1. Field of the Invention
Embodiments of the present invention generally relate to a lift mechanism for controlling the position of a substrate support in a processing chamber.
2. Description of the Related Art
Many semiconductor processing operations, for example, chemical vapor deposition, physical vapor deposition and etch, among others, are performed in a vacuum environment. Typically, a substrate is positioned on a movable substrate support disposed within a processing chamber. The elevation of the substrate support is controlled by a lift mechanism so that the substrate may be disposed at a lower position within the processing chamber to facilitate substrate transfer and an elevated position that typically enhances substrate processing. As the spacing between the top of the processing chamber and the substrate seated on the substrate support may be 200 mils or closer when in the elevated position, the parallelism between the top of the processing chamber and the substrate support is a major attribute in maintaining process uniformity across the width of the substrate and ensuring process repeatability between substrates. For example, if one edge of the substrate is closer to the top of the processing chamber than another edge of the substrate, gases flowing between the substrates and the top of the processing chamber will be inclined to disadvantageously flow predominantly through the portion of the gap having the widest spacing, resulting in process non-uniformity across the width of the substrate. Additionally, variations in the distance between the substrate and the top of the processing chamber will typically result in process non-uniformity in plasma enhanced processes. As the intensity of the plasma formed between the substrate and the top of the processing chamber is dependent on the strength of the electrical field defined between the substrate support and the top of the processing chamber, which in turn is dependent on the distance between the substrate support and the top of the processing chamber. If this distance is not uniform, the plasma will not be uniform across the width of the substrate support and will contribute to process non-uniformity. Additionally, in the extreme cases, if the plane of the substrate support is not orientated perpendicular to the center line of the chamber, the plane of a wafer supported thereon may be skewed relative to the plane of operation of a transfer robot utilized to transfer the substrate to and from the processing chamber. In such instances, the end effector of the transfer robot may inadvertently collide with the substrate, causing particular generation and possibly knocking the substrate out of alignment. Moreover, if the lift pin mechanism is not parallel with the substrate support, the lift pins utilized to space the substrate from the substrate support may not extend uniformly through the substrate support, thereby causing the substrate to be supported in a skewed position that may lead to damage during transfer with the transfer robot as described above.
Typically, most substrate supports are coupled to their lift mechanisms by a mechanism in a manner that allows for the plane of the substrate support to be adjusted perpendicular to the center line of the processing chamber. However, many of the adjustment mechanisms utilized to level the substrate support are difficult to secure in a desired position. Furthermore, most adjustment mechanisms do not provide against drift during the securing procedures that is detrimental to systems requiring close parallelism tolerancing.
A disadvantage of such a clamping arrangement 800 is that a clamp screw 812 utilized to clamp hole 804 around the shaft 806 imparts a tangential force upon the shaft 802, thus exerting a rotational moment upon the substrate support 810 as shown by arrow 814. Thus, as the substrate support 810 is being clamped into position, the clamping force, tangential to the shaft 806, causes the parallelism of the substrate support 810 to disadvantageously draft away from a predefined, desired position.
Therefore, there is a need for an apparatus for controlling the position of a substrate support.
An apparatus for positioning a substrate support within a processing chamber is provided. In one embodiment, an apparatus for positioning a substrate support includes a yoke comprising a curved surface with a first slot formed therethrough, a base comprising a first surface adapted to support the substrate support and a curved second surface, wherein the curved second surface mates with the curved surface of the yoke and a first slot is formed through the curved second surface of the base, and a first threaded member disposed through the first slot in the yoke and the first slot in the base.
A more particular description of the invention, briefly summarized above, may be had by reference to the embodiments thereof that are illustrated in the appended drawings. It is to be noted, however, that the appended drawings illustrate only typical embodiments of this invention and are therefore not to be considered limiting of its scope, for the invention may admit to other equally effective embodiments.
To facilitate understanding, identical reference numerals have been used, wherever possible, to designate identical elements that are common to the figures.
The processing chamber 100 typically includes sidewalls 106 and a bottom 108 that support a lid 110 to define an interior volume 112 of the processing chamber. The processing chamber 100 is typically fabricated from a monolithic block of aluminum or welded from stainless steel plates. At least one wall 108 of the processing chamber 100 includes a substrate access port 114 to facilitate entry and egress of substrates from the processing chamber 100.
An exhaust port 146 is typically disposed in the sidewalls 106 or bottom 108 of the processing chamber 100 and is coupled to a pumping system 148. The pumping system 148 generally includes various pumping components such as throttle valves and turbomolecular pumps to evacuate and maintain the interior volume 112 of the processing chamber 100 at a predefined pressure during processing.
The lid 110 of the processing chamber 100 is typically removable to allow access to the interior volume 112 of the processing chamber 100. A showerhead 116 is coupled to an interior side 118 of the lid 110 to facilitate uniform distribution of process gases within the processing chamber 100 and across the surface of a substrate 120 positioned on the substrate support 104 during processing. One example of suitable showerhead is described in U.S. patent application Ser. No. 09/603,117, filed Jun. 22, 2000, which is hereby incorporated by reference in its entirety.
A gas source 122 is typically coupled to the processing chamber 100 to provide process and other gases to the interior volume 112. In one embodiment, the lid 110 includes an inlet 124 through which process and/or other gases are provided from the gas source 122 to a plenum defined between the showerhead 116 and the interior surface 112 of the lid 110. The plenum allows the process and other gases provided into the interior volume 112 of the processing chamber 100 to spread across the backside of the showerhead 116, thereby enhancing uniformity of gas distribution through the showerhead 116 and across the substrate 120.
The substrate support 104 is disposed in the interior volume 112 of the processing chamber 100 and may be controlled in elevation along a central axis 150 between a processing position approximate the showerhead 116 and a lower transfer position aligned with the access port 114. The substrate support 104 may be a susceptor, heater, vacuum chuck, an electrostatic chuck or other platform for supporting the substrate 120 during processing or transfer. The substrate support 104 may be fabricated from ceramic, aluminum, stainless steel or other materials compatible with processing temperatures and chemistries. Two examples of substrate supports which may be adapted to benefit from the invention are described in U.S. patent application Ser. No. 09/596,854, filed Jun. 19, 2000 and U.S. patent application Ser. No. 10/055,634, filed Jan. 22, 2002, both of which are hereby incorporated by reference in their entireties.
The substrate support 104 has an upper surface 126 that supports the substrate 120 and an opposing lower surface 128 facing the chamber bottom 108. A plurality of holes 130 (one is shown in
The second end 136 of the lift pins 132 may be selectively actuated by a lift pin actuation mechanism 138. The lift pin actuation mechanism 138 displaces the second end 136 of the lift pins 132 toward the lower surface 128 of the substrate support 104, thereby causing the flared first end 134 of the lift pins 132 to project above the upper surface 126 to space the substrate 120 from the substrate support 104. One lift pin mechanism that may be adapted to benefit from the invention is described in U.S. patent Ser. No. 09/698,814 filed Oct. 26, 2000, which is hereby incorporated by reference in its entirety.
A stem 140 is disposed through an aperture 142 formed in the bottom 108 of the processing chamber 100 and connects the substrate support 104 to the substrate support lift mechanism 102. The stem 140 is typically hollow and/or includes passages formed therethrough to facilitate coupling of power leads, sensors, control lines, fluid lines and other utilities (not shown) from the substrate support 104 to the exterior of the processing chamber 100. A bellows 144 is typically provided circumscribing the stem 140 to provide a flexible seal that facilitates elevation control of the substrate support 104 without vacuum leakage from the interior volume 112 of the processing chamber 100.
The substrate support lift mechanism 102 is configured to allow the substrate support 104 to be adjusted along five axes and typically includes an actuator 160, a bearing assembly 162 and a gimbal assembly 164. In one embodiment, the bearing assembly 162 is coupled to the exterior side of the chamber bottom 108. The gimbal assembly 164 is coupled between the stem 140 and the bearing assembly 162 and is driven by the actuator 160 to control the elevation of the substrate support 104.
The bearing assembly 162 includes a rectangular frame 202 and at least two carriage blocks 204, 206. The rectangular frame 202 has a first end 208 adapted for coupling to the chamber bottom 108 separated from a second end 210 by two longitudinal members 212. A center member 244 is coupled between the two longitudinal members 212 to form a c-section. The center member 244 provides geometrical stability of the two longitudinal members 212. The center member 244 includes a plurality of mounting holes 242 through which the plurality of fasteners 234 pass through and thread into a threaded hole 238 formed in the mounting flange 232 of the mounting bracket 230.
The facing surfaces of the longitudinal members include bearing surfaces 218 between which the carriage blocks 204, 206 ride. The bearing surfaces 218 may be an integral part of the longitudinal members 212 or may alternatively be a separate outer race of a bearing that facilitates movement of the blocks 204, 206 along the frame 202.
The bearing surfaces 218 and the carriage blocks 204, 206 form the inner and outer race for a plurality of bearings (not shown) disposed between the carriage blocks 204, 206 and the frame 202. The bearings may be ball, pin or tapered and are typically captured to recirculate about each carriage block 204, 206. Each carriage block 204, 206 includes a plurality of mounting holes 220 to facilitate coupling the bearing assembly 162 to the gimbal assembly 164. In the embodiment depicted in
The actuator 160 is typically mounted to the second end 210 of the frame 202 but may alternatively be mounted in other configurations that allow the actuator 160 to control the position of the carriage blocks 204, 206 relative to the frame 202. The actuator 160 may be an electric motor, air motor, pneumatic cylinder, hydraulic cylinder, solenoid, ball screw, lead screw or other motion device adapted to control the linear position of the carriage blocks 204, 206. The actuator 160 is coupled to a controller 222 that controls the actuator's motion. In the embodiment depicted in
One or more sensors 228 are typically coupled to the substrate support lift assembly 102 to provide positional feedback to the controller 222 indicative of the elevation of the substrate support 104 within the processing chamber 100. The sensors 228 may include LVDT sensors, proximity sensors, read switches, Halifax switches, proximity switches, limit switches, motor encoders and the like. In the embodiment depicted in
The clamp block 302 includes a clamping aperture 314 formed therein. The clamping aperture 314 is adapted to receive a post 318 extending from the yoke 304 to secure the orientation of the yoke 304 within the clamp block 302 while allowing axial and rotational adjustment of the post 318 relative to the clamping aperture 314.
In the embodiment depicted in
To further prevent torque generation during clamping that could cause the yoke 304 to rotate relative to the clamp block 302, a clamping surface 424 of the plunger 406 may be configured to contact the post 318 at two locations. For example, the clamping surface 424 of the plunger 406 may include a “V” configuration, a step, depression, a radius or a curved surface configured to mate with the post 318 at least two locations equidistance from the center.
Returning to
Each mounting flange 334, 336 includes an upper side 342 and a lower side 344 separated by facing inner lateral sides 346. The lateral sides 346 of the adjacent mounting flanges 334, 336 define a space between the mounting flanges 334, 336 configured to allow routing of the various conduits and wires routed out of the stem 140.
In one embodiment, the upper side 342 of each flange 334, 336 is curved to facilitate adjusting the orientation of the gimbal base 306 seated on the mounting flange 334, 336. In the embodiment depicted in
Each mounting flange 334, 336 includes a slot 350 formed therethrough between the upper and lower sides 342, 344. The slot 350 is configured to accept a fastener or stud 352 extending from the gimbal base 306. A clamping block 354 is typically disposed on the portion of the stud 352 extending through the lower side 344 of the mounting flanges 334, 336. A nut 356 is threaded onto each of the studs 352 and may be tightened to urge a bottom surface 370 of the gimbal base 306 against the upper side 342 of the mounting flanges 334, 336. A contact surface 358 of the clamping block 354 typically is configured with the same radius as the lower side 344 of the mounting flanges 334, 336 to maintain axial tension on the studs 352 that substantially eliminates lateral drift of the studs 352 along the lower side 344 of the mounting flanges 334, 336 as the nuts 356 are tightened. Advantageously, this arrangement for coupling the gimbal base 306 to the yoke 304 allows the support surface of the substrate support 104 to be adjusted about an axis 348 perpendicular to the central axis of the yoke 304 and secured in that position without inducing any lateral forces on the stud that could compromise the parallelism of the substrate support 104 and the showerhead 116.
Referring additionally to
In one embodiment, the lift pin actuation mechanism 138 includes a lift plate 602 coupled by an actuation rod 606 to an actuator assembly 608. In order to minimize deflection between the lift plate 602 and rod 606, the mating surfaces of the lift plate 602 and rod 606 include a plurality of mating wedge-shaped keys 614, 616 (seen in
The rod 606 extends through an aperture 610 formed in the bottom 108 of the process chamber 100 and is coupled to the actuator assembly 608. A bellows 612 is typically disposed around the rod 606 to provide a flexible seal between the processing chamber 100 and the pin lift actuation mechanism 138 to prevent leakage into the chamber while facilitating actuation of the lift pins 132.
The actuator assembly 608 is typically coupled between the rod 606 and the chamber bottom 108 to control the elevation of the lift plate 602 and lift pins 132. The actuator assembly 608 may include solenoids, gear motors or other actuator suitable for controllably actuating the shaft in an axial direction. In one embodiment, the actuation assembly 608 is similar to the bearing assembly and actuator described above.
A spar 630 is utilized to couple the rod 606 to the actuator assembly 608. The spar is typically fabricated from aluminum or other suitably rigid material. The spar 630 includes a mounting side 632 and an opposing lower side 638 separated by first and second lateral sides 634, 636. The mounting side 632 of the spar 630 is coupled to the rod 606 by a plurality of fasteners 640. The second lateral side 636 is typically coupled to a bearing assembly 644 of the actuator assembly 608. The lower side 638 may include a chamfer 642 at the junction of the first lateral side 634 and the lower side 638.
The lateral sides 634, 636 are typically longer than the mounting side 632 to minimize deflection of the actuation mechanism 138 due to vacuum forces acting upon the annular plate 602 disposed within the chamber 100. To further stiffen the spar 630, the lower side 638 typically extends from the second lateral side 636 beyond a center line 618 of the rod 606 before the chamfer 642. As the rigidity of the spar 630 is superior to conventional L-shaped brackets commonly used in conventional designs, the reduced deflection of the lift pin actuation mechanism 138 enhances the planarity between the plate 602 and the substrate support 104, thereby allowing the substrate 102 to retain its parallelism to the substrate support 104 when spaced therefrom by the lift pins 132 displaced by the plate 602.
As discussed above, maintaining the parallelism between the lid 110 and the upper support surface 126 of the substrate support 104 is important for maintaining process uniformity and repeatability. The invention also improves the parallelism of the substrate 120 when spaced from the substrate support 104 that minimizes particular generation or wafer damage during robotic wafer exchange. In one aspect of the invention, the substrate support lift assembly 102 experiences reduced tortional deflection when the substrate support 104 is exposed to a vacuum within the processing chamber 100. In another aspect of the invention, the spaced bearing surfaces of the carriage blocks 204, 206 maintains parallelism of the substrate support 104 to the lid 110 as the substrate support 104 is moved between the elevated and lowered position. Additionally, the dual carriage blocks 204, 206 minimize deflection of the lift 102 thereby maintaining the desired planar orientation of the substrate support 104 when the substrate support 104 is subjected to vacuum forces. In another aspect of the invention, the lift pin actuation mechanism 138 is configured to minimize deflection under vacuum loading of the lift mechanism 138 to enable simultaneous contact and substantially equal displacement of the lift pins, resulting in enhanced parallelism of the substrate and substrate support when spaced apart to facilitate wafer exchange with a robotic mechanism while minimizing the probability of inadvertent wafer to robot contact due to misalignment and/or deflection issues.
While the foregoing is directed to the preferred embodiment of the present invention, other and further embodiments of the invention may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.
This application is a continuation of U.S. patent application Ser. No. 10/387,619, filed Mar. 12, 2003, now abandoned which is herein incorporated by reference.
Number | Name | Date | Kind |
---|---|---|---|
202473 | Rowell | Apr 1878 | A |
309438 | Carleton | Dec 1884 | A |
539796 | Close | May 1895 | A |
1100504 | Taft | Jun 1914 | A |
1104666 | Harris | Jul 1914 | A |
1173289 | McKee et al. | Feb 1916 | A |
1550651 | Charter | Aug 1925 | A |
2499146 | Kindt | Feb 1950 | A |
2619215 | Guss | Nov 1952 | A |
2921326 | Lautmann | Jan 1960 | A |
2972493 | Waters | Feb 1961 | A |
3582116 | Young | Jun 1971 | A |
3876174 | Culver | Apr 1975 | A |
4058430 | Suntola et al. | Nov 1977 | A |
4389973 | Suntola et al. | Jun 1983 | A |
4413022 | Suntola et al. | Nov 1983 | A |
4415275 | Dietrich | Nov 1983 | A |
4607974 | Brothers et al. | Aug 1986 | A |
4629321 | Hart et al. | Dec 1986 | A |
4761269 | Conger et al. | Aug 1988 | A |
4834831 | Nishizawa et al. | May 1989 | A |
4891087 | Davis et al. | Jan 1990 | A |
4975252 | Nishizawa et al. | Dec 1990 | A |
4993357 | Scholz | Feb 1991 | A |
5027746 | Frijlink | Jul 1991 | A |
5173327 | Sandhu et al. | Dec 1992 | A |
5178681 | Moore et al. | Jan 1993 | A |
5225366 | Yoder | Jul 1993 | A |
5261959 | Gasworth | Nov 1993 | A |
5281274 | Yoder | Jan 1994 | A |
5292393 | Maydan et al. | Mar 1994 | A |
5294286 | Nishizawa et al. | Mar 1994 | A |
5338362 | Imahashi | Aug 1994 | A |
5374570 | Nasu et al. | Dec 1994 | A |
5441703 | Jurgensen | Aug 1995 | A |
5443647 | Aucoin et al. | Aug 1995 | A |
5462603 | Murakami | Oct 1995 | A |
5480818 | Matsumoto et al. | Jan 1996 | A |
5483919 | Yokoyama et al. | Jan 1996 | A |
5503875 | Imai et al. | Apr 1996 | A |
5558717 | Zhao et al. | Sep 1996 | A |
5562947 | White et al. | Oct 1996 | A |
5634757 | Schanz | Jun 1997 | A |
5674786 | Turner et al. | Oct 1997 | A |
5711811 | Suntola et al. | Jan 1998 | A |
5730802 | Ishizumi et al. | Mar 1998 | A |
5762544 | Zuniga et al. | Jun 1998 | A |
5796066 | Guyot | Aug 1998 | A |
5796116 | Nakata et al. | Aug 1998 | A |
5804042 | Ferreira et al. | Sep 1998 | A |
5807792 | Ilg et al. | Sep 1998 | A |
5835677 | Li et al. | Nov 1998 | A |
5848670 | Salzman | Dec 1998 | A |
5855680 | Soininen et al. | Jan 1999 | A |
5860640 | Marohl et al. | Jan 1999 | A |
5868847 | Chen et al. | Feb 1999 | A |
5879128 | Tietz et al. | Mar 1999 | A |
5879459 | Gadgil et al. | Mar 1999 | A |
5900062 | Loewenhardt et al. | May 1999 | A |
5916365 | Sherman | Jun 1999 | A |
5951775 | Tepman | Sep 1999 | A |
5972430 | DiMeo, Jr. et al. | Oct 1999 | A |
6001234 | Batz, Jr. et al. | Dec 1999 | A |
6015590 | Suntola et al. | Jan 2000 | A |
6042652 | Hyun et al. | Mar 2000 | A |
6071572 | Mosely et al. | Jun 2000 | A |
6089723 | Ogasawara et al. | Jul 2000 | A |
6102164 | McClintock et al. | Aug 2000 | A |
6120609 | Selyutin et al. | Sep 2000 | A |
6139700 | Kang et al. | Oct 2000 | A |
6146504 | Patadia et al. | Nov 2000 | A |
6168668 | Yudovsky | Jan 2001 | B1 |
6174377 | Doering et al. | Jan 2001 | B1 |
6183563 | Choi et al. | Feb 2001 | B1 |
6197683 | Kang et al. | Mar 2001 | B1 |
6200893 | Sneh | Mar 2001 | B1 |
6213478 | Nishikawa | Apr 2001 | B1 |
6231672 | Choi et al. | May 2001 | B1 |
6270572 | Kim et al. | Aug 2001 | B1 |
6302965 | Umotoy et al. | Oct 2001 | B1 |
6305314 | Sneh et al. | Oct 2001 | B1 |
6306216 | Kim et al. | Oct 2001 | B1 |
6447607 | Soininen et al. | Sep 2002 | B2 |
6454860 | Metzner et al. | Sep 2002 | B2 |
6478872 | Chae et al. | Nov 2002 | B1 |
6481945 | Hasper et al. | Nov 2002 | B1 |
6511368 | Halley | Jan 2003 | B1 |
6511539 | Raaijmakers | Jan 2003 | B1 |
6548112 | Hillman et al. | Apr 2003 | B1 |
6551406 | Kilpi | Apr 2003 | B2 |
6572705 | Suntola et al. | Jun 2003 | B1 |
6578287 | Aswad | Jun 2003 | B2 |
6579372 | Park | Jun 2003 | B2 |
6593484 | Yasuhara et al. | Jul 2003 | B2 |
6609909 | Aoki et al. | Aug 2003 | B2 |
6630030 | Suntola et al. | Oct 2003 | B1 |
6630201 | Chiang et al. | Oct 2003 | B2 |
6660126 | Nguyen et al. | Dec 2003 | B2 |
6716287 | Santiago et al. | Apr 2004 | B1 |
6718126 | Lei | Apr 2004 | B2 |
6734020 | Lu et al. | May 2004 | B2 |
6772072 | Ganguli et al. | Aug 2004 | B2 |
6773507 | Jallepally et al. | Aug 2004 | B2 |
6777352 | Tepman et al. | Aug 2004 | B2 |
6778762 | Shareef et al. | Aug 2004 | B1 |
6815285 | Choi et al. | Nov 2004 | B2 |
6818094 | Yudovsky | Nov 2004 | B2 |
6821563 | Yudovsky | Nov 2004 | B2 |
6866746 | Lei et al. | Mar 2005 | B2 |
6868859 | Yudovsky | Mar 2005 | B2 |
6881437 | Ivanov et al. | Apr 2005 | B2 |
6902624 | Seidel et al. | Jun 2005 | B2 |
6921062 | Gregg et al. | Jul 2005 | B2 |
20010000866 | Sneh et al. | May 2001 | A1 |
20010009140 | Bondestam et al. | Jul 2001 | A1 |
20010011526 | Doering et al. | Aug 2001 | A1 |
20010013312 | Soininen et al. | Aug 2001 | A1 |
20010014371 | Kilpi | Aug 2001 | A1 |
20010042523 | Kasala | Nov 2001 | A1 |
20010042799 | Kim et al. | Nov 2001 | A1 |
20010054377 | Lindfors et al. | Dec 2001 | A1 |
20020000196 | Park | Jan 2002 | A1 |
20020007790 | Park | Jan 2002 | A1 |
20020009544 | McFeely et al. | Jan 2002 | A1 |
20020009896 | Sandhu et al. | Jan 2002 | A1 |
20020011204 | Gujer et al. | Jan 2002 | A1 |
20020017242 | Hamaguchi et al. | Feb 2002 | A1 |
20020041931 | Suntola et al. | Apr 2002 | A1 |
20020052097 | Park | May 2002 | A1 |
20020066411 | Chiang et al. | Jun 2002 | A1 |
20020073924 | Chiang et al. | Jun 2002 | A1 |
20020076481 | Chiang et al. | Jun 2002 | A1 |
20020076507 | Chiang et al. | Jun 2002 | A1 |
20020076508 | Chiang et al. | Jun 2002 | A1 |
20020086106 | Park et al. | Jul 2002 | A1 |
20020092471 | Kang et al. | Jul 2002 | A1 |
20020094689 | Park | Jul 2002 | A1 |
20020104481 | Chiang et al. | Aug 2002 | A1 |
20020108570 | Lindfors | Aug 2002 | A1 |
20020110991 | Li | Aug 2002 | A1 |
20020115886 | Yasuhara et al. | Aug 2002 | A1 |
20020121241 | Nguyen et al. | Sep 2002 | A1 |
20020121312 | Lubomirsky et al. | Sep 2002 | A1 |
20020121342 | Nguyen et al. | Sep 2002 | A1 |
20020127745 | Lu et al. | Sep 2002 | A1 |
20020134307 | Choi | Sep 2002 | A1 |
20020144655 | Chiang et al. | Oct 2002 | A1 |
20020144657 | Chiang et al. | Oct 2002 | A1 |
20020146511 | Chiang et al. | Oct 2002 | A1 |
20030004723 | Chihara | Jan 2003 | A1 |
20030010451 | Tzu et al. | Jan 2003 | A1 |
20030017697 | Choi et al. | Jan 2003 | A1 |
20030022338 | Ruben et al. | Jan 2003 | A1 |
20030042630 | Babcoke et al. | Mar 2003 | A1 |
20030053799 | Lei | Mar 2003 | A1 |
20030057527 | Chung et al. | Mar 2003 | A1 |
20030072913 | Chou et al. | Apr 2003 | A1 |
20030075273 | Kilpela et al. | Apr 2003 | A1 |
20030075387 | Wang et al. | Apr 2003 | A1 |
20030075925 | Lindfors et al. | Apr 2003 | A1 |
20030079686 | Chen et al. | May 2003 | A1 |
20030089308 | Raaijmakers | May 2003 | A1 |
20030101927 | Raaijmakers et al. | Jun 2003 | A1 |
20030101938 | Ronsse et al. | Jun 2003 | A1 |
20030106490 | Jallepally et al. | Jun 2003 | A1 |
20030113187 | Lei et al. | Jun 2003 | A1 |
20030116087 | Nguyen et al. | Jun 2003 | A1 |
20030121469 | Lindfors et al. | Jul 2003 | A1 |
20030121608 | Chen et al. | Jul 2003 | A1 |
20030140854 | Kilpi | Jul 2003 | A1 |
20030143328 | Chen et al. | Jul 2003 | A1 |
20030143747 | Bondestam et al. | Jul 2003 | A1 |
20030153177 | Tepman et al. | Aug 2003 | A1 |
20030172872 | Thakur et al. | Sep 2003 | A1 |
20030194493 | Chang et al. | Oct 2003 | A1 |
20030198740 | Wendling | Oct 2003 | A1 |
20030198754 | Xi et al. | Oct 2003 | A1 |
20030213560 | Wang et al. | Nov 2003 | A1 |
20030216981 | Tillman | Nov 2003 | A1 |
20030219942 | Choi et al. | Nov 2003 | A1 |
20030221780 | Lei et al. | Dec 2003 | A1 |
20030224107 | Lindfors et al. | Dec 2003 | A1 |
20030235961 | Metzner et al. | Dec 2003 | A1 |
20040005749 | Choi et al. | Jan 2004 | A1 |
20040011404 | Ku et al. | Jan 2004 | A1 |
20040011504 | Ku et al. | Jan 2004 | A1 |
20040013577 | Ganguli et al. | Jan 2004 | A1 |
20040014320 | Chen et al. | Jan 2004 | A1 |
20040015300 | Ganguli et al. | Jan 2004 | A1 |
20040016404 | Gregg et al. | Jan 2004 | A1 |
20040025370 | Guenther | Feb 2004 | A1 |
20040065255 | Yang et al. | Apr 2004 | A1 |
20040069227 | Ku et al. | Apr 2004 | A1 |
20040071897 | Verplancken et al. | Apr 2004 | A1 |
20040144308 | Yudovsky | Jul 2004 | A1 |
20040144311 | Chen et al. | Jul 2004 | A1 |
20040177813 | Schieve et al. | Sep 2004 | A1 |
20040203254 | Conley, Jr. et al. | Oct 2004 | A1 |
20040219784 | Kang et al. | Nov 2004 | A1 |
20040224506 | Choi et al. | Nov 2004 | A1 |
20040235285 | Kang et al. | Nov 2004 | A1 |
20040253375 | Ivanov et al. | Dec 2004 | A1 |
20050006799 | Gregg et al. | Jan 2005 | A1 |
20050059240 | Choi et al. | Mar 2005 | A1 |
20050064207 | Senzaki et al. | Mar 2005 | A1 |
20050070126 | Senzaki | Mar 2005 | A1 |
20050095859 | Chen et al. | May 2005 | A1 |
20050104142 | Narayanan et al. | May 2005 | A1 |
20050153571 | Senzaki | Jul 2005 | A1 |
20050233156 | Senzaki et al. | Oct 2005 | A1 |
20050255243 | Senzaki | Nov 2005 | A1 |
Number | Date | Country |
---|---|---|
0 284 343 | Sep 1988 | EP |
0 497 267 | Jan 1992 | EP |
0 592 017 | Apr 1994 | EP |
1 005 063 | May 2000 | EP |
1 167 569 | Jan 2002 | EP |
1 202 330 | May 2002 | EP |
1202330 | May 2002 | EP |
58-098917 | Jun 1983 | JP |
04-291916 | Sep 1992 | JP |
05-206036 | Aug 1993 | JP |
05-234899 | Sep 1993 | JP |
05-270997 | Oct 1993 | JP |
06-124520 | May 1994 | JP |
06-224138 | May 1994 | JP |
07-176472 | Jul 1995 | JP |
05-047666 | Feb 1996 | JP |
2000-319772 | Mar 2000 | JP |
2001-020075 | Nov 2000 | JP |
2000-212752 | Nov 2002 | JP |
WO 9617107 | Jun 1996 | WO |
WO 9901595 | Jan 1999 | WO |
WO 9931299 | Jun 1999 | WO |
WO 9965064 | Dec 1999 | WO |
WO 0054320 | Sep 2000 | WO |
WO 0079576 | Dec 2000 | WO |
WO 0117692 | Mar 2001 | WO |
WO 0136702 | May 2001 | WO |
WO 0208488 | Jan 2002 | WO |
WO 0245871 | Jun 2002 | WO |
WO 03023835 | Mar 2003 | WO |
WO 2004008491 | Jan 2004 | WO |
Number | Date | Country | |
---|---|---|---|
20060240542 A1 | Oct 2006 | US |
Number | Date | Country | |
---|---|---|---|
Parent | 10387619 | Mar 2003 | US |
Child | 11426555 | US |