral gap distances between the first pad sidewall 506A and the stair layer 603 may be defined as the lateral gap distances GD1, GD2, GD3 and GD4 with several values since the first pad sidewall 506A includes the concave sidewall portion 506A1. In an embodiment, the first pad sidewall 506A includes the concave sidewall portion 506A1 in the upper portion, the lateral gap distances between the first pad sidewall 506A and the stair layer 603 may decrease from bottom to top. The lateral gap distances GD1 and GD2 (e.g. the first lateral gap distance) between an upper portion of the first pad sidewall 506A and the stair layer 603 (e.g. the second stair layer) may be smaller than the lateral gap distances GD3 and GD4 (e.g. the second lateral gap distance) between a lower portion of the first pad sidewall 506A and the stair layer 603 (e.g. the second stair layer). The lateral gap distance GD1 may be defined as the lateral gap distance between the top of the first pad sidewall 506A (i.e. an upper surface of the landing pad 506) and the conductive film 503 (e.g. the second conductive film) of the stair layer 603 (e.g. the second stair layer), and the lateral gap distance GD2 is defined as the lateral gap distance between any place of the upper portion of the first pad sidewall 506A, except the top of the first pad sidewall 506A, and the stair layer 603. In an embodiment, the lateral gap distance GD2 (e.g. the first lateral gap distance) may be defined as the lateral gap distance between the upper portion of the first pad sidewall 506A and the conductive film 503 (e.g. the second conductive film) of the stair layer 603 (e.g. the second stair layer). In an embodiment, the lateral gap distance GD2 (e.g. the first lateral gap distance) gradually decreases along a direction away from the stair layer 602 (e.g. the first stair layer). The lateral gap distance GD1 may be smaller than the lateral gap distance GD2. The lateral gap distance GD1 may be a minimum lateral gap distance among the lateral gap distances between the first pad sidewall 506A and the stair layer 603 (e.g. the second stair layer).
The lateral gap distance GD4 may be defined as the lateral gap distance between the bottom of the first pad sidewall 506A and the insulating film 105 of the stair layer 603, and the lateral gap distance GD3 may be defined as the lateral gap distance between any place of the lower portion of the first pad sidewall 506A, except the bottom of the first pad sidewall 506A, and the stair layer 603. In an embodiment, the lateral gap distance GD3 (e.g. the second lateral gap distance) may be defined as the lateral gap distance between the lower portion of the first pad sidewall 506A and the insulating film 105 of the stair layer 603 (e.g. the second stair layer). The lateral gap distance may be a gap distance along a horizontal direction perpendicular to the vertical direction.
In an embodiment, the first pad sidewall 506A includes a straight sidewall portion 506A2 below the concave sidewall portion 506A1 and in lower half of the first pad sidewall 506A; the lateral gap distance GD3 may be equal to the lateral gap distance GD4.
The relation of the landing pads relative to the stair layers can be realized by the analogy. For example, the landing pad 507 disposed on the conductive film 503 (e.g. first conductive film) of the stair layer 603 (e.g. first stair layer) has the first pad sidewall 507A facing toward the stair layer 604 (e.g. second stair layer) on the stair layer 603.
Referring to FIG. 6, the semiconductor structure 10 may further include contact structures 605, 606, 607 and 608 formed in the dielectric structure 405 and on the landing pads 505, 506, 507 and 508 respectively. The contact structures 605-608 may include conductive materials for providing electrical connections. For example, the contact structure 605 is electrically connected to the landing pad 505 and the conductive film 501. In this embodiment, the landing pads 505, 506 and 507 may have heights smaller than heights of the stair layers 602, 603 and 604 respectively. For example, the height H1 of the landing pad 506 is smaller than the height H2 of the stair layer 603 (e.g. the second stair layer).
FIG. 7 illustrates a schematic view of a semiconductor structure 20 according to an embodiment of the present disclosure. The difference between the semiconductor structure 20 and the semiconductor structure 10 is in shapes and/or heights of landing pads 701, 702, 703 and 704. In this embodiment, the landing pads 701, 702 and 703 may have heights larger than heights of the stair layers 602, 603 and 604 respectively. For example, the height H3 of the landing pad 703 is larger than the height H4 of the stair layer 604 (e.g. the second stair layer). The present disclosure is not limited thereto. In another embodiment, as shown in FIG. 8, landing pads 801, 802, 803 and 804 of semiconductor structure 30 is different from the landing pads 701, 702, 703 and 704 shown in FIG. 7 in shapes and and/or heights. In FIG. 8, the landing pads 801, 802 and 803 may have heights equal to heights of the stair layers 602, 603 and 604 respectively. For example, the height H5 of the landing pad 803 is equal to the height H6 of the stair layer 604 (e.g. the second stair layer). In an embodiment, an upper surface of the landing pad may be level with an upper surface of the stair layer; for example, the upper surface S1 of the landing pad 802 is level with the upper surface S2 of the stair layer 603 (e.g. the second stair layer), as shown in FIG. 8.
Referring back to FIG. 7, the landing pad 702 has a first pad sidewall 702A including a concave sidewall portion 702A2 facing toward the stair layer 603 (e.g. the second stair layer). The first pad sidewall 702A may further include a straight sidewall portion 702A1 facing toward the stair layer 603 (e.g. the second stair layer) and above the concave sidewall portion 702A2.
FIGS. 9-13 illustrate a method for manufacturing a semiconductor structure according to an embodiment of the present disclosure.
Referring to FIG. 9, a staircase stack 200 is provided. The staircase stack 200 includes a staircase structure 900 and an upper stair layer 915 on the staircase structure 900. The upper stair layer 915 may be formed on the top of the staircase structure 900. The staircase structure 900 includes stair layers arranged one on top of another. Each of the stair layers includes an insulating film and a conductive film on the insulating film. For example, the staircase structure 900 includes a stair layer 911, a stair layer 912 on the stair layer 911, a stair layer 913 on the stair layer 912, and a stair layer 914 on the stair layer 913. The stair layer 911 includes an insulating film 901 and a conductive film 906 on the insulating film 901; the stair layer 912 includes an insulating film 902 and a conductive film 907 on the insulating film 902; the stair layer 913 includes an insulating film 903 and a conductive film 908 on the insulating film 903; the stair layer 914 includes an insulating film 904 and a conductive film 909 on the insulating film 904. The staircase structure 900 may include more or fewer stair layers. A lower stair layer of the stair layers has an area larger than an area of an upper stair layer of the stair layers. The upper stair layer 915 is on the conductive film 909 of the stair layer 914. The upper stair layer 915 includes an oxide film 905 and a hard mask film 910 on the oxide film 905. In an embodiment, an area of the upper stair layer 915 is smaller than an area of the uppermost stair layer. For example, the area of the upper stair layer 915 is smaller than the area of the stair layer 914. In an embodiment, the insulating films 901-904 may include oxide, such as silicon oxide. The conductive films 906-909 may include conductive materials, such as tungsten (W) and titanium/tungsten (Ti/W). The oxide film 905 may include oxide, such as silicon oxide. The hard mask film 910 may include silicon, such as polysilicon.
The insulating film and the conductive film in the same stair layer may have a coplanar stair sidewall. In an embodiment, the insulating film sidewall of the insulating film and the conductive film sidewall of the conductive film in the same stair layer may be vertical and aligned with each other. For example, an insulating film sidewall 902A of the insulating film 902 and a conductive film sidewall 907A of the conductive film 907 may be vertical and aligned with each other. The oxide film 905 and the hard mask film 910 may have a coplanar stair sidewall. In an embodiment, a sidewall 905A of the oxide film 905 and a sidewall 910A of the hard mask film 910 may be vertical and aligned with each other.
Referring to FIG. 10, spacers 1001, 1002, 1003 and 1004 are then formed on the stair layers 911, 912, 913 and 914 respectively. The spacer 1001 is formed on the stair layer 911 and on a sidewall of the stair layer 912. The spacer 1002 is formed on the stair layer 912 and on a sidewall of the stair layer 913. The spacer 1003 is formed on the stair layer 913 and on a sidewall of the stair layer 914. The spacer 1004 is formed on the stair layer 914 and on a sidewall of the upper stair layer 915. In an embodiment, the spacer may be formed by a deposition process and a reactive-ion etching (RIE) process. The spacers may include dielectric materials, such as silicon nitride. The spacer 1001 has a first spacer sidewall 1001A and a second spacer sidewall 1001B opposite to the first spacer sidewall 1001A. The first spacer sidewall 1001A of the spacer 1001 faces away from the sidewall of the stair layer 912, where the spacer 1001 is formed. The second spacer sidewall 1001B of the spacer 1001 faces toward, or be in contact with, the sidewall of the stair layer 912, where the spacer 1001 is formed. The spacer 1002 has a first spacer sidewall 1002A and a second spacer sidewall 1002B opposite to the first spacer sidewall 1002A. The first spacer sidewall 1002A of the spacer 1002 faces away from the sidewall of the stair layer 913, where the spacer 1002 is formed. The second spacer sidewall 1002B of the spacer 1002 faces toward, or be in contact with, the sidewall of the stair layer 913, where the spacer 1002 is formed. The spacer 1003 has a first spacer sidewall 1003A and a second spacer sidewall 1003B opposite to the first spacer sidewall 1003A. The first spacer sidewall 1003A of the spacer 1003 faces away from the sidewall of the stair layer 914, where the spacer 1003 is formed. The second spacer sidewall 1003B of the spacer 1003 faces toward, or be in contact with, the sidewall of the stair layer 914, where the spacer 1003 is formed. The spacer 1004 has a first spacer sidewall 1004A and a second spacer sidewall 1004B opposite to the first spacer sidewall 1004A. The first spacer sidewall 1004A of the spacer 1004 faces away from the sidewall of the upper stair layer 915, where the spacer 1004 is formed. The second spacer sidewall 1004B of the spacer 1004 faces toward, or be in contact with, the sidewall of the upper stair layer 915, where the spacer 1004 is formed. The first spacer sidewall of the spacer may include a curved sidewall portion. In an embodiment, the first spacer sidewall of the spacer may include a rounded corner. In an embodiment, the first spacer sidewall of the spacer may include a convex sidewall portion.
Referring to FIGS. 11-12, landing pads 1101, 1102, 1103 and 1104 are formed on the stair layers 911, 912, 913 and 914 respectively, and a dielectric structure 1205 is formed on the landing pads 1101-1104, the spacers 1001-1004, the stair layers 911-914 and the upper stair layer 915. In an embodiment, a selective growth process is performed so as to provide the landing pads 1101, 1102, 1103 and 1104 on the stair layers 911, 912, 913 and 914 respectively. The landing pads 1101-1104 are separated from each other. The landing pads 1101-1104 may be formed on the conductive films 906-909 respectively. The landing pads 1101-1104 may be in contact with the conductive films 906-909 respectively. As shown in FIG. 11, the landing pads 1101-1104 may be formed on the first spacer sidewalls 1001A-1004A of the spacers 1001-1004 respectively. The landing pads 1101-1104 may be formed conformally on the first spacer sidewalls 1001A-1004A of the spacers 1001-1004 respectively. On the same level/stair, the landing pad is separated from the stair layer by the spacer therebetween. For example, on the same level/stair, the landing pad 1101 is separated from the stair layer 912 by the space 1001 therebetween. The landing pads 1101-1104 may include conductive materials, such as tungsten (W) and titanium/tungsten (Ti/W). In an embodiment, the landing pads 1101-1104 and the conductive films 906-909 include the same material. The process for forming the landing pads 1101-1104 on the conductive films 906-909 can be understood as a conductor on conductor process. The dielectric structure 1205 may include an oxide such as silicon oxide.
Through performing the method shown in FIGS. 9-12, a semiconductor structure 40 is provided. The semiconductor structure 40 includes the staircase structure 900, the upper stair layer 915, the spacers 1001-1004, the landing pads 1101-1104 and the dielectric structure 1205. The spacers 1001-1004 and the landing pads 1101-1104 are disposed on the staircase structure 900. The spacer 1001, the landing pad 1101 and the stair layer 912 are disposed on the conductive film 906 of the stair layer 911; the spacer 1001 is between the landing pad 1101 and the stair layer 912. The spacer 1002, the landing pad 1102 and the stair layer 913 are disposed on the conductive film 907 of the stair layer 912; the spacer 1002 is between the landing pad 1102 and the stair layer 913. The spacer 1003, the landing pad 1103 and the stair layer 914 are disposed on the conductive film 908 of the stair layer 913; the spacer 1003 is between the landing pad 1103 and the stair layer 914. The spacer 1004, the landing pad 1104 and the upper stair layer 915 are disposed on the conductive film 909 of the stair layer 914; the spacer 1004 is between the landing pad 1104 and the upper stair layer 915.
The landing pad has a first pad sidewall facing toward the stair layer and a second pad sidewall opposite to the first pad sidewall. The first pad sidewall of the landing pad may be shape complementary to at least part of the first spacer sidewall of the spacer, on which the landing pad is formed. The landing pad has a bottom surface extending beyond the stair layer on which the landing pad is disposed. The bottom surface of the landing pad may extend beyond a sidewall of the conductive film of the stair layer on which the landing pad is disposed.
For example, as exemplarily shown in FIG. 12, the landing pad 1102 (e.g. first landing pad) disposed on the conductive film 907 (e.g. first conductive film) of the stair layer 912 (e.g. first stair layer) has a first pad sidewall 1102A facing toward the stair layer 913 (e.g. second stair layer) on the stair layer 912. The landing pad 1102 has a second pad sidewall 1102B opposite to the first pad sidewall 1102A. The first pad sidewall 1102A of the landing pad 1102 may have a concave curved shape complementary to part of the first spacer sidewall 1002A of the spacer 1002. The first pad sidewall 1102A may include a concave sidewall portion 1102A1 facing toward the stair layer 913 (e.g. second stair layer). The concave sidewall portion 1102A1 of the first pad sidewall 1102A of the landing pad 1102 may be in an upper portion of the first pad sidewall 1102A. As shown in FIG. 12, the concave sidewall portion 1102A1 of the first pad sidewall 1102A of the landing pad 1102 may be a curved portion. The first pad sidewall 1102A may further include a straight sidewall portion 1102A2 facing toward the stair layer 913 (e.g. second stair layer), and the straight sidewall portion 1102A2 is below the concave sidewall portion 1102A1. The straight sidewall portion 1102A2 may be in lower half of the first pad sidewall 1102A; the present disclosure is not limited thereto. The second pad sidewall 1102B of the landing pad 1102 may include an inclined sidewall portion, that is, the second pad sidewall 1102B may not be vertical. The landing pad 1102 has a bottom surface 1102C extending beyond the stair layer 912 on which the landing pad 1102 is disposed. The bottom surface 1102C of the landing pad 1102 may be in contact with the spacer 1001. The bottom surface 1102C of the landing pad 1102 may extend beyond the sidewall 907A of the conductive film 907 of the stair layer 912 on which the landing pad 1102 is disposed. In an embodiment, the insulating film 902 and the conductive film 907 of the stair layer 912 may have a coplanar stair sidewall 912A, and the bottom surface 1102C of the landing pad 1102 may extend beyond the coplanar stair sidewall 912A of the stair layer 912.
In an embodiment, an internal angle of the landing pad between the second pad sidewall and the bottom surface of the landing pad may be an acute angle. For example, the internal angle IA2 of the landing pad 1102 between the second pad sidewall 1102B and the bottom surface 1102C of the landing pad 1102 is an acute angle.
In an embodiment, there is no interface (i.e. no actual boundary or no specific boundary) between the landing pad 1101 and the conductive film 906, between the landing pad 1102 and the conductive film 907, between the landing pad 1103 and the conductive film 908, and between the landing pad 1104 and the conductive film 909. The landing pad 1101 may be connected to the conductive film 906 without an interface between them. The landing pad 1102 may be connected to the conductive film 907 without an interface between them. The landing pad 1103 may be connected to the conductive film 908 without an interface between them. The landing pad 1104 may be connected to the conductive film 909 without an interface between them. There is an interface between the spacer 1001 and the landing pad 1101. There is an interface between the spacer 1002 and the landing pad 1102. There is an interface between the spacer 1003 and the landing pad 1103. There is an interface between the spacer 1004 and the landing pad 1104. The interface between the spacer and the landing pad can be understood as a boundary where the spacer and the landing pad are in contact with each other.
In the semiconductor structure 40, there is an interface between the spacers (e.g. the spacers 1001, 1002, 1003 and 1004) and the dielectric structure 1205. The interface between the spacers and the dielectric structure 1205 can be understood as a boundary where the spacers and the dielectric structure 1205 are in contact with each other. The interface between the spacers and the dielectric structure 1205 may include a curved portion.
As shown in FIG. 12, lateral gap distances between the first pad sidewall of the landing pad and the stair layer may have several values since the first pad sidewall may include the concave sidewall portion. For example, the lateral gap distances between the first pad sidewall 1102A and the stair layer 913 may be defined as the lateral gap distances GD5, GD6, GD7 and GD8 with several values since the first pad sidewall 1102A includes the concave sidewall portion 1102A1. In an embodiment, the first pad sidewall 1102A includes the concave sidewall portion 1102A1 in the upper portion, the lateral gap distances between the first pad sidewall 1102A and the stair layer 913 may decrease from bottom to top. The lateral gap distances GD5 and GD6 (e.g. the first lateral gap distance) between an upper portion of the first pad sidewall 1102A and the stair layer 913 may be smaller than the lateral gap distances GD7 and GD8 (e.g. the second lateral gap distance) between a lower portion of the first pad sidewall 1102A and the stair layer 913. The lateral gap distance GD5 may be defined as the lateral gap distance between the top of the first pad sidewall 1102A (i.e. an upper surface of the landing pad 1102) and the conductive film 908 (e.g. the second conductive film) of the stair layer 913 (e.g. the second stair layer), and the lateral gap distance GD6 is defined as the lateral gap distance between any place of the upper portion of the first pad sidewall 1102A, except the top of the first pad sidewall 1102A, and the stair layer 913. In an embodiment, the lateral gap distance GD6 (e.g. the first lateral gap distance) may be defined as the lateral gap distance between the upper portion of the first pad sidewall 1102A and the conductive film 908 (e.g. the second conductive film) of the stair layer 913 (e.g. the second stair layer). In an embodiment, the lateral gap distance GD6 (e.g. the first lateral gap distance) gradually decreases along a direction away from the stair layer 912 (e.g. the first stair layer). The lateral gap distance GD5 may be smaller than the lateral gap distance GD6. The lateral gap distance GD5 may be a minimum lateral gap distance among the lateral gap distances between the first pad sidewall 1102A and the stair layer 913 (e.g. the second stair layer).
The lateral gap distance GD8 may be defined as the lateral gap distance between the bottom of the first pad sidewall 1102A and the insulating film 903 of the stair layer 913, and the lateral gap distance GD7 may be defined as the lateral gap distance between any place of the lower portion of the first pad sidewall 1102A, except the bottom of the first pad sidewall 1102A, and the stair layer 913. In an embodiment, the lateral gap distance GD7 (e.g. the second lateral gap distance) may be defined as the lateral gap distance between the lower portion of the first pad sidewall 1102A and the insulating film 903 of the stair layer 913 (e.g. the second stair layer). The lateral gap distance may be a gap distance along a horizontal direction perpendicular to the vertical direction.
In an embodiment, the first pad sidewall 1102A includes a straight sidewall portion 1102A2 below the concave sidewall portion 1102A1 and in lower half of the first pad sidewall 1102A; the lateral gap distance GD7 may be equal to the lateral gap distance GD8.
In the semiconductor structure 40, the relation of the other landing pads (e.g. the landing pads 1101, 1103) relative to the stair layers can be realized by the analogy.
Referring to FIG. 13, the semiconductor structure 40 may further include contact structures 1305, 1306, 1307 and 1308 formed in the dielectric structure 1205 and on the landing pads 1101, 1102, 1103 and 1104 respectively. The contact structures 1305-1308 may pass through the landing pads 1101-1104 respectively. A distance OE1 can be defined as a longitudinal distance between an upper surface of the landing pad 1101 and a bottom surface of the contact structure 1305. A distance OE2 can be defined as a longitudinal distance between an upper surface of the landing pad 1102 and a bottom surface of the contact structure 1306. A distance OE3 can be defined as a longitudinal distance between an upper surface of the landing pad 1103 and a bottom surface of the contact structure 1307. A distance OE4 can be defined as a longitudinal distance between an upper surface of the landing pad 1104 and a bottom surface of the contact structure 1308. The distances OE1, OE2, OE3 and OE4 can be different from each other. For example, the distance OE1 is smaller than the distance OE2, the distance OE2 is smaller than the distance OE3, and the distance OE3 is smaller than the distance OE 4; the present disclosure is not limited thereto. The contact structures 1305-1308 may include conductive materials for providing electrical connections. For example, the contact structure 1305 is electrically connected to the landing pad 1101 and the conductive film 906. The first contact structures 1305-1308 and the landing pads 1101-1104 may include different materials.
In the semiconductor structure 40, the landing pads 1101-1103 may have heights smaller than heights of the stair layers 912-914 respectively; the landing pad 1104 may have a height smaller than a height of the upper stair layer 915. For example, the height H7 of the landing pad 1102 is smaller than the height H8 of the stair layer 913.
FIG. 14 illustrates a schematic view of a semiconductor structure 50 according to an embodiment of the present disclosure. The difference between the semiconductor structure 50 and the semiconductor structure 40 is in shapes and/or heights of landing pads 1401, 1402, 1403 and 1404. In this embodiment, the landing pads 1401, 1402 and 1403 may have heights larger than heights of the stair layers 912, 913 and 914 respectively. The landing pad 1404 may have a height larger than a height of the upper stair layer 915. For example, the height H9 of the landing pad 1403 is larger than the height H10 of the stair layer 914. The present disclosure is not limited thereto. In another embodiment, as shown in FIG. 15, landing pads 1501, 1502, 1503 and 1504 of semiconductor structure 60 is different from the landing pads 1501-1504 shown in FIG. 14 in shapes and and/or heights. In FIG. 15, the landing pads 1501, 1502 and 1503 may have heights equal to heights of the stair layers 912, 913 and 914 respectively. For example, the height H11 of the landing pad 1503 is equal to the height H12 of the stair layer 914. In an embodiment, an upper surface of the landing pad may be level with an upper surface of the stair layer; for example, the upper surface S3 of the landing pad 1502 is level with the upper surface S4 of the stair layer 913, as shown in FIG. 15.
Referring back to FIG. 14, the landing pad 1402 has a first pad sidewall 1402A including a concave sidewall portion 1402A2 facing toward the stair layer 913. The first pad sidewall 1402A may further include a straight sidewall portion 1402A1 facing toward the stair layer 913 and above the concave sidewall portion 1402A2.
The present disclosure provides a semiconductor structure including a landing pad so as to increase essentially the thickness of the conductive film in the landing area. With use of the landing pad, the etching process for forming the contact structure can be well controlled, the over-etching problem can be prevented, and the yield can be increased.
It is noted that the structures and methods as described above are provided for illustration. The disclosure is not limited to the configurations and procedures disclosed above. Other embodiments with different configurations of known elements can be applicable, and the exemplified structures could be adjusted and changed based on the actual needs of the practical applications. It is, of course, noted that the configurations of figures are depicted only for demonstration, not for limitation. Thus, it is known by people skilled in the art that the related elements and layers in a semiconductor structure, the shapes or positional relationship of the elements and the procedure details could be adjusted or changed according to the actual requirements and/or manufacturing steps of the practical applications.
While the disclosure has been described by way of example and in terms of the exemplary embodiment(s), it is to be understood that the disclosure is not limited thereto. On the contrary, it is intended to cover various modifications and similar arrangements and procedures, and the scope of the appended claims therefore should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements and procedures.
Patent Application
20230282511
