Claims
- 1. A semiconductor wafer comprising:
- first and second major surfaces disposed opposite to each other and a side edge surface defining respective contours of said first and second major surfaces; and
- wafer hanging means having a notch which defines an opening on said side edge surface of said wafer, said opening of said notch on the side edge surface of said wafer having a distance which is smaller than a distance at a center portion of said notch, wherein said first and second major surfaces are selectively clipped out at a region corresponding to said notch.
- 2. The semiconductor wafer according to claim 1, wherein said notch defines a substantially circular shape.
- 3. The semiconductor wafer according to claim 1, wherein said notch defines a trapezoidal shape such that said notch tapers inwardly in a direction toward said the side edge surface of said wafer.
Priority Claims (1)
Number |
Date |
Country |
Kind |
1-178424 |
Jul 1989 |
JPX |
|
Parent Case Info
This is a division of application Ser. No. 07/424,826, filed on Oct. 20, 1989, U.S. Pat. No. 4,966,549.
US Referenced Citations (1)
Number |
Name |
Date |
Kind |
4965653 |
Otsuka et al. |
Oct 1990 |
|
Non-Patent Literature Citations (1)
Entry |
S. Magdo, "Pyramid Shaped Electrical Feedthrough in Silicon Wafers", IBM Technical Disclosure Bulletin, vol. 19, Sep. 1976, pp. 1232-1233. |
Divisions (1)
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Number |
Date |
Country |
Parent |
424826 |
Oct 1989 |
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