Hereinafter, referring to the drawings, preferred embodiments of the present invention will be described.
The table 11 is so provided as to be able to support the wafer W fixedly on a top surface thereof. The table 11 is fixed on a top end of a rod 15 of a uni axial robot 14, and is designed to be able to move up and down by an extending and retracting mechanism of the rod 15. In the present embodiment, the uni axial robot 14 is disposed on a bottom wall 17 of a lower case 16, and thereby the table 11 is so arranged as to be accommodated within the lower case 16. The lower case 16 is cylindrical in shape with a bottom plate, and a piping 20 is connected from a peripheral wall 18 to a decompression source (not shown), and thus level of decompression thereof is designed to be controllable.
The pressing member 12 is comprised of a molded component using rubber. The pressing member 12 is, as shown in
The deformable portion 23 includes an inner erecting surface 25 directed upward from the peripheral portion of the pressing surface 21, a peripheral drooping surface 26 running downward at acute angle from the top end of the inner erecting surface 25, and a flange surface portion 27 being formed at the lower end of the peripheral drooping surface 26. The flange surface portion 27 is fixed via a screw (not shown) at the lower end of a mounting cylinder 32 fixed in a lower surface of a top wall 31 forming an upper case 30 of lower open type. Thereby, when the upper and lower cases 30, 16 are enclosed, a first space S1 is designed to be formed by these cases 30, 16 and the pressing member 12, whereas a second space S2 to be formed by the top wall 31 portion of the upper case 30, the pressing member 12 and the mounting cylinder 32. It is noted that, in
The upper case 30 is provided with a piping 35 connected to a top wall 31 thereof, and the piping 35 is connected to a decompression source (not shown) adapted to decompress within the second space S2, which is designed to be capable of controlling the level of decompression thereof. It is noted that a recessed groove 36A is formed at the lower end surface of a peripheral wall 36 in the upper case 30, and an O-ring 38 is housed within the recessed groove 36A thereby ensuring a sealing property when the upper and lower cases 30, 16 are butt-enclosed.
Now, a method of sticking the sheet in the embodiment of the present invention will be described with reference to
First, in an opened state where the upper case 30 is separated from the upper end of the lower case 16, a wafer W is transferred to a table 11 via a transfer arm (not shown) or the like. At that time, a sheet S is supplied across between the upper and lower cases 30, 16 via a sheet supply apparatus (not shown), and thereby an initial operation for sticking the sheet S is completed.
Subsequent to completion of the initial operation, as illustrated in
When the pressing member 12 receives downward force exerted to the pressing surface 21, resulting from the release of the decompression, the deformable portion 23 begins to be deformed, as illustrated in
The deformable portion 23 continues to be deformed, as illustrated in
Subsequent to the completion of sticking of the sheet S in this manner, the upper and lower cases 30, 16 are opened, and cutting operation of the sheet S is performed by a cutting apparatus (not shown) along a peripheral side of the wafer W.
Therefore, according to such an embodiment, since the first and the second spaces S1, S2 are put in approximately the same decompression state, the deformable portion 23 is deformed by gradually releasing only the second space S2 side from decompression state. The pressing surface 21 is flattened by this deformation step by step from the central area toward the peripheral side, and thereby sticking of the sheet S is carried out. By virtue of this arrangement, it becomes possible to stick the sheet S to the wafer W by utilizing only decompression, and further even if air is present between the sheet S and the wafer W, it becomes possible to perform sticking operation of the sheet S while expelling the air to the outside. Thus, the invention offers the effectiveness that sticking of the sheet S can be ensured without trapping air.
As was described up to this point, the best arrangement, method and the like for carrying out the present invention have been disclosed in the foregoing descriptions. However, the present invention is not limited to the details set forth.
That is, the present invention has been illustrated and described mainly with reference to a specific embodiment. However, the invention is intended to cover such various modifications or changes that those skilled in the art may add, if necessary, to the above-described embodiment with respect to shape, location, layout and the like without departing from the technical spirit and the scope of the object of the present invention.
For example, in the above-described embodiment, there has been illustrated and described a case where the deformable portion 23 includes an inner erecting surface 25 directed to an erecting direction from the peripheral portion of the pressing surface 21, and a peripheral drooping portion 26 along a downward line at acute angle from the top of the inner erecting surface 25. As illustrated in
Further, by using a material that more readily undergoes elastic deformation than the pressing surface 21 for the deformable portion 23, that is, by changing the hardness of rubber serving as a material, as in the case of the present embodiment, the deformable portion 23 may be arranged so as to be more readily stretched vertically when pressure of the second space S2 is relatively increased.
Also, in the above-described embodiment, an arrangement is employed in which the first space S1 and the second space S2 are provided, then pressure within the first and the second spaces S1, S2 are decompressed, and on the other hand, only the second space S2 is released from decompression state. The present invention, however, is not limited thereto. In other words, even if an arrangement is employed in which air is supplied only into the space S2, without providing a decompression (vacuum) atmosphere, and the sheet S is stuck to the wafer W through the deformation of the deformable portion 23 and the pressing surface 21, substantially the same sticking of the sheet can be performed.
Further, the plate-like member is not limited to the wafer only, but the above-described embodiment can be also applied to an arrangement in which sheets and films are intended to be stuck to other plate-like members.
Also, the pressing member 12 is comprised of rubber molded components in the above-described embodiment, but not limited thereto. The pressing member 12 may be also comprised of elastically deformable materials such as soft resin materials, metal sheets.
Furthermore, the pressing member 12 is not limited to conical shape, but may be shaped with slopes being formed by two surfaces, alternatively may be arranged so as to stick the sheet S from one end toward the other end. In this case, such arrangement is adaptable by forming, for example, an accordion-shaped deformable portion from peripheral portion of the pressing surface excluding the above-mentioned one end.
Still further, in the above-described embodiment, the second space S2 is formed by the pressing member 12 and the upper case 30 and the mounting cylinder 32, but the second space S2 may be formed with the mounting cylinder being omitted. In addition to this, such arrangement may be employed in which the pressing member 12 itself is constructed to be a balloon-like enclosed shape with an intention to form the second space S2, then an exhaust valve or the like is provided on the pressing member, thereby performing pressure reducing operation.
Number | Date | Country | Kind |
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2006-244673 | Sep 2006 | JP | national |