BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1A is a plan view illustrating a solid-state imaging device in accordance with a first embodiment of the invention;
FIG. 1B is a cross-sectional view thereof;
FIG. 2A is a cross-sectional view illustrating a schematic construction of a solid-state imaging element in accordance with the first embodiment;
FIG. 2B is a cross-sectional view illustrating the construction of a solid-state imaging element substrate;
FIGS. 3A and 3B are explanatory diagrams illustrating parts of a method of manufacturing the solid-state imaging element in accordance with the first embodiment;
FIGS. 4A to 4D are explanatory diagrams illustrating parts of the method of manufacturing the solid-state imaging element in accordance with the first embodiment;
FIG. 5 is an explanatory diagram illustrating a part of the method of manufacturing the solid-state imaging element in accordance with the first embodiment;
FIGS. 6A to 6D are explanatory diagrams illustrating parts of the method of manufacturing the solid-state imaging element in accordance with the first embodiment;
FIG. 7 is an explanatory diagram of a bonded state of a substrate and the solid-state imaging element, illustrating apart of the method of manufacturing the solid-state imaging element in accordance with the first embodiment;
FIG. 8 is a cross-sectional view of essential portions illustrating a distal end portion of an electronic endoscope in accordance with a second embodiment of the invention;
FIG. 9 is a cross-sectional view of essential portions illustrating a distal end portion of an electronic endoscope with the related-art solid-state imaging device installed therein; and
FIG. 10 is an exploded perspective view illustrating the related-art solid-state imaging device.