Patent Application
20180304320
The present disclosure relates to a substrate processing apparatus having a function of reducing damage caused by a water hammer phenomenon.
In a substrate polishing device for polishing semiconductor substrates (wafers), polishing liquid having been used for polishing a substrate may adhere to a component of the polishing part or the inner surfaces and ceiling of the polishing chamber. When it is left as is, such adhering polishing liquid may be dried out and repeatedly deposited so that there is a possibility that the deposited polishing liquid drops down to a substrate or adheres to a polishing surface of the polishing pad to cause a scratch on a substrate that is being polished.
In a conventional substrate processing apparatus with a hand shower (for example, Japanese Patent Laid-Open No. 9-29637), polishing liquid adhering to a component of the polishing part or the inner walls and ceiling of the polishing chamber is manually washed away on a regular basis (preferably, before the polishing liquid is dried out) using pure water (ultrapure water).
However, the conventional hand shower, which is configured to start/stop discharging water by manually operating an operation lever (a handle), includes no measure for a water hammer phenomenon that may occur when discharging water is stopped. Meanwhile, an extremely high level (class) of cleanliness management is required for devices for processing semiconductor substrates. For example, since the hand shower is made of plastic and the pipe (the pure-water supplying tube) thereof is configured by a non-oil-treated product, there is a limit to improvement of the pressure resistance. Therefore, there is a risk of damage to the hand shower gun and the pipe (the pure-water supplying tube) thereof caused by a water hammer phenomenon when discharging water is stopped.
The present disclosure has been achieved in view of the above problems, and an object of the present disclosure is to provide a substrate processing apparatus, a hand shower gun, and a water-hammer reducing mechanism capable of reducing damage caused by a water hammer phenomenon.
A substrate processing apparatus of the present disclosure includes a substrate processing part that performs substrate processing in a chamber and a washing unit that performs washing in the chamber. The washing unit includes a main body that has a liquid supplying port and a liquid jetting port, a flow channel that is formed between the liquid supplying port and the liquid jetting port in the main body, and a valve that is provided in the flow channel. In the washing unit, when the valve is opened, the flow channel is opened, thereby causing the liquid jetting port to jet liquid, and when the valve is closed, the flow channel is closed, thereby causing the liquid jetting port to stop jetting liquid. The flow channel is provided with a water-hammer reducing mechanism that operates to reduce damage to the flow channel caused by a water hammer phenomenon when the valve is closed.
According to the above configuration, when the valve is closed to cause the liquid jetting port of the washing unit in the substrate processing apparatus to stop jetting liquid, the water-hammer reducing mechanism operates. Consequently, damage to the flow channel caused by a water hammer phenomenon is reduced.
In some embodiments, in the substrate processing apparatus of the present disclosure, the flow channel includes a first flow channel between the liquid supplying port and the valve, a second flow channel between the valve and the liquid jetting port, and a third flow channel connecting the first flow channel and the second channel without interposing the valve. The water-hammer reducing mechanism is a pressure relief valve that is provided in the third flow channel. When the valve is closed, the pressure relief valve is opened by increase in liquid pressure in the first flow channel, thereby establishing communication between the first flow channel open and the second flow channel.
According to the above configuration, when the valve is closed, the pressure relief valve is opened by the liquid pressure in the first flow channel, thereby establishing the communication between the first flow channel and the second flow channel through the third flow channel so that the liquid pressure in the first flow channel is prevented from increasing excessively. Consequently, damage to the flow channel caused by a water hammer phenomenon is reduced.
In some embodiments, in the substrate processing apparatus of the present disclosure, the pressure relief valve is configured to be kept closed by an energizing member (biasing member). An energizing pressure (biasing pressure) by the energizing member is higher than a normal liquid pressure in the first flow channel and is lower than a breakage generating pressure at which the flow channel is broken by a water hammer phenomenon.
According to the above configuration, since the energizing pressure of the pressure relief valve is lower than the breakage generating pressure, breakage of the flow channel caused by a water hammer phenomenon can be prevented. In this case, the energizing pressure of the pressure relief valve is higher than the normal liquid pressure in the first flow channel. Consequently, at the normal time (when no water hammer phenomenon occurs) in which the valve is closed, the pressure relief valve is prevented from being opened to establish the communication between the first flow channel and the second flow channel, thereby preventing liquid from jetting out (leaking) from the liquid jetting port.
In some embodiments, in the substrate processing apparatus of the present disclosure, the washing unit includes a piston that is provided in the valve and slidingly moves in cooperation with an opening/closing operation of the valve and a cylinder chamber that houses the piston. The flow channel includes a first flow channel between the liquid supplying port and the valve, a second flow channel between the valve and the liquid jetting port, and a fourth flow channel connecting the first flow channel and the cylinder chamber. A fluid resistance of the fourth flow channel is higher than a fluid resistance of the first flow channel.
According to the above configuration, when the valve is closed, liquid flows into the cylinder chamber from the fourth flow channel with the sliding movement of the piston. However, in this case, since the fluid resistance of the fourth flow channel is higher than that of the first flow channel, the flow speed (the inflow rate per unit time) of the liquid to the cylinder chamber is lowered. Accordingly, the sliding movement speed of the piston is lowered and the closing speed of the valve is lowered. In this way, since the closing speed of the valve is lowered, the liquid pressure in the first flow channel is prevented from increasing excessively when the valve is closed. Consequently, damage to the flow channel caused by a water hammer phenomenon is reduced. In this case, the water-hammer reducing mechanism can be considered to have a configuration in which the fluid resistance of the fourth flow channel is higher than the fluid resistance of the first flow channel.
In some embodiments, in the substrate processing apparatus of the present disclosure, the fourth flow channel is provided with a fluid-resistance adjusting part that adjusts the fluid resistance of the fourth flow channel.
According to the above configuration, since the fluid resistance of the fourth flow channel is adjustable, the moving speed of the piston (that is, the speed of closing the valve) can be appropriately adjusted.
In some embodiments, in the substrate processing apparatus of the present disclosure, the cylinder chamber includes a first area in which the piston slidingly moves when the valve is opened and a second area that is an area at the opposite side of the first area across the piston. The cylinder chamber is provided with a fifth flow channel connecting the first area and the second area. The fifth flow channel is provided with a check valve. When the valve is opened, the check valve is opened by increase in liquid pressure in the first area, thereby establishing communication between the first area and the second area.
According to the above configuration, when the valve is opened, the check valve is opened by the liquid pressure in the first area in the cylinder chamber, thereby establishing the communication between the first area and the second area through the fifth flow channel so that liquid is allowed to move from the first area to the second area. Consequently, the liquid pressure is prevented from blocking the sliding movement of the piston to allow the smooth sliding movement of the piston.
In some embodiments, in the substrate processing apparatus of the present disclosure, the substrate processing part is a polishing part that polishes a substrate in the chamber. The washing unit is a hand shower gun that washes an inside of the chamber.
According to the above configuration, the hand shower gun is provided with the water-hammer reducing mechanism to reduce damage to the flow channel caused by a water hammer phenomenon.
In some embodiments, in the substrate processing apparatus of the present disclosure, the substrate processing part is a polishing part that polishes a substrate in the chamber. The washing unit is an atomizer that washes the polishing part in the chamber.
According to the above configuration, the atomizer is provided with the water-hammer reducing mechanism to reduce damage to the flow channel caused by a water hammer phenomenon.
A substrate processing apparatus of the present disclosure includes a substrate processing part that performs substrate processing in a chamber, a washing unit that performs washing in the chamber, and a liquid supplying line that supplies liquid to the washing unit. The washing unit includes a main body that has a liquid supplying port and a liquid jetting port, a flow channel that is formed between the liquid supplying port and the liquid jetting port in the main body, and a valve that is provided in the flow channel. In the washing unit, when the valve is opened, the flow channel is opened, thereby causing the liquid jetting port to jet liquid, and when the valve is closed, the flow channel is closed, thereby causing the liquid jetting port to stop jetting liquid. The liquid supplying line is provided with a water-hammer reducing mechanism that operates to reduce damage to the flow channel caused by a water hammer phenomenon when the valve is closed.
According to the above configuration, when the valve is closed to cause the liquid jetting port of the washing unit in the substrate processing apparatus to stop jetting liquid, the water-hammer reducing mechanism operates. Consequently, damage to the flow channel caused by a water hammer phenomenon is reduced. When the liquid supplying line is provided with the water-hammer reducing mechanism, the water-hammer reducing mechanism may be placed directly in the middle of the liquid supplying line, or may be placed in another line (for example, a liquid discharging line) that branches from the middle of the liquid supplying line.
In some embodiments, in the substrate processing apparatus of the present disclosure, the water-hammer reducing mechanism is configured by a pressure relief valve that is provided in a liquid discharging line that branches from the liquid supplying line. When the valve is closed, the pressure relief valve operates to reduce damage to the flow channel caused by a water hammer phenomenon.
According to the above configuration, the pressure relief valve is provided to reduce damage to the flow channel caused by a water hammer phenomenon.
In some embodiments, in the substrate processing apparatus of the present disclosure, the water-hammer reducing mechanism is configured by a buffer tank that is provided in the liquid supplying line. The buffer tank includes a diaphragm that operates to reduce damage to the flow channel caused by a water hammer phenomenon when the valve is closed.
According to the above configuration, the buffer tank including the diaphragm is provided to reduce damage to the flow channel caused by a water hammer phenomenon.
In some embodiments, in the substrate processing apparatus of the present disclosure, the water-hammer reducing mechanism is configured by a pressure sensor and a pressure relief valve that are provided in the liquid discharging line that branches from the liquid supplying line. When the valve is closed and the pressure sensor detects increase in pressure in the liquid supplying line, the pressure relief valve operates to reduce damage to the flow channel caused by a water hammer phenomenon.
According to the above configuration, the pressure sensor and the pressure relief valve are provided to reduce damage to the flow channel caused by a water hammer phenomenon.
A hand shower gun of the present disclosure includes a main body that has a liquid supplying port and a liquid jetting port, a flow channel that is formed between the liquid supplying port and the liquid jetting port in the main body, a valve that is provided in the flow channel, and an operation handle that opens/closes the valve. When the valve is opened by an opening operation of the operation handle, the flow channel is opened, thereby causing the liquid jetting port to jet liquid, and when the valve is closed by a closing operation of the operation handle, the flow channel is closed, thereby causing the liquid jetting port to stop jetting liquid. The flow channel in the main body is provided with a water-hammer reducing mechanism that operates when the valve is closed by the closing operation of the operation handle.
According to the above configuration, when the valve is closed by the closing operation of the operation handle to cause the liquid jetting port of the hand shower gun to stop jetting liquid, the water-hammer reducing mechanism operates. Consequently, damage to the flow channel in the main body of the hand shower gun caused by a water hammer phenomenon is reduced.
In some embodiments, in the hand shower gun of the present disclosure, the flow channel includes a first flow channel between the liquid supplying port and the valve, a second flow channel between the valve and the liquid jetting port, and a third flow channel connecting the first flow channel and the second flow channel without interposing the valve. The water-hammer reducing mechanism is a pressure relief valve that is provided in the third flow channel. When the valve is closed by the closing operation of the operation handle, the pressure relief valve is opened by increase in liquid pressure in the first flow channel, thereby establishing communication between the first flow channel and the second flow channel.
According to the above configuration, when the valve is closed by the closing operation of the operation handle, the pressure relief valve is opened by the liquid pressure in the first flow channel, thereby establishing the communication between the first flow channel and the second flow channel through the third flow channel so that the liquid pressure in the first flow channel is prevented from increasing excessively. Consequently, damage to the flow channel caused by a water hammer phenomenon is reduced.
In some embodiments, in the hand shower gun of the present disclosure, the pressure relief valve is configured to be kept closed by an energizing member. An energizing pressure by the energizing member is higher than a normal liquid pressure in the first flow channel and is lower than a breakage generating pressure at which the flow channel is broken by a water hammer phenomenon.
According to the above configuration, since the energizing pressure of the pressure relief valve is lower than the breakage generating pressure, breakage of the flow channel caused by a water hammer phenomenon can be prevented. In this case, since the energizing pressure of the pressure relief valve is higher the normal liquid pressure in the first flow channel, at the normal time (when no water hammer phenomenon occurs) in which the valve is closed, the pressure relief valve is prevented from being opened to establish the communication between the first flow channel and the second flow channel, thereby preventing liquid from jetting out (leaking) from the liquid jetting port.
In some embodiments, in the hand shower gun of the present disclosure, the hand shower gun includes a piston that is provided in the valve and slidingly moves in cooperation with an opening/closing operation of the valve and a cylinder chamber that houses the piston. The flow channel includes a first flow channel between the liquid supplying port and the valve, a second flow channel between the valve and the liquid jetting port, and a fourth flow channel connecting the first flow channel and the cylinder chamber. A fluid resistance of the fourth flow channel is higher than a fluid resistance of the first flow channel.
According to the above configuration, when the valve is closed by the closing operation of the operation handle, liquid flows into the cylinder chamber from the fourth flow channel to the cylinder chamber with the sliding movement of the piston. However, in this case, since the fluid resistance of the fourth flow channel is higher than the fluid resistance of the first flow channel, the flow speed (the inflow rate per unit time) of the liquid to the cylinder chamber is lowered. Accordingly, the sliding movement speed of the piston is lowered and the closing speed of the valve is lowered. In this way, since the closing speed of the valve is lowered, the liquid pressure in the first flow channel is prevented from increasing excessively when the valve is closed. Consequently, damage to the flow channel caused by a water hammer phenomenon is reduced. In this case, the water-hammer reducing mechanism can be considered to have a configuration in which the fluid resistance of the fourth flow channel is higher than the fluid resistance of the first flow channel.
In some embodiments, in the hand shower gun of the present disclosure, the fourth flow channel is provided with a fluid-resistance adjusting part that adjusts the fluid resistance of the fourth flow channel.
According to the above configuration, since the fluid resistance of the fourth flow channel is adjustable, the moving speed of the piston (that is, the speed of closing the valve) can be appropriately adjusted.
In some embodiments, in the hand shower gun of the present disclosure, the cylinder chamber includes a first area in which the piston slidingly moves when the valve is opened by the opening operation of the operation handle and a second area that is an area at an opposite side of the first area across the piston. The cylinder chamber is provided with a fifth flow channel connecting the first area and the second area. The fifth flow channel is provided with a check valve. When the valve is opened by the opening operation of the operation handle, the check valve is opened by increase in liquid pressure in the first area, thereby establishing communication between the first area and the second area.
According to the above configuration, when the valve is opened by the opening operation of the operation handle, the check valve is opened by the liquid pressure in the first area in the cylinder chamber, thereby establishing the communication between the first area and the second area through the fifth flow channel so that liquid is allowed to move from the first area to the second area. Consequently, the liquid pressure is prevented from blocking the sliding movement of the piston to allow the smooth sliding movement of the piston. In this way, the opening operation of the operation handle can be smoothly performed.
In a water-hammer reducing mechanism of the present disclosure, a flow channel is formed between a liquid supplying port and a liquid jetting port and the water-hammer reducing mechanism operates when a valve provided in the flow channel is closed. The flow channel includes a first flow channel between the liquid supplying port and the valve, a second flow channel between the valve and the liquid jetting port, and a third flow channel connecting the first flow channel and the second channel without interposing the valve. The water-hammer reducing mechanism is a pressure relief valve that is provided in the third flow channel. When the valve is closed, the pressure relief valve is opened by increase in liquid pressure in the first flow channel, thereby establishing communication between the first flow channel and the second flow channel.
According to the above water-hammer reducing mechanism, similarly to the above hand shower gun, when the valve is closed, the pressure relief valve is opened by the liquid pressure in the first flow channel, thereby establishing the communication between the first flow channel and the second flow channel through the third flow channel so that the liquid pressure in the first flow channel is prevented from increasing excessively. Consequently, damage to the flow channel caused by a water hammer phenomenon is reduced.
In a water-hammer reducing mechanism of the present disclosure, a flow channel is formed between a liquid supplying port and a liquid jetting port and the water-hammer reducing mechanism operates when a valve provided in the flow channel is closed. The valve is provided with a piston that is housed in a cylinder chamber and slidingly moves in cooperation with an opening/closing operation of the valve. The flow channel includes a first flow channel between the liquid supplying port and the valve, a second flow channel between the valve and the liquid jetting port, and a fourth flow channel connecting the first flow channel and the cylinder chamber. A fluid resistance of the fourth flow channel is higher than a fluid resistance of the first flow channel.
According to the above water-hammer reducing mechanism, similarly to the above hand shower gun, when the valve is closed, liquid flows into the cylinder chamber from the fourth flow channel with the sliding movement of the piston. However, in this case, since the fluid resistance of the fourth flow channel is higher than the fluid resistance of the first flow channel, the flow speed (the inflow rate per unit time) of liquid to the cylinder chamber is lowered. Accordingly, the sliding movement speed of the piston is lowered and the closing speed of the valve is lowered. In this way, since the closing speed of the valve is lowered, the liquid pressure in the first flow channel is prevented from increasing excessively when the valve is closed. Consequently, damage to the flow channel caused by a water hammer phenomenon is reduced.
According to the present disclosure, damage caused by a water hammer phenomenon is reduced.
Hereinafter, descriptions of a substrate processing apparatus in an embodiment of the present disclosure will be given with reference to the drawings. In the present embodiment, an example of the substrate processing apparatus that is used as a substrate polishing device or the like is shown, for example. Identical or corresponding components are denoted by identical reference numerals and the overlapping explanations thereof will be omitted.
The polishing part 3 is a region in which a wafer is polished (flattened) and includes a first polishing unit 3A, a second polishing unit 3B, a third polishing unit 3C, and a fourth polishing unit 3D. As illustrated in
As illustrated in
The atomizer 34A is intended to wash away polishing wastes and abrasive grains remaining on the polishing surface of the polishing pad 10 with high-pressure fluid. Washing the polishing surface with the fluid pressure by the atomizer 34A and dressing the polishing surface, which is mechanical contact, by the dresser 33A result in more preferable dressing, that is, regeneration of the polishing surface. An atomizer generally regenerates a polishing surface after a contact-type dresser (for example, a diamond dresser) dresses the polishing surface.
The second polishing unit 3B similarly includes a polishing table 30B having the polishing pad 10 attached thereon, a top ring 31B, a polishing-liquid supplying nozzle 32B, a dresser 33B, and an atomizer 34B. The third polishing unit 3C similarly includes a polishing table 30C having the polishing pad 10 attached thereon, a top ring 31C, a polishing-liquid supplying nozzle 32C, a dresser 33C, and an atomizer 34C. The fourth polishing unit 3D similarly includes a polishing table 30D having the polishing pad 10 attached thereon, a top ring 31D, a polishing-liquid supplying nozzle 32D, a dresser 33D, and an atomizer 34D.
The pure-water supplying pipe 110 is divided at a point between the first polishing section 3a and the second polishing section 3b. Both ends of the divided pure-water supplying pipe 110 are connected with each other by a connection mechanism (not illustrated). Examples of the use of pure water used in the polishing units include washing of the top rings (for example, washing of the outer peripheral sides of the top rings, washing of the substrate holding surfaces, and washing of the retaining rings), washing of wafer carrying hands (for example, washing of the carrying hands of first and second linear transporters), washing of polished wafers, dressing of the polishing pads, washing of the dressers (for example, washing of the dressing members), washing of the dresser arms, washing of the polishing-liquid supplying nozzles, and washing of the polishing pads by the atomizers.
Pure water is flown into the distribution control parts 113 through the pure-water supplying pipe 110 and distributed to respective use points by the distribution control parts 113. Each use point is a point at which pure water of a nozzle for washing the top rings and a nozzle for washing the dressers is used. Pure water is supplied from the distribution control part 113 to a terminal device such as a washing nozzle (for example, the above nozzle for washing the top ring or the above nozzle for washing the above dresser) that is placed in the polishing unit. For example, pure water the flow rate of which is adjusted by the respective distribution control parts 113 of the polishing units is supplied to the pure-water supplying tubes (not illustrated) of the above polishing-liquid supplying nozzles 32A to 32D, respectively. In this way, the distribution control part 113 is placed in each polishing unit. Accordingly, the number of pipes is smaller than that in the conventional structure in which pure water is supplied from a single header to polishing units through a plurality of pipes. This leads to reduction in number of the connection mechanisms for connecting the pipes between the first polishing section 3a and the second polishing section 3b and results in the simple structure and reduction of risk of leakage of pure water. Since the atomizer needs a lot of pure water, a pure-water supplying pipe 112 for the exclusive use of the atomizer is preferably provided, as illustrated in
Each distribution control part 113 includes a valve box 113a that communicates with the use point of a nozzle for washing the top ring (not illustrated), the pure-water supplying tube (not illustrated) or the like, a pressure gauge 113b that is placed at an upstream side of the valve box 113a, and a flow-rate regulator 113c that is placed at an upstream side of the pressure gauge 113b. The valve box 113a has a plurality of pipes communicating with the corresponding use points and respective valves for the pipes.
The pressure gauge 113b measures the pressure of pure water that is sent to the valve box 113a. The flow-rate regulator 113c adjusts the flow rate of pure water so as to maintain the measured value by the pressure gauge 113b at a predetermined value. In this way, the polishing units independently control the flow rate of pure water. Accordingly, the influence by pure water used among the polishing units can be reduced, thereby stabilizing supply of pure water. Therefore, this solves the problem in the conventional structure that the flow rate of pure water in one polishing unit is made unstable due to pure water used in another polishing unit. Each polishing unit has the flow-rate regulator 113c in the embodiment illustrated in
In the embodiment illustrated in
Similarly to the above distribution control parts 113, each flow-rate control part 114 has a valve, a pressure gauge, and a flow-rate regulator, which are arranged similarly to those in the distribution control part 113. The control part 5 controls the operations of the flow-rate regulators of the flow-rate control parts 114 based on the respective measurement values by the pressure gauges of the flow-rate control parts 114 in such a way that pure water is supplied to the atomizers at respective predetermined flow rates.
As illustrated in
A worker washes the inside of the polishing chamber 300 by using the hand shower gun 40. As illustrated in
The operation handle 46 includes an operation part 460, a handle slide shaft 461, and a mounting part 462. The handle slide shaft 461 is mounted to the mounting part 462 in such a way that the handle slide shaft 461 is slidable in the handle moving direction (the opening/closing direction, or the lateral direction in
The operation handle 46 is connected with the valve 45 through the handle slide shaft 461 to cooperate with the valve 45. A seal member 450 such as an O ring is attached to the valve 45. The seal member 450 prevents leakage of liquid (pure water) from a first flow channel 44A to a second flow channel 44B when the valve 45 is closed.
The hand shower gun 40 in the present embodiment is used for semiconductors (for washing precision devices with pure water). For this reason, the hand shower gun 40 is made of plastic. For example, the liquid contact part (a part that contacts with liquid) is made of polypropylene, fluororubber, or the like to prevent elution of metal ions and generation of rust. The flow channel 44 in the main body 43 and a pipe (a pipe outside the main body 43) such as a liquid supplying tube 47 of the hand shower gun 40 are configured by non-oil-treated products (see
Specific descriptions of the water-hammer reducing mechanism in the present embodiment will be given below. The flow channel 44 in the main body 43 of the hand shower gun 40 is constituted by the first flow channel 44A between the liquid supplying port 41 and the valve 45, the second flow channel 44B between the valve 45 and the liquid jetting port 42, and a third flow channel 44C connecting the first flow channel 44A and the second flow channel 44B without interposing the valve 45.
The water-hammer reducing mechanism in the present embodiment is a pressure relief valve 48 that is provided in the third flow channel 44C. When the valve 45 is closed by the closing operation of the operation handle 46, the pressure relief valve 48 is opened by increase in liquid pressure in the first flow channel 44A to establish communication between the first flow channel 44A and the second flow channel 44B.
In this case, the pressure relief valve 48 is configured to be kept closed by a spring 49 energizing a ball (a valve element) 50. The energizing force (the released pressure by the pressure relief valve 48) by the spring 49 is set to be higher than the normal liquid pressure in the first flow channel 44A. That is, the released pressure by the pressure relief valve 48 is set to be higher than the supplying pressure of liquid (pure water) that is supplied to the flow channel 44 (the pipe). The released pressure by the pressure relief valve 48 is preferably as close to the supplying pressure as possible, and for example, set to 1.05 to 1.2 times of the supplying pressure.
The energizing force (the released pressure by the pressure relief valve 48) by the spring 49 is set to be lower than the breakage generating pressure at which the flow channel 44 is broken by a water hammer phenomenon. That is, the released pressure by the pressure relief valve 48 is set to be lower than the maximum pressure in the pipe at the time of occurrence of a water hammer phenomenon.
As illustrated in
When the communication between the first flow channel 44A and the second flow channel 44B through the third flow channel 44C is established, the liquid pressure in the first flow channel 44A decreases and the energizing pressure by the spring 49 causes the ball (the valve element) 50 to move in the closing direction (the rightward direction in
According to the above substrate processing apparatus in the first embodiment of the present disclosure, when the valve 45 is closed to cause the liquid jetting port 42 of the washing unit (the hand shower gun 40) in the substrate processing apparatus to stop jetting liquid (pure water), the water-hammer reducing mechanism (the pressure relief valve 48) operates. Consequently, damage to the flow channel 44 (the flow channel 44 in the hand shower gun 40, pipes outside the hand shower gun 40) caused by a water hammer phenomenon is reduced so that the lifetime of the substrate processing apparatus is prolonged.
In the present embodiment, when the valve 45 is closed, the pressure relief valve 48 is opened by the liquid pressure in the first flow channel 44A, thereby establishing the communication between the first flow channel 44A and the second flow channel 44B through the third flow channel 44C so that the liquid pressure in the first flow channel 44A is prevented from increasing excessively. Consequently, damage to the flow channel 44 (the flow channel 44 in the hand shower gun 40, pipes outside the hand shower gun 40) caused by a water hammer phenomenon is reduced.
In the present embodiment, since the energizing pressure of the pressure relief valve 48 is lower than the breakage generating pressure, breakage of the flow channel 44 caused by a water hammer phenomenon is prevented. In this case, the energizing pressure of the pressure relief valve 48 is higher than the normal liquid pressure in the first flow channel 44A. Consequently, at the normal time (when no water hammer phenomenon occurs) in which the valve 45 is closed, the pressure relief valve 48 is prevented from being opened to establish the communication between the first flow channel 44A and the second flow channel 44B, thereby preventing liquid from jetting out (leaking) from the liquid jetting port 42.
According to the hand shower gun 40 in the first embodiment of the present disclosure, when the valve 45 is closed by the closing operation of the operation handle 46 to cause the liquid jetting port 42 of the hand shower gun 40 to stop jetting liquid (pure water), the water-hammer reducing mechanism operates. Consequently, damage to the flow channel (the flow channel 44 in the main body 43, pipes outside the main body 43) of the hand shower gun 40 caused by a water hammer phenomenon is reduced so that the lifetime of the hand shower gun 40 is prolonged.
In the present embodiment, when the valve 45 is closed by the closing operation of the operation handle 46, the pressure relief valve 48 is opened by the liquid pressure in the first flow channel 44A, thereby establishing the communication between the first flow channel 44A and the second flow channel 44B through the third flow channel 44C so that the liquid pressure in the first flow channel 44A is prevented from increasing excessively. Consequently, damage to the flow channel 44 (the flow channel 44 in the main body 43, pipes outside the main body 43) caused by a water hammer phenomenon is reduced.
In the present embodiment, since the energizing pressure of the pressure relief valve 48 is lower than the breakage generating pressure, breakage of the flow channel 44 caused by a water hammer phenomenon is prevented. In this case, since the energizing pressure of the pressure relief valve 48 is higher the normal liquid pressure in the first flow channel 44A, at the normal time (when no water hammer phenomenon occurs) in which the valve 45 is closed, the pressure relief valve 48 is prevented from being opened to establish the communication between the first flow channel 44A and the second flow channel 44B, thereby preventing liquid from jetting out (leaking) from the liquid jetting port 42.
In the present embodiment, the hand shower gun 40 is provided with the water-hammer reducing mechanism to reduce damage to the flow channel 44 (the flow channel 44 in the main body 43, pipes outside the main body 43) caused by a water hammer phenomenon.
When the atomizer 34 is provided with the water-hammer reducing mechanism in this way, damage to the flow channel 44 (the flow channel 44 in the atomizer 34, pipes outside the atomizer 34) caused by a water hammer phenomenon is reduced.
Next, descriptions will be given of a substrate processing apparatus in a second embodiment of the present disclosure. Differences between the substrate processing apparatus in the second embodiment and that in the first embodiment will be mainly described. Unless otherwise noted, the configuration and operations in the present embodiment are identical to those in the first embodiment.
In the present embodiment, the configuration in which the fluid resistance of the fourth flow channel 44D is higher than that of the first flow channel 44A is applied as the water-hammer reducing mechanism. For example, when the flow channel area of the fourth flow channel 44D is set to be smaller than that of the first flow channel 44A, the fluid resistance of the fourth flow channel 44D is made higher than that of the first flow channel 44A. Alternatively, when the flow channel length of the fourth flow channel 44D is set to be longer than that of the first flow channel 44A, the fluid resistance of the fourth flow channel 44D is made higher than that of the first flow channel 44A.
As illustrated in
For example, when the adjusting screw 55 of the throttling mechanism 54 is rotated and moved in the throttle direction (the leftward direction in
As illustrated in
The fifth flow channel 44E is provided with a check valve 56. When the valve 45 is opened by the opening operation of the operation handle 46, the check valve 56 is opened by increase in liquid pressure in the first area 52A to establish the communication between the first area 52A and the second area 52B.
In this case, the check valve 56 is configured to be kept closed by a spring 57 energizing a ball (a valve element) 58. The energizing force (the released pressure by the check valve 56) by the spring 57 is set to be higher than the normal liquid pressure in the first area 52A in the cylinder chamber 52. That is, the released pressure by the check valve 56 is set to be higher than the supplying pressure of liquid (pure water) that is supplied to the flow channel 44.
In this case, when the valve 45 is opened by the opening operation of the operation handle 46, increase in liquid pressure in the first area 52A in the cylinder chamber 52 causes the ball (the valve element) 58 to move in the opening direction (the upward direction in
As illustrated in
According to the above substrate processing apparatus in the second embodiment of the present disclosure, effects same as those in the first embodiment are provided. That is, damage to the flow channel 44 (the flow channel 44 in the hand shower gun 40, pipes outside the hand shower gun 40) caused by a water hammer phenomenon is reduced so that the lifetime of the substrate processing apparatus is prolonged.
In the present embodiment, when the valve 45 is closed, liquid (pure water) flows into the cylinder chamber 52 (the first area 52A) from the fourth flow channel 44D with the sliding movement of the piston 51. However, in this case, since the fluid resistance of the fourth flow channel 44D is higher than that of the first flow channel 44A, the flow speed (the inflow rate per unit time) of liquid to the cylinder chamber 52 (the first area 52A) is lowered. Accordingly, the sliding movement speed of the piston 51 is lowered and the closing speed of the valve 45 is lowered. In this way, since the closing speed of the valve 45 is lowered, the liquid pressure in the first flow channel 44A is prevented from increasing excessively when the valve 45 is closed. Consequently, damage to the flow channel 44 (the flow channel 44 in the hand shower gun 40, pipes outside the hand shower gun 40) caused by a water hammer phenomenon is reduced.
In the present embodiment, since the fluid resistance of the fourth flow channel 44D is adjustable, the moving speed of the piston 51 (that is, the closing speed of the valve 45) can be adjusted appropriately.
In the present embodiment, when the valve 45 is opened, the check valve 56 is opened by the liquid pressure in the first area 52A in the cylinder chamber 52, thereby establishing the communication between the first area 52A and the second area 52B through the fifth flow channel 44E so that liquid is allowed to move from the first area 52A to the second area 52B. Consequently, the liquid pressure is prevented from blocking the sliding movement of the piston 51 to allow the smooth sliding movement of the piston 51.
According to the hand shower gun 40 in the second embodiment of the present disclosure, effects same as those in the first embodiment are provided. That is, damage to the flow channel 44 (the flow channel 44 in the main body 43, pipes outside the main body 43) of the hand shower gun 40 caused by a water hammer phenomenon is reduced so that the lifetime of the hand shower gun 40 is prolonged.
In the present embodiment, when the valve 45 is closed by the closing operation of the operation handle 46, liquid flows into the cylinder chamber 52 (the first area 52A) from the fourth flow channel 44D with the sliding movement of the piston 51. However, in this case, since the fluid resistance of the fourth flow channel 44D is higher than that of the first flow channel 44A, the flow speed (the inflow rate per unit time) of liquid to the cylinder chamber 52 (the first area 52A) is lowered. Accordingly, the sliding movement speed of the piston 51 is lowered and the closing speed of the valve 45 is lowered. In this way, since the closing speed of the valve 45 is lowered, the liquid pressure in the first flow channel 44A is prevented from increasing excessively when the valve 45 is closed. Consequently, damage to the flow channel (the flow channel 44 in the main body 43, pipes outside the main body 43) caused by a water hammer phenomenon is reduced.
In the present embodiment, since the fluid resistance of the fourth flow channel 44D is adjustable, the moving speed of the piston 51 (that is, the closing speed of the valve 45) can be adjusted appropriately.
In the present embodiment, when the valve 45 is opened by the opening operation of the operation handle 46, the check valve 56 is opened by increase in liquid pressure in the first area 52A of the cylinder chamber 52, thereby establishing the communication between the first area 52A and the second area 52B through the fifth flow channel 44E so that liquid is allowed to move from the first area 52A to the second area 52B. Consequently, the liquid pressure is prevented from blocking the sliding movement of the piston 51 to allow the smooth sliding movement of the piston 51. In this way, the opening operation of the operation handle 46 can be performed smoothly.
When the atomizer 34 is provided with the water-hammer reducing mechanism in this way, damage to the flow channel 44 (the flow channel 44 in the atomizer 34, pipes outside the atomizer 34) caused by a water hammer phenomenon is reduced.
Next, descriptions will be given of a substrate processing apparatus in a third embodiment of the present disclosure. Differences between the substrate processing apparatus in the third embodiment and that in the second embodiment will be mainly described. Unless otherwise noted, the configuration and operations in the present embodiment are identical to those in the second embodiment.
As the water-hammer reducing mechanism in the present embodiment, the configuration in which the fluid resistance of the fourth flow channel 44D is higher than that of the first flow channel 44A is applied. For example, when the flow channel area of the fourth flow channel 44D is set to be smaller than that of the first flow channel 44A, the fluid resistance of the fourth flow channel 44D is made higher than that of the first flow channel 44A.
As illustrated in
As in the second embodiment, the fifth flow channel 44E is provided with the check valve 56. When the valve 45 is opened by the opening operation of the operation handle 46, the check valve 56 is opened by increase in liquid pressure in the first area 52A to establish the communication between the first area 52A and the second area 52B.
In this case, the closed state of the check valve 56 is configured to be kept closed by the spring 57 energizing the ball (the valve element) 58. The energizing pressure (the released pressure by the check valve 56) by the spring 57 is set to be higher than the normal liquid pressure in the first area 52A in the cylinder chamber 52. That is, the released pressure by the check valve 56 is set to be higher than the supplying pressure of liquid (pure water) that is supplied to the flow channel 44 (the pipe).
In this case, when the valve 45 is opened by the opening operation of the operation handle 46, increase in liquid pressure in the first area 52A in the cylinder chamber 52 causes the ball (the valve element) 58 to move in the opening direction (the upward direction in
As illustrated in
According to the above substrate processing apparatus in the third embodiment of the present disclosure, effects same as those in the second embodiment are provided. That is, damage to the flow channel 44 (the flow channel 44 in the hand shower gun 40, pipes outside the hand shower gun 40) caused by a water hammer phenomenon is reduced so that the lifetime of the substrate processing apparatus is prolonged.
According to the hand shower gun 40 in the third embodiment of the present disclosure, effects same as those in the second embodiment are provided. That is, damage to the flow channel 44 (the flow channel 44 in the main body 43, pipes outside the main body 43) of the hand shower gun 40 caused by a water hammer phenomenon is reduced so that the lifetime of the hand shower gun 40 is prolonged.
When the atomizer 34 is provided with the water-hammer reducing mechanism in this way to reduce damage to the flow channel 44 (the flow channel 44 in the atomizer 34, pipes outside the atomizer 34) caused by a water hammer phenomenon.
Embodiments of the present disclosure have been exemplified above. However, the scope of the present disclosure is not limited to the above embodiments and appropriate variations and modifications are possible within the scope of the claims.
In the above descriptions, the water-hammer reducing mechanism is provided in the hand shower gun or the atomizer. However, the water-hammer reducing mechanism may be provided in a washing unit other than the hand shower gun and the atomizer. Liquid is not limited to pure water or ultrapure water and may be other washing liquid.
As described above, a substrate processing apparatus according to the present disclosure provides an effect that damage caused by a water hammer phenomenon is reduced. The substrate processing apparatus is useful and may be used as a substrate polishing device or the like, for example.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2015-045278 | Mar 2015 | JP | national |
| 2015-049896 | Mar 2015 | JP | national |
This is a division of U.S. patent application Ser. No. 15/060,368 filed Mar. 3, 2016, which claims the benefit of Japanese Patent Application No. 2015-045278 filed Mar. 6, 2015, and Japanese Patent Application No. 2015-049896 filed Mar. 12, 2015, each of which is incorporated herein by reference in its entirety.
| Number | Date | Country | |
|---|---|---|---|
| Parent | 15060368 | Mar 2016 | US |
| Child | 16019824 | US |
