Patent Application
20200225279
The subject matter herein generally relates to circuit boards, and more particularly to a smart decision feedback device and a method thereof for inspecting a circuit board.
Generally, electronic components mounted by surface mount technology (SMT) on printed circuit boards are mounted by solder paste, and the solder paste is inspected by a solder paste inspection device. An abnormality of solder paste printing on the circuit board is initially determined by the solder paste inspection device, and then visually inspected to determine whether the solder paste printing is abnormal. Parameter corrections and debugging of the solder paste inspection machine are accomplished by the personnel on site, which results in high labor cost and may be inefficient.
Implementations of the present disclosure will now be described, by way of embodiments, with reference to the attached figures.
It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different figures to indicate corresponding or analogous elements. Additionally, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein. However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details. In other instances, methods, procedures and components have not been described in detail so as not to obscure the related relevant feature being described. The drawings are not necessarily to scale and the proportions of certain parts may be exaggerated to better illustrate details and features. The description is not to be considered as limiting the scope of the embodiments described herein.
Several definitions that apply throughout this disclosure will now be presented.
The term “coupled” is defined as connected, whether directly or indirectly through intervening components, and is not necessarily limited to physical connections. The connection can be such that the objects are permanently connected or releasably connected. The term “comprising” means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in a so-described combination, group, series and the like.
In general, the word “module” as used hereinafter refers to logic embodied in hardware or firmware, or to a collection of software instructions, written in a programming language such as, for example, Java, C, or assembly. One or more software instructions in the modules may be embedded in firmware such as in an erasable-programmable read-only memory (EPROM). It will be appreciated that the modules may comprise connected logic units, such as gates and flip-flops, and may comprise programmable units, such as programmable gate arrays or processors. The modules described herein may be implemented as either software and/or hardware modules and may be stored in any type of computer-readable medium or other computer storage device.
At block S1, a number of abnormal solder paste points of the circuit board identified by the solder paste inspection device is obtained.
At block S2, whether the number of abnormal solder paste points is greater than or equal to a first predetermined value is determined. When the number of abnormal solder paste points is greater than or equal to the first predetermined value, block S3 is implemented. If the number of abnormal solder paste points is less than the first predetermined value, block S4 is implemented.
At block S3, a first prompt is displayed on a display unit.
At block S4, whether an identification result of the solder paste inspection device is abnormal is determined.
At block S5, when the identification result of the solder paste inspection device is abnormal, a test result performed by a testing device on the circuit board is obtained, and an adjustment parameter of the solder paste inspection device is analyzed.
At block S6, the adjustment parameter is sent to the solder paste inspection device.
At block S41, whether any of the abnormal solder paste points include a short circuit defect point is determined. If any of the abnormal solder paste points include a short circuit defect point, the second prompt is displayed on the display unit. If none of the abnormal solder paste points include a short circuit defect point, block S42 is implemented.
When the abnormal solder paste point includes a short circuit defect point, the second prompt is used to prompt a relevant personnel to wash or repair the circuit board. After the circuit board is washed, the circuit board can be re-printed by a printing machine, and the repaired circuit board can be inspected by the solder paste inspection device again.
Furthermore, when the abnormal solder paste points include a short circuit defect point, it is further determined whether a number of the short circuit defect points is greater than or equal to a second predetermined value. If the number of the short circuit defect points is greater than or equal to the second predetermined value, the second prompt includes a prompt to wash the circuit board. If the number of the short circuit defect points is less than the second predetermined value, the second prompt includes a prompt to overhaul the circuit board. In one embodiment, the second predetermined value is 5. In other embodiments, the second predetermined value may be adjusted according to actual requirements.
At block S42, whether any of the abnormal solder paste points include an offset point is determined. If any of the abnormal solder paste points include an offset point, the third prompt is displayed on the display unit. If none of the abnormal solder paste points include an offset point, block S43 is implemented.
The offset point is defined as the abnormal solder paste point having an offset surface area greater than or equal to 60% of a standard surface area. The third prompt includes a prompt to wash the circuit board. A criterion for determining the offset points may be adjusted to a different percentage of the standard surface area according to actual requirements. After the relevant personnel views the third prompt, the circuit board is washed, and the circuit board is re-printed by the printing machine.
At block S43, whether any of the abnormal solder paste points is larger than a first predetermined size is determined. If any of the abnormal solder paste points is larger than the first predetermined size, the fourth prompt is displayed on the display unit. If none of the abnormal solder paste points is larger than the first predetermined size, block S44 is implemented.
The abnormal solder paste point is determined to be larger than the first predetermined size when a surface area of the abnormal solder paste point is greater than or equal to 250% of a standard volume. The fourth prompt includes a prompt to wash the circuit board. A criterion for determining that the abnormal solder paste point is larger than the first predetermined size may be adjusted to a different percentage of the standard surface area according to actual requirements. After the relevant personnel views the fourth prompt, the circuit board is washed, and the circuit board is re-printed by the printing machine.
At block S44, whether any of the abnormal solder paste points is smaller than a second predetermined size is determined. If any of the abnormal solder paste points is smaller than the second predetermined size, the fifth prompt is displayed on the display unit. If none of the abnormal solder paste points is smaller than the second predetermined size, the identification result of the solder paste inspection device is determined to be abnormal.
When the abnormal solder paste point is determined to be smaller than the second predetermined size, the fifth prompt is used to prompt the relevant personnel to wash or repair the circuit board. The circuit board after washing can be re-printed by the printing machine, and the re-printed or repaired circuit board can be inspected by the solder paste inspection device again.
Furthermore, when any of the abnormal solder paste points is smaller than the second predetermined size, it is further determined whether a number of the solder paste points smaller than the second predetermined size is greater than or equal to a third predetermined value. If the number of the solder paste points smaller than the second predetermined size is greater than or equal to the third predetermined value, the fifth prompt includes a prompt to wash the circuit board. In one embodiment, the third predetermined value is 5. In other embodiments, the third predetermined value may be adjusted according to actual requirements.
In blocks S2 and S3, when the number of abnormal solder paste points is greater than or equal to the first predetermined value, the first prompt is used to prompt a relevant personnel to manually determine whether there is a problem of misidentification of the abnormal solder paste point or a problem of the solder paste inspection device. In one embodiment, a problem of the solder paste inspection device may be an incorrect template of the solder paste points on the circuit board. If there is a problem of incorrect identification of the abnormal solder paste points, the solder paste inspection device is adjusted to identify the abnormal solder paste points. If there is a problem of the template of the solder paste points, the template of the solder paste points is adjusted.
In one embodiment, the first predetermined value is 200. In other embodiments, the first predetermined value may be adjusted according to actual conditions. For example, the first predetermined value cannot be greater than a total number of solder paste points on the circuit board.
It other embodiments, a sequence of determining a type of abnormality of the solder paste points as described in
In block S5 in
In addition, AOI, ICT and FVS test the circuit board according to different principles. Thus, the inspection results are more comprehensive and accurate.
The processor 12 may be a central processing unit (CPU), a digital signal processor, a single chip microcomputer, or the like. The memory 13 is capable of storing various types of data, such as program codes, in the smart decision feedback device 10, and achieves high speed and automatic access of programs or data during the operation of the smart decision feedback device 10.
The memory 13 can be, but is not limited to, a read only memory (ROM), a random access memory (RAM), a programmable read only memory (PROM), an erasable programmable read only memory (EPROM), a one-time programmable read only memory, (OTPROM), an electronically erasable rewritable read only memory (EEPROM), a compact disk read-only memory (CD-ROM), or other optical disk storage, disk storage, magnetic tape storage, or any computer readable medium for storing data.
In other embodiments, the smart decision feedback device 10 may not include the display unit 11, and instead couple to an external device with the display function to meet the requirement of displaying the prompts. In addition, the smart decision feedback device 10 may not include the communication unit 14, and instead have an external communication function to satisfy the demand for transmitting data or signals.
Referring to
The transceiver module 21 is configured to obtain the number of abnormal solder paste points on the circuit board identified by the solder paste inspection device. The determining module 22 is configured to sequentially determine whether the number of abnormal solder paste points is greater than or equal to a first predetermined value, whether any of the abnormal solder paste point is a short circuit defect point, whether any of the abnormal solder paste points is an offset point, whether any of the abnormal solder paste points is surface area, and whether any of the abnormal solder paste points is smaller than the second predetermined size. Then, it is determined whether the identification result of the solder paste inspection device 10 is abnormal.
The display control module 23 is configured to control the display unit 11 to display the first prompt when the number of the abnormal solder paste points is greater than or equal to the first predetermined value, display the second prompt when any of the abnormal solder paste points is a short circuit defect point, the third prompt when any of the abnormal solder paste points is an offset point, the fourth prompt when any of the abnormal solder paste points is surface area, and the fifth prompt when any of the abnormal solder paste points is smaller than the second predetermined size.
The transceiver module 21 is further configured to obtain a test result performed by the testing device on the circuit board when the identification result is abnormal. The test result obtained from the testing device is at least one of AOI, ICT, and FVS test results. The analysis module 24 analyzes the parameters to be adjusted by the solder paste inspection device according to the AOI, ICT and FVS test results when the determination module 22 determines that the identification result of the solder paste inspection device is abnormal. The transceiver module 21 is configured to send adjustment parameters to the solder paste inspection device.
In this embodiment, the first predetermined value is 200, the second predetermined value is 5, and the third predetermined value is 5. In other embodiments, the first predetermined value, the second predetermined value, and the third predetermined value can be adjusted according to actual requirements.
In one embodiment, the offset point is defined as the abnormal solder paste point having an offset surface area greater than or equal to 60% of a standard surface area, the surface area solder paste point is defined as the abnormal solder paste point having a surface area greater than or equal to 250% of a standard volume, and the solder paste point smaller than the second predetermined size is defined as the abnormal solder paste point having a surface area less than or equal to 30% of a standard volume.
The embodiments shown and described above are only examples. Even though numerous characteristics and advantages of the present technology have been set forth in the foregoing description, together with details of the structure and function of the present disclosure, the disclosure is illustrative only, and changes may be made in the detail, including in matters of shape, size and arrangement of the parts within the principles of the present disclosure up to, and including, the full extent established by the broad general meaning of the terms used in the claims.
| Number | Date | Country | Kind |
|---|---|---|---|
| 201910024497.3 | Jan 2019 | CN | national |
