Patent Application
20080000675
The present invention can be more easily understood and further advantages and uses thereof more readily apparent, when considered in view of the description of the following figures in which:
Like reference numbers and designations in the various drawings indicate like elements.
In the following detailed description, reference is made to the accompanying drawings that form a part hereof, and in which is shown by way of illustration specific illustrative embodiments in which the invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention, and it is to be understood that other embodiments may be utilized and that logical, mechanical and electrical changes may be made without departing from the scope of the present invention. It should be understood that the exemplary method illustrated may include additional or fewer steps or may be performed in the context of a larger processing scheme. Furthermore, the method presented in the drawing figures or the specification is not to be construed as limiting the order in which the individual steps may be performed. The following detailed description is, therefore, not to be taken in a limiting sense.
Embodiments of the present invention protect surface mounted components from damage due to vibration during operation. This is accomplished by providing support devices coupled to surface mounted components and the printed wiring board. In addition, the support devices are adapted to provide an additional benefit of transferring heat away from the surface mounted components and to the printed wiring board, in some embodiments. As used herein, “vibration environments” includes, but is not limited to, random vibration, sinusoidal vibration, and shock.
In describing
In this exemplary embodiment, connectors 110 are thermally conductive epoxy. However, in other embodiments, connectors 110 are comprised of other materials. For example, in one embodiment, solder pads are placed on component 102 and PWB 106 so that metal solder is used for connectors 110. In addition, support devices 108-1 and 108-2 are made of metal in this example. In particular, support devices 108-1 and 108-2, in this example, are made of aluminum. However, it is to be understood that in other embodiments, other metals are used, such as copper, silver, etc. By using a thermally conductive epoxy and metal braces, embodiments of the present invention are also able to conduct heat away from component 102 and into PWB 106 via connectors 110 and support devices 108-1 and 108-2. However, it is not required to use a thermally conductive metal for support devices 108-1 and 108-2 or a thermally conductive epoxy for connectors 110.
With regards to the shape of support devices 108-1 and 108-2, as can be seen in the example in
Support devices 208-3 and 208-4 are made of metal in this example. In particular, support devices 208-3 and 208-4, in this example, are made of aluminum. However, it is to be understood that in other embodiments, other metals are used, such as copper, silver, etc. By using a thermally conductive epoxy and metal braces, embodiments of the present invention are also able to conduct heat away from component 202 via connectors 210. However, it is not required to use a thermally conductive metal for support devices 208-3 and 208-4 or a thermally conductive epoxy for connectors 210.
As with support devices 108-1 and 108-2 in
Support devices 308-5 and 308-6 are made of metal in this example. In particular, support devices 308-5 and 308-6, in this example, are made of aluminum. However, it is to be understood that in other embodiments, other metals are used, such as copper, silver, etc. By using a thermally conductive epoxy and metal braces, embodiments of the present invention are also able to conduct heat away from component 302 via connectors 310. However, it is not required to use a thermally conductive metal for support devices 308-5 and 308-6 or a thermally conductive epoxy for connectors 310. In addition, as can be seen in
As with support devices 108-1 and 108-2, support device 308-6 also limits movement of component 302 along the X axis. Support device 308-5 aids in impeding movement of component 302 via its connection to component 302 and PWB 306 with connectors 310. The strength of this aid is based in part on the shearing and adhesive strength of connectors 310. In addition, support device 308-5 is adapted with extension 318. Extension 318 enables support device 308-5 to make contact with component 302 without contacting leads 304. In this way, support device 308-5 is able to be placed on sides of component 302 having leads 304. In this example, support device 308-5 limits movement of component 302 along the Y axis. However, in other embodiments, support devices on other sides of component 302 are also adapted with extension 318. For example, in some embodiments, component 302 is a quad flat package (QFP) with leads 304 extending from all four sides of component 302. In such embodiments, extension 318 is used with each support device to make contact with component 302 without contacting leads 304. Finally, as shown in
In addition, coupling at least one support device to the surface mounted component includes coupling at least one support device on two or more sides of the component, in some embodiments. For example, in one embodiment, two shorter support devices are coupled on one side of a component to reduce the weight that is used by one longer support device. Coupling a support device to a surface mounted component also includes, in some embodiments, coupling a support device such that the support device overlaps one or more edges of the surface mounted component (see support devices 208-3 and 208-4 in
Although specific embodiments have been illustrated and described herein, it will be appreciated by those of ordinary skill in the art that any arrangement, which is calculated to achieve the same purpose, may be substituted for the specific embodiment shown. This application is intended to cover any adaptations or variations of the present invention. Therefore, it is manifestly intended that this invention be limited only by the claims and the equivalents thereof.
