Solid-state imaging device and electronic endoscope using the same

Abstract
A solid-state imaging device comprises: a solid-state imaging element comprising a solid-state imaging element body; a first substrate one end face of which is bonded to and integrated with one end face of a solid-state imaging element substrate of the solid-state imaging element, the first substrate comprising on its one surface an electrode for establishing electrical contact with a bonding wire led from a pad provided on one surface of the solid-state imaging element, a frame that seals the solid-state imaging element so as to surround outer peripheral surfaces of the solid-state imaging element substrate excluding its the one end face; and a sealing resin portion that covers a region extending from a portion including the electrode on the one surface of the first substrate to a portion including the pad on the one surface of the solid-state imaging element.
Description

BRIEF DESCRIPTION OF THE DRAWINGS


FIG. 1A is a plan view illustrating a solid-state imaging device in accordance with a first embodiment of the invention;



FIG. 1B is a cross-sectional view thereof;



FIG. 2A is a cross-sectional view illustrating a schematic construction of a solid-state imaging element in accordance with the first embodiment;



FIG. 2B is a cross-sectional view illustrating the construction of a solid-state imaging element substrate;



FIGS. 3A and 3B are explanatory diagrams illustrating parts of a method of manufacturing the solid-state imaging element in accordance with the first embodiment;



FIGS. 4A to 4D are explanatory diagrams illustrating parts of the method of manufacturing the solid-state imaging element in accordance with the first embodiment;



FIG. 5 is an explanatory diagram illustrating a part of the method of manufacturing the solid-state imaging element in accordance with the first embodiment;



FIGS. 6A to 6D are explanatory diagrams illustrating parts of the method of manufacturing the solid-state imaging element in accordance with the first embodiment;



FIG. 7 is an explanatory diagram of a bonded state of a substrate and the solid-state imaging element, illustrating apart of the method of manufacturing the solid-state imaging element in accordance with the first embodiment;



FIG. 8 is a cross-sectional view of essential portions illustrating a distal end portion of an electronic endoscope in accordance with a second embodiment of the invention;



FIG. 9 is a cross-sectional view of essential portions illustrating a distal end portion of an electronic endoscope with the related-art solid-state imaging device installed therein; and



FIG. 10 is an exploded perspective view illustrating the related-art solid-state imaging device.


Claims
  • 1. A solid-state imaging device comprising: a solid-state imaging element comprising a solid-state imaging element body;a first substrate one end face of which is bonded to and integrated with one end face of a solid-state imaging element substrate of the solid-state imaging element, the first substrate comprising on its one surface an electrode for establishing electrical contact with a bonding wire led from a pad provided on one surface of the solid-state imaging element,a frame that seals the solid-state imaging element so as to surround outer peripheral surfaces of the solid-state imaging element substrate excluding its the one end face; anda sealing resin portion that covers a region extending from a portion including the electrode on the one surface of the first substrate to a portion including the pad on the one surface of the solid-state imaging element.
  • 2. The solid-state imaging device according to claim 1, wherein a gap is formed between the solid-state imaging element and the frame, andthe gap is sealed with a moisture-resistant resin.
  • 3. The solid-state imaging device according to claim 2, wherein the resin is a thermosetting epoxy resin.
  • 4. The solid-state imaging device according to claim 1, wherein the frame is formed by a metal plate.
  • 5. An electronic endoscope comprising the solid-state imaging device according to claim 1 provided in one of an interior of a distal end portion and a distal end side portion of the endoscope.
Priority Claims (1)
Number Date Country Kind
2006-027705 Feb 2006 JP national