SUBSTRATE TREATMENT SYSTEM, SUBSTRATE TREATMENT METHOD, AND COMPUTER READABLE STORAGE MEDIUM

Abstract

In the present invention, a plurality of heat treatment plates are provided side by side in a linear form on a base of a heat treatment apparatus in a coating and developing treatment system. In the heat treatment apparatus, three transfer member groups are provided which transfer a substrate in zones between adjacent heat treatment plates. At the time when performing a pre-baking treatment in the heat treatment apparatus, the substrate is transferred in order to the heat treatment plates at the same temperature, whereby the heat treatment is dividedly performed on the heat treatment plates. According to the present invention, substrates are subjected to heat treatment along the same route, so that the thermal histories are made uniform among the substrates.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan view showing the outline of a configuration of a coating and developing treatment system according to the present embodiment;

FIG. 2 is a front view of the coating and developing treatment system;

FIG. 3 is a rear view of the coating and developing treatment system;

FIG. 4 is a plan view showing the outline of a configuration of a heat treatment apparatus;

FIG. 5 is a longitudinal sectional view of a base and a heat treatment plate;

FIG. 6 is an explanatory view showing a configuration of a transfer member;

FIG. 7 is a longitudinal sectional view of a base for explaining transfer of a wafer from a first heat treatment plate to a second heat treatment plate;

FIG. 8 is a longitudinal sectional view of the base for explaining transfer of the wafer from the second heat treatment plate to a third heat treatment plate;

FIG. 9 is a longitudinal sectional view of the base for explaining transfer of the wafer from the third heat treatment plate to a fourth heat treatment plate;

FIG. 10 is a plan view of the heat treatment apparatus in the case in which the positions of the transfer members are changed;

FIG. 11 is a plan view of the heat treatment apparatus in which a plurality of grooves are provided;

FIG. 12 is a perspective view of the inside of the heat treatment apparatus in the case using transfer members having wire portions;

FIG. 13 is an explanatory view of a transverse section showing a configuration inside a holding portion of the transfer member;

FIG. 14 is a plan view of the heat treatment apparatus;

FIG. 15 is a longitudinal sectional view of a base and a heat treatment plate for explaining transfer of the wafer from the first heat treatment plate to the second heat treatment plate;

FIG. 16 is a schematic view of a heat treatment apparatus in the case in which the heat treatment plate is divided;

FIG. 17 is a schematic view of the heat treatment apparatus showing a division pattern of the heat treatment plate;

FIG. 18 is a schematic view of the heat treatment apparatus showing a division pattern of the heat treatment plate;

FIG. 19 is a schematic view showing the outline of a heat treatment apparatus in which heat treatment units are arranged in the vertical direction;

FIG. 20 is a perspective view showing a configuration of the first heat treatment potion;

FIG. 21 is a perspective view showing a configuration of the second heat treatment unit;

FIG. 22 is a perspective view of the first heat treatment unit and the second heat treatment unit, showing the state in which the heat treatment plate is moved;

FIG. 23 is a front view of a coating and developing treatment system in which a resist coating apparatus having a plurality of treatment units is installed;

FIG. 24 is a longitudinal sectional view showing the outline of a resist coating apparatus;

FIG. 25 is an explanatory view of a transverse section showing the outline of the configuration of the resist coating apparatus;

FIG. 26 is a rear view of a coating and developing treatment system in which developing treatments apparatus having a plurality of treatment units are installed;

FIG. 27 is a longitudinal sectional view showing the outline of a configuration of a developing treatment apparatus; and

FIG. 28 is an explanatory view of a transverse section showing the outline of a configuration of the developing treatment apparatus.

Claims

1. A substrate treatment system for forming a resist pattern on a substrate, comprising at least a coating treatment apparatus for applying a resist solution to the substrate, a developing treatment apparatus for performing a developing treatment for the substrate, and a heat treatment apparatus for performing a heat treatment for the substrate, wherein at least any of said coating treatment apparatus, developing treatment apparatus, and heat treatment apparatus includes a plurality of treatment units for dividedly performing the treatment.

2. The substrate treatment system as set forth in claim 1, further comprising: a substrate transfer mechanism for transferring the substrate to said plurality of treatment units in a predetermined order, and capable of successively transferring a plurality of substrates in said plurality of treatment units.

3. The substrate treatment system as set forth in claim 1, wherein said treatment apparatus including said plurality of treatment units comprises a coating treatment apparatus, andwherein said coating treatment apparatus has a discharge treatment unit for discharging the resist solution onto the substrate, a spread treatment unit for rotating the substrate to spread the resist solution over the substrate, and a drying treatment unit for drying the substrate.

4. The substrate treatment system as set forth in claim 3, wherein said drying treatment unit has a function of removing the resist solution at a peripheral portion of the substrate.

5. The substrate treatment system as set forth in claim 1, wherein said treatment apparatus including said plurality of treatment units comprises a developing treatment apparatus, andwherein said developing treatment apparatus has a developing solution supply treatment unit for supplying a developing solution onto the substrate, a cleaning solution supply treatment unit for supplying a cleaning solution onto the substrate, and a drying treatment unit for drying the substrate.

6. The substrate treatment system as set forth in claim 1, wherein said treatment apparatus including said plurality of treatment units comprises a heat treatment apparatus, andwherein said heat treatment apparatus has a plurality of heat treatment units for heating the substrate at the same temperature.

7. A substrate treatment method for forming a resist pattern on a substrate, comprising at least a coating treatment of applying a resist solution to the substrate, a substrate developing treatment, and a substrate heat treatment, wherein at least any of said coating treatment, developing treatment, and heat treatment is performed by transferring the substrate in order to a plurality of treatment units where the treatment is dividedly performed.

8. The substrate treatment method as set forth in clam 7, wherein the treatment dividedly performed in the plurality of treatment units comprises the coating treatment, andwherein, in the coating treatment, a discharge treatment of discharging the resist solution onto the substrate, a spread treatment of rotating the substrate to spread the resist solution over the substrate, and a drying treatment of drying the substrate are performed in the respective treatment units.

9. The substrate treatment method as set forth in clam 8, wherein a treatment of removing the resist solution at a peripheral portion of the substrate is performed in the treatment unit for performing the drying treatment.

10. The substrate treatment method as set forth in clam 7, wherein said treatment dividedly performed in the plurality of treatment units comprises the developing treatment, andwherein, in the developing treatment, a developing solution supply treatment of supplying a developing solution to the substrate, a cleaning solution supply treatment of supplying a cleaning solution onto the substrate, and a drying treatment of drying the substrate are performed in the respective treatment units.

11. The substrate treatment method as set forth in clam 7, wherein the treatment dividedly performed in the plurality of treatment units comprises the heat treatment, andwherein the heat treatment is performed in a plurality of heat treatment units for heating the substrate at the same temperature.

12. A computer readable storage medium storing a computer program when performing treatments for a substrate using a substrate treatment system, wherein said treatment for the substrate comprises at least a coating treatment of applying a resist solution to the substrate, a substrate developing treatment, and a substrate heat treatment, andwherein at least any of said coating treatment, developing treatment, and heat treatment is performed by transferring the substrate in order to a plurality of treatment units where the treatment is dividedly performed.