The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.
Reference will now be made in detail to the present preferred embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts.
The via 22 has an opening on the surface layer 211 of the substrate body 21. The via 22 can be a blind via or a through via. The via 22 has a first conductive element 221, a second conductive element 222 and a ground element 223 therein. The first conductive element 221, the second conductive element 222 and the ground element 223 are separate and electrically isolated to one another. The ground element 223 is electrically connected to the ground layer 212 of the substrate body 21. The first conductive element 221 and the second conductive element 222 pass through the ground layer 212 of the substrate body 21 and are electrically isolated with the ground layer 212 of the substrate body 21.
In the present embodiment, the method of forming the first conductive element 221, the second conductive element 222 and the ground element 223 includes, for example, the following steps. First, the via 22 is filled with a conductive material such as a metal. Then, a laser cutting operation is performed to cut the block of conductive material in the via 22 into the form shown in
The first circuit 23 is located on the surface layer 211 of the substrate body 21. The first circuit 23 is connected to the first conductive element 221 and is used for transmitting a positive differential signal. The second circuit 24 is located on the surface layer 211 of the substrate body 21. The second circuit 24 is connected to the second conductive element 222 and is used for transmitting a negative differential signal.
One of the advantages of the present invention is the production of three conductive elements inside one via (that is, the via 22). Two of the conductive elements (the first conductive element 221 and the second conductive element 222) can be respectively used to transmit a positive and a negative differential signal. The other conductive element (the ground element 223) is connected to a ground signal to serve as a reference plane for the impedance design. Thus, not only is the purpose of controlling the impedance inside the via achieved, but the effect is so positive that the electrical characteristics of the differential pair are also improved. In addition, one via (the via 22) instead of multiple vias is used to transmit a differential pair of signals in the present invention. Hence, the area occupied by the via is effectively reduced.
In the present embodiment, the method of forming the first conductive element 221, the second conductive element 222, the third conductive element 224 and the fourth conductive element 225 includes, for example, by laser cutting. However, it should be noted that other method could be used to separate the first conductive element 221, the second conductive element 222, the third conductive element 224 and the fourth conductive element 225. In the present embodiment, the first conductive element 221, the second conductive element 222, the third conductive element 224 and the fourth conductive element 225 are quadrants of a circle when viewed from the top view and the area of the quadrants are approximately equal. However, it should be noted that the first conductive element 221, the second conductive element 222, the third conductive element 224 and the fourth conductive element 225 could be partitioned into other forms.
The first circuit 23 is located on the surface layer 211 of the substrate body 21. The first circuit 23 is connected to the first conductive element 221 and is used for transmitting a positive differential signal. The second circuit 24 is located on the surface layer 211 of the substrate body 21. The second circuit 24 is connected to the second conductive element 222 and is used for transmitting a negative differential signal.
It should be noted that a better impedance control could be achieved because the semiconductor substrate 3 of the present embodiment has two ground elements (that is, the third conductive element 224 and the fourth conductive element 225).
It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the present invention without departing from the scope or spirit of the invention. In view of the foregoing, it is intended that the present invention cover modifications and variations of this invention provided they fall within the scope of the following claims and their equivalents.
Number | Date | Country | Kind |
---|---|---|---|
95138865 | Oct 2006 | TW | national |