This application is related to concurrently-filed U.S. application Ser. No. 08/995,874 which is incorporated by reference herein for all purposes.
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Entry |
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Yauh-Ching Liu, Gary K. Giust, Ruggero Castagnetti, and Subramanian Ramesh, “Metal-Encapsulated Polysilicon Gate and Interconnect”, Application Serial No: 09/069,027, Filing Date Apr. 27, 1998, Claims from corresponding U.S. Patent application (LSI1P141). |
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