Technique for writing with a raster scanned beam

Information

  • Patent Grant
  • 6828570
  • Patent Number
    6,828,570
  • Date Filed
    Monday, April 1, 2002
    22 years ago
  • Date Issued
    Tuesday, December 7, 2004
    19 years ago
Abstract
Provided is a technique for generating patterns with a raster scanned beam in a photolithographic system that employs a multiple blank position flash cycle. In accordance with one embodiment of the present invention, a beam creates a shadow of a first aperture that impinges upon a region of a stop, referred to as a first blank position. The beam is deflected so that the shadow of the first aperture moves along a first direction to a flash position, in which a portion thereof superimposes a second aperture located in the stop. To complete the flash cycle, the beam is deflected so that shadow of the first aperture impinges upon a second region of the stop, referred to as second blank position. As a result, during the flash cycle, the beam is deflected in one direction to impinge upon two different blank positions.
Description




BACKGROUND OF THE INVENTION




The present invention relates generally to pattern generation systems. More specifically, the present invention relates to a column in a lithographic pattern generation system that employs a raster scanned beam writing technique.





FIG. 1

shows an exemplary prior art column


10


employed in a photolithographic pattern generation system that includes a high brightness electron source


12


such as a ZrO Schottky emission cathode with extraction energy of 10 kV. Source


12


produces an electron beam


14


that is directed along a path


16


. Disposed in path


16


are a focusing lens


18


, a first stop


20


, a second stop


22


and an objective lens


24


. First stop


20


includes a square aperture


20




a


that lies in path


16


, and second stop


22


includes a rectangular aperture


22




a


that lies in path


16


. Disposed between first stop


20


and second stop


22


is a first deflector


26


. A second deflector


28


is disposed between second stop


22


and objective lens


24


.




Lens


18


may be a series of magnetic lenses or electrostatic lenses and is used to focus electrons in beam


14


to pass through square aperture


20




a


. First deflector


26


deflects beam


14


through an angle θ


d


with respect to second aperture


22




a


, systematically allowing a portion of beam


14


to propagate through objective lens


24


, discussed more fully below.




Objective lens


24


defines an object plane


30


located between first deflector


26


and second deflector


28


, proximate to second stop


22


. Although object plane


30


is shown positioned between first deflector


26


and second stop


22


, object plane


30


may be positioned between second deflector


28


and second stop


22


. Objective lens


24


images object plane


30


onto an image plane


32


. Beam


14


impinges upon image plane


32


as a shadow, as opposed to a focused image, of the overlay of square aperture


20




a


and rectangular aperture


22




a


. With this configuration, the area of the shadow impinging upon image plane


32


is determined by the focus of objective lens


24


instead of image magnification. The area of the shadow may be much smaller than the physical size of either first aperture


20




a


or second aperture


22




a


, and its size may be adjusted by varying the distance between the cathode crossover


16




a


and object plane


30


. Positioned in object plane


30


is a substrate


36


, upon which a pattern is written.




When writing a pattern, it is desireable to provide the highest quality pattern in a minimum amount of time, which is expressed in terms of the pattern coverage rate (R). R specifies the pattern area exposed per second of writing time. R is normally expressed having the dimensions of square centimeters per second (cm


2


/sec). Thus, it is desireable to employ a pattern writing technique having a high R.




One such pattern writing technique is described by Rishton et al. in


Raster shaped beam pattern generation


J. Vac. Sci. Tech. B17:6, p. 2927 (1999) and employs a graybeam data format to specify a fraction of patterned area within each pixel on a regular grid. The pixel grid is further partitioned into a flash grid, where flash sites include four graybeam data pixels in a 2×2 array. The beam is scanned periodically over the substrate. An exposure amplitude retrograde scan is added to the uniform saw tooth raster scan, so that the beam appears to dwell on each area of exposure for approximately 10 nsec. At each exposure, the pattern is composed using a shaped beam, allowing edges to be positioned on an address grid that is much finer than the pixel grid. The size and shape of the beam is derived from a 4×4 pixel array of graybeam data surrounding the exposure area. The exposure time is varied between about 30%-80% of the exposure cycle time to correct for proximity scattering and other dose error effects.




Pattern exposure is controlled as a function of the flashing and blanking of beam


14


. The flash is a portion of the pattern written in image plane


32


during one cycle of an exposure sequence by the presence of beam


14


in image plane


32


. The blank is the absence of beam


14


in image plane


32


.




Referring to both

FIGS. 1 and 2

, a flash occurs when first deflector


26


deflects beam


14


so that a shadow of square aperture


20




a


superimposes a portion of rectangular aperture


22




a


, referred to as a flash position


34


. A blank occurs when second deflector


28


deflects beam


14


so that no portion of the shadow of square aperture


20




a


superimposes rectangular aperture


22




a


, referred to as a blank position


36


. First deflector


26


systematically flashes and blanks beam


14


in accordance with the pattern to be written.




Referring to

FIGS. 1 and 3

, a prior art blanking technique is shown. At the commencement of the flash cycle, the shadow of square aperture


20




a


impinges upon the surface of stop


22


, referred to as blank position


40


. During the flash cycle, beam


14


is deflected so that the shadow of square aperture


20




a


moves along a first direction to a flash position


42


, in which a portion


44


thereof superimposes rectangular aperture


22




a


. At the end of the flash cycle, the shadow of the square aperture returns to blank position


40


. To that end, beam


14


is deflected so that the shadow of square aperture


20




a


moves along a second direction, opposite to the first direction.




A drawback with this blanking technique is that it results in an undesirable “shutter” effect, due to the limited bandwidth and settling time of the deflection drive electronics. Specifically, beam


14


impinges upon regions of substrate


36


that should not be exposed when proceeding to the final position. In addition, the presence of a single blanking position, such as blank position


40


, results in regions of substrate


36


being exposed longer to beam


14


than other regions. The net result is a non-uniform dose distribution that causes errors in both the location and size of pattern features.




Referring to

FIGS. 1 and 4

, shown is another prior art blanking technique for an alternate embodiment of stop


122


. Stop


122


includes four apertures


122




a


,


122




b


,


122




c


and


122




d


. Beam


14


is deflected so that the shadow of square aperture


20




a


moves back and forth in opposite directions when traveling between a blank position


140


and a flash position


142


. The choice of aperture


122




a


,


122




b


,


122




c


and


122




d


selected for a flash position depends upon the shape of the region on the substrate to be exposed. This depends upon the relationship between pattern features to be written and the flash grid. As discussed above with respect to

FIG. 2

, this blanking technique also results in non-uniform dose distribution.




What is needed, therefore, is a blanking technique that provides improved dose uniformity.




SUMMARY OF THE INVENTION




Provided is technique for generating patterns with a photolithographic system that employs a multiple blank position flash cycle. In accordance with one embodiment of the present invention, a beam, creates a shadow of a first aperture that impinges upon a region of a stop, referred to as a first blank position. The beam is deflected so that the shadow of the first aperture moves along a first direction A to a flash position, in which a portion thereof superimposes a second aperture that is located in the stop. To complete the flash cycle, the beam is deflected so that the shadow of the aperture impinges upon a second region of the stop, referred to as a second blank position. As a result, during the flash cycle, the beam is deflected in one direction to impinge upon two different blank positions. During a subsequent flash cycle, the beam moves the shadow of the first aperture along a second direction, which is opposite to first direction. In this manner, the shadow of the aperture moves from blank position and impinges upon the aperture of the second stop. Thereafter, the beam is deflected to move the shadow of the first aperture of the first stop, along the second direction, from impinging upon the second aperture located in the stop to impinge upon the first blank position.











BRIEF DESCRIPTION OF THE DRAWINGS





FIG. 1

is simplified plan view of a prior art raster shaped beam lithographic pattern generation system;





FIG. 2

is a perspective view showing the deflection of a beam with respect to a stop, shown above in FIG.


1


and in accordance with the prior art;





FIG. 3

is a top down view of the stop shown above in

FIG. 2

demonstrating a prior art blanking technique;





FIG. 4

is a top down view of a multi-aperture stop demonstrating a prior art blanking technique;





FIG. 5

is a top down view of the stop shown above in

FIG. 2

demonstrating a blanking technique in accordance with the present invention;





FIG. 6

is a graphical representation showing the dose-uniformity in a region of a substrate employing the blanking technique discussed with respect to

FIG. 5

;





FIG. 7

is a graphical representation showing the dose-uniformity in a region of a substrate employing the blanking technique discussed with respect to

FIG. 3

;





FIG. 8

is a graphical representation showing the dose-uniformity in a region of a substrate employing the blanking technique discussed with respect to

FIG. 4

;





FIG. 9

is a top down view of a stop demonstrating a multiple flash blanking technique in accordance with one embodiment of the present invention and employing the prior art raster shaped beam lithographic pattern generation system discussed above with respect to

FIG. 1

;





FIG. 10

is a top down view of a stop demonstrating a multiple flash blanking technique in accordance with one embodiment of the present invention and employing the multi-aperture stop discussed above with respect to

FIG. 3

;





FIG. 11

is a top down view of a stop demonstrating a multiple flash blanking technique incorporated into the blanking technique discussed above with respect to FIG.


5


and in accordance with the present invention;





FIG. 12

is a plan view of a raster scan beam illumination system that may be employed to practice any of the blanking techniques discussed with respect to

FIGS. 3

,


4


,


5


,


9


,


10


and


11


, in accordance with the present invention; and





FIG. 13

is side view of an array of the illumination system shown in

FIG. 12

, in accordance with the present invention.











DETAILED DESCRIPTION OF INVENTION




Referring to

FIGS. 1 and 5

, a top down view of a blanking technique in accordance with one embodiment of the present invention using second stop


22


is shown. As shown in

FIG. 5

, during a flash cycle, beam


14


creates a shadow of square aperture


20




a


that impinges upon a region of second stop


22


, referred to as a first blank position


45


. Beam


14


is deflected so that the shadow of square aperture


20




a


moves along a first direction A to a flash position in which a portion


46


thereof superimposes rectangular aperture


22




a


. To complete the flash cycle, beam


14


is deflected so that shadow of square aperture


20




a


impinges upon a second region of stop


22


, referred to as second blank position


47


. As a result, during the flash cycle, beam


14


is deflected in one direction to impinge upon two different blank positions


45


and


47


. During a subsequent flash cycle, beam


14


is deflected to move the shadow of square aperture


20




a


along a second direction, which is opposite to first direction A. In this manner, the shadow of square aperture


20




a


moves from blank position


47


and impinges upon aperture


22




a


. Thereafter, beam


14


is deflected to move the shadow of square aperture


20




a


, along the second direction, from impinging upon square aperture


20




a


to impinge upon blank position


45


. Again, during the flash cycle, beam


14


is deflected in one direction to impinge upon two different blank positions


45


and


47


.




Referring to

FIG. 6

, the aforementioned blanking technique minimizes the “shutter effect” in high-speed raster scanning beam (RSB) pattern generation systems. As shown by curves


48


, the dose applied to a region of a substrate to generate line patterns is substantially uniform. The substantially planar shape of the upper portions of curves


48


demonstrates the uniformity. This results from beam


14


having one of two states: stationary or moving in one direction, which precludes beam


14


from retracing an area twice during a flash cycle.




Referring to

FIGS. 6

,


7


and


8


, curves


50


and


52


show the dose-uniformity provided by the blanking techniques discussed above with respect to

FIGS. 3 and 4

, respectively. As seen by comparing the upper portions


50




a


and


52




a


of curves


50


and


52


, respectively, with upper portion


48




a


, the dose uniformity represented by curve


48


is superior.




For flashes that cover only a fraction of a flash site on substrate


36


, beam


14


passes over un-patterned areas of substrate


36


while moving towards a flash site, leaving some residual dose error in these areas. These errors appear as uniformly dosed areas within the gaps, and underexposed areas within the pattern. Adjustment of the flash dwell time in accordance with the flash area compensates for these uniformity errors. For example, the shoulders on the line and gap profiles may be compensated by slightly increasing the dose of partial area flashes, leaving the dose at the middle of the steps at the level necessary to produce the correct line or gap width in the developed resist on substrate


36


. This may be done in the flash composition logic by modifying dose according to flash size and type.




Referring to

FIGS. 1 and 9

, to facilitate formation of orthogonal pattern shapes and shapes that extend obliquely with respect to a scan direction, a multiple flash blanking technique is demonstrated. In one embodiment of the multiple flash blanking technique, the shadow of square aperture


20




a


impinges upon the surface of stop


22


, referred to as blank position


40


. During the flash cycle, beam


14


is deflected so that the shadow of square aperture


20




a


moves along a first trajectory


40




a


to a flash position in which a portion


40




b


thereof superimposes rectangular aperture


22




a


at first flash position


50


. The definition of trajectory, in this case, includes the angle and direction of travel of the shadow. Thereafter, beam


14


is deflected so that the shadow of square aperture


20




a


moves along a second trajectory


50




a


to a second flash position


52


in which a portion


50




b


thereof superimposes rectangular aperture


22




a


. In this manner, the flash site defined by flash positions


50


and


52


result in a region of substrate


36


being exposed. The area of the region is an “L” shape of the appropriate area and size to compose the 2×2 pixel flash site.




At the end of the flash cycle, the shadow of the square aperture returns to blank position


40


. Although the two aforementioned trajectories


40




a


and


50




a


are different, it should be noted that movement is along a common direction to reach the two flash positions. It should be noted, however, the two aforementioned trajectories


40




a


and


50




a


may be identical. Alternatively, the two aforementioned trajectories


40




a


and


50




a


may have differing directions, but a common angle or differing directions and differing angles of movement.




Referring to

FIGS. 1 and 10

, a multiple flash blanking technique is shown in which the aforementioned trajectories of beam


14


to each flash position have differing directions and differing angles of movement, with respect to a multi-aperture stop


122


having four apertures


122




a


,


122




b


,


122




c


and


122




d


present. Beam


14


is deflected so that the shadow of square aperture


20




a


moves along a first trajectory


140




a


from blank position


140


to a first flash position


150


. In the first flash position


150


, a portion


140




b


of the shadow of aperture


20




a


superimposes one of the apertures, shown here as aperture


122




a


. Thereafter, beam


14


is deflected to move along a second trajectory


150




a


from flash position


150


to have a portion


150




b


of the shadow of aperture


20




a


superimpose a second flash position


158


. In the second flash position


158


, the shadow of aperture


20




a


superimposes aperture


122




b


. However, it should be understood that flash position


150


and second flash position


158


may be in a common aperture. Thereafter, beam


14


is deflected to move the shadow of aperture


20




a


along a third trajectory


159


to blank position


140


. As before, the area of the two flashes exposed on a substrate defines an “L” shape of the appropriate area and size to compose the 2×2 pixel flash site.




Referring to

FIGS. 1 and 11

, a top down view of a multiple flash blanking technique in accordance with another embodiment of the present invention using second stop


22


is shown. During a flash cycle, beam


14


creates a shadow of square aperture


20




a


that impinges upon a first blank position


45


. Beam


14


is deflected so that the shadow of square aperture


20




a


moves along a trajectory


58


to a first flash position


60


so that a portion


45




a


of the shadow superimposes rectangular aperture


22




a


. Thereafter, beam


14


is deflected so that the shadow of square aperture


20




a


moves along a trajectory


62


to a second flash position


64


. In second flash position, a portion


60




a


of the shadow of square aperture superimposes rectangular aperture


22




a


. To complete the flash cycle, beam


14


is deflected so that shadow of square aperture


20




a


impinges upon a second region of stop


22


, referred to as second blank position


65


. As a result, during the flash cycle, beam


14


is deflected in one direction to impinge upon two different blank positions


45


and


65


, and moves in an opposite direction, as discussed above with respect to

FIG. 5

, to provide one or more flashes before reaching blank position


45


.




In the aforementioned multiple flash blanking technique, less time is available to expose each of the two flashes, compared to a single flash blanking technique. A maximum flash exposure time of about 60% of the flash cycle is used, so that the beam has time to return to its blanking site between flashes. When two flashes are needed to expose an “L” shaped area, the cycle is increased to 80%, and each of the flashes usually last no more than 40% of the cycle. This may leave interior corners slightly under-dosed. Fortunately, additional dose scatters into an interior corner from surrounding flashes, so it may be desirable to under-dose regions (not shown) of substrate


36


in which orthogonal patterns are formed. In this manner, the associated dose error is not as significant as might otherwise be expected. Alternatively, the current of beam


14


may be increased so that no more than 40% of a flash cycle is needed to expose any flash. In either case, if sufficient current is available, an “L” shaped flash may be composed without reducing throughput.




Referring to

FIG. 12

, shown is a column


110


that may be employed in a raster shaped beam lithographic pattern generation system to practice the blanking techniques discussed above, with respect to

FIGS. 3

,


4


,


5


,


9


,


10


and


11


. As shown in

FIG. 12

, column


110


is designed to generate patterns on a substrate


136


employing a single stage deflector to deflect a shadow projection of a beam having energy in the range of 0.5-1.0 kV. To that end, column


110


includes an electron source, such as a focusing electrode


112


and an extractor


113


to direct a beam


114


of electrons along a path


116


. A focusing lens assembly


118


is disposed in path


116


. A first stop


120


, having a first aperture


120




a


, and a second stop


222


, having a second aperture


222




a


are disposed in path


116


. An objective lens assembly


124


is disposed in path


116


, with first and second stops


120


and


222


being positioned between objection lens assembly


124


and focus lens assembly


118


. A shaping deflector


126


is positioned in path between first and second stops


120


and


222


. Objective lens assembly


124


defines an object plane


130


, with deflector


126


lying in object plane


130


.




Cathode


112


may be any e-beam source in the art, one example of which is ZrO Schottky emission cathode with extraction energy of 10 keV, an effective source diameter of about 20 nm, an angular intensity of about 1 mA/sr, and a brightness of about 3×10


8


A/sq.cm/sr. Beam


114


passes through focus lens assembly


118


, which is a stack of aligned electrodes biased to about −8 kV. An exemplary focus lens assembly


118


may be a decelerating Einzel lens, focusing an image of cathode


112


in a drift space between cathode source


112


and objective lens assembly


124


. Specifically, aperture


120




a


provides the portion of beam


114


propagating therethrough with a square cross-section. The cathode image, referred to as crossover


135


, is focused at a point along path


116


located between first stop


120


and objective lens assembly


124


.




Deflector


126


is located proximate to object plane


130


and causes beam


114


to move transversely to path


116


systematically blanking and flashing the shape of aperture


120




a


with respect to second stop


222


. The portion of beam


114


passing through second aperture


222




a


has a shape that corresponds to the shape comprising the superimposition of first and second apertures


120




a


and


222




a.






The portion of beam


114


passing through first and second apertures


120




a


and


222




a


enters objective lens assembly


124


and forms a much smaller shadow projection, onto image plane


132


, compared to the area of the resulting shapes defined by the superimposition of first and second aperture


120




a


and


222




a


. Cross-over


135


is positioned proximate to image plane


132


allowing the shadow of the aperture


120




a


to be positioned upon aperture


222




a


without shifting the shadow of aperture


120




a


on image plane


132


and, therefore, substrate


136


. A shield


142


having an aperture


142




a


disposed therein is positioned between lens


133


and image plane


132


. Shield


142


prevents electrons backscattering off of substrate


136


from reaching lens


133


. To that end, shield


142


is biased to −9 kV.




Objective lens assembly


124


is a stack of aligned electrodes biased to about −15 kV. An exemplary objective lens assembly


124


may include either a triode or a tetrode cathode lens. One such lens is described by Chmelik et al. in


Comparing cathode lens configurations for low energy electron microscopy


, Optik 83, 1 p. 155 (1989). Were a tetrode lens employed, then an intermediate retarding field lens, shown as


133


, may be disposed between objective lens assembly


124


and image plane


132


. Lens


133


is biased to a level of about −7 kV and functions to focus beam


114


before entering the decelerating region just above the image plane


132


where substrate


136


is positioned. An intermediate anode (not shown) is typically employed with a tretrode objective lens to slow beam


114


in two stages. The anode (not shown) may provide stronger focusing by operating the same in an accelerating mode with a positive potential. In both cases, beam


114


traverses most of the beam path at about 10-kV extraction energy, and is decelerated from about −10 kV to the final beam energy of 0.5 to 1 kV in a very short region just above image plane


132


. To provide retroscan and beam position offset, a separate deflection system


139


may be positioned proximate to second stop


222


, between second stop and objective lens assembly


124


.




An appropriate arrangement might provide aperture


142




a


with a 300 um diameter, spaced about 100 um from the surface of substrate


136


. To maximize the scan field size, it is desirable to minimize the disturbance of the electric field distribution near the substrate. Accordingly, the aperture should be thin. For example were the distance between lens


133


and image plane


132


approximately 3 mm, and the distance between the aperture


142




a


and image plane


132


, 0.1 mm, then the aperture would be biased {fraction (1/30)} of the way between substrate and second anode potential.




Column


110


is configured so that aperture


222




a


is larger than aperture


120




a


. By properly positioning object plane


130


, the shadow of aperture


120




a


formed by beam


114


does not move in image plane


132


, and the shadow formed by aperture


222




a


moves within a flash area defined by first aperture


120




a


. Further, the area of the beam at the image plane


132


depends upon a distance between crossover


135


and object plane


130


, which in this embodiment, is defined by the focal length of focus lens assembly


118


. The use of a single deflection device, such as deflector


126


, with limited drive voltage is afforded by maintaining beam energy in the drift space between focus lens


118


and objective lens assembly


124


to be approximately −10 kV. This allows much larger shape deflection angle Θ


d


using the limited shaper drive voltage. With higher drive voltages, this configuration could also be used in higher voltage pattern generation systems, as well as electrostatic focusing.




Referring to

FIGS. 12 and 13

, typically column


110


is employed in a system


300


as an array of columns. Although any number of columns may be present in the array, one example of the present invention includes a 4×2 array of columns, four of which are shown as


310




a


,


310




b


,


310




c


and


310




d


, which include extractor systems


340




a


,


340




b


,


340




c


and


340




d


. Also included with columns


310




a


,


310




b


,


310




c


and


310




d


are shaper drive modules


342




a


,


342




b


,


342




c


and


342




d


, respectively.




System


300


includes a gun lens assembly


341


and an objective lens apparatus


344


, each of which consists of a stack of aligned electrodes. Included within gun lens assembly


341


is a focus lens assembly


118


. Included within objective lens apparatus


344


are objective lens assembly


124


,


133


and shield


142


. The gun lens assembly


341


is arranged with respect to extractors systems


340




a


,


340




b


,


340




c


and


340




d


to allow a beam (not shown) to propagate along a path


316




a


,


316




b


,


316




c


and


316




d


, respectively, and impinge upon shaper drive modules


342




a


,


342




b


,


342




c


and


342




d


, respectively. Objective lens apparatus


344


is arranged so that the beam (not shown) propagating from shaper drive modules


342




a


,


342




b


,


342




c


and


342




d


impinges upon image plane


332


where a substrate (not shown) is positioned. Specifically, image plane


332


lies proximate to a stage assembly


345


. Stage assembly


345


includes a sub-stage


345




a


upon which the substrate is disposed (not shown). Stage


345


moves along in the plane of

FIG. 13

, thereby facilitating movement between the array of columns


310




a


,


310




b


,


310




c


and


310




d


and the substrate (not shown).




Operation of system


300


is regulated by control electronics


350


, which includes a processor and power supply, which provide the deflection and dynamic correction signals to the deflection plates and movement of stage


345


. Columns


310




a


,


310




b


,


310




c


and


310




d


may be driven in common to minimize the number of fast, high voltage scan drive amplifiers.




Although the invention has been described in terms of specific embodiments, one skilled in the art will recognize that various modifications may be made that are within the scope of the present invention. For example, any shaped aperture may be employed in the stops mentioned above and the exposure region, although being described as being L-shaped, may be any shape desired. Therefore, the scope of the invention should not be based upon the foregoing description. Rather, the scope of the invention should be determined based upon the claims recited herein, including the full scope of equivalents thereof.



Claims
  • 1. A method for writing a pattern on a substrate by systematically blanking and flashing a beam along a path employing a stop having an aperture disposed therein, said method comprising:impinging said beam upon a first region of said stop, defining a first blank position; moving said beam, along a first direction, from said first blank position to a flash position located within said aperture; moving said beam, along said first direction, from said flash position to impinge upon a second region of said stop, defining a second blank position; and wherein said first direction is transverse to said path.
  • 2. The method as recited in claim 1 further including moving said beam, along a second direction transverse to said path, opposite to said first direction, from said second position to propagate through said aperture, after moving said beam to impinge upon said second blank position, and repeatably moving said beam to successively impinge upon said first and second blank position to have said beam periodically propagate through said aperture.
  • 3. The method as recited in claim 1 further including moving said beam, after impinging said beam upon said first blank position and before moving said beam to impinge upon said second blank position, to impinge upon an additional flash position.
  • 4. The method as recited in claim 3 wherein said stop includes additional apertures, with said additional flash position on said stop being located within differing apertures.
  • 5. The method as recited in claim 3 wherein said beam moves along a common trajectory when moving from said first blank position to impinge upon said flash position and moving from said flash position to impinge upon said additional flash position.
  • 6. The method as recited in claim 3 wherein said beam moves along a first trajectory from said first blank position to impinge upon said flash position and along a second trajectory from said flash position to impinge upon said additional flash position, with said first trajectory being different from said second trajectory.
  • 7. The method as recited in claim 1 further including providing a beam source and an additional stop, disposed between said stop and said beam source, with said additional stop including an additional aperture which superimposes said aperture, with said stop and said additional stop being disposed between said beam source and said substrate, with said beam propagating through said aperture having a cross-sectional area with a shape of said cross-sectional area being defined by a superimposition of said aperture and said additional aperture.
  • 8. The method as recited in claim 7 wherein said cross-sectional area has an “L” shape.
  • 9. The method as recited in claim 2 further including having said aperture superimpose an area of said substrate to be exposed, wherein said flash position is defined, wherein repeatably moving said beam further includes moving said substrate with respect to said beam while periodically propagating said beam through said aperture to expose a plurality of said flash positions on said substrate.
  • 10. A method for writing a pattern on a substrate by systematically blanking and flashing a beam along a path, produced by a beam source, employing first and second stops, disposed between said beam source and said substrate, with each of said stops having an aperture associated therewith defining first and second apertures, respectively, said method comprising:impinging said beam upon a first region of said second stop, defining a first blank position; moving said beam, along a first direction, from said first blank position to a flash position located within said second aperture, with said beam propagating through said second aperture having a cross-sectional area, a shape of which being defined by a superimposition of said first and second apertures; moving said beam, along said first direction, from said flash position to impinge upon a second region of said second stop, defining a second blank position; moving said beam, along a second direction, opposite to said first direction, from said second blank position to propagate through said second aperture, after moving said beam to impinge upon said second blank position, and repeatably moving said beam to successively impinge upon said first and second blank positions to have said beam periodically propagate through said aperture and impinge upon said substrate; and wherein said first direction and said second direction are transverse to said path.
  • 11. The method as recited in claim 10 further including having said aperture superimpose an area of said substrate to be exposed, wherein said flash position is defined, wherein repeatably moving said beam further includes moving said substrate with respect to said beam while periodically propagating said beam through said aperture to expose a plurality of said flash positions on said substrate.
  • 12. The method as recited in claim 10 further including moving said beam, after impinging said beam upon said first blank position and before moving said beam to impinge upon said second blank position, to impinge upon an additional flash position, located within said second aperture.
  • 13. The method as recited in claim 12 wherein said beam moves along a common trajectory when moving from said first blank position to impinge upon said flash position and moving from said flash position to impinge upon said additional flash position.
  • 14. The method as recited in claim 12 wherein said beam moves along a first trajectory from said first blank position to impinge upon said flash position and along a second trajectory from said flash position to impinge upon said additional flash position, with said first trajectory being different from said second trajectory.
  • 15. A system for writing a pattern on a substrate by systematically blanking and flashing a bean along a path employing a stop having an aperture disposed therein, said system comprising:means for impinging said beam upon a first region of said stop, defining a first blank position; means for moving said beam, along a first direction, from said first blank position to a flash position located within said aperture; means for moving said beam, along said first direction, from said flash position to impinge upon a second region of said stop, defining a second blank position; and wherein said first direction is transverse to said path.
  • 16. A system for writing a pattern on a substrate, comprising:a source to direct a beam of energy along a path; a stop, disposed in said path, having an aperture formed; a displacement mechanism to spatially displace said substrate with respect to said path in accordance; a writing plane, disposed in said path proximate to said substrate, with said beam forming a shadow of said aperture impinging upon said writing plane; a deflector disposed proximate to said stop to deflect said beam; a processor in data communication with said source, said deflector and said displacement mechanism; a memory in data communication with said processor, said memory comprising a computer-readable medium having a computer-readable program embodied therein, said computer-readable program including a first set of instructions for controlling said deflector to move said beam, along a first direction, from impinging upon a first region of said stop, defining a first blank position, to impinge upon a flash position located within said aperture; and a second set of instructions to control said deflector to move said beam, along said first direction, from impinging upon said flash position to impinge upon a second region of said stop, defining a second blank flash position; and wherein said first direction is transverse to said path.
  • 17. The system as recited in claim 16 wherein said computer-readable program further includes a third set of instructions for controlling said deflector to move said beam, along a second direction transverse to said path, opposite to said first direction, from impinging upon said second blank position to propagate through said aperture, and repeatably moving said beam to successively impinge upon said first and second blank positions to have said beam periodically propagate through said aperture.
  • 18. The system as recited in claim 16 wherein said computer-readable program further includes a third set of instructions to control said deflector to move said beam, after impinging said beam upon said first blank position and before moving said beam to impinge upon said second blank position, to impinge upon an additional flash position to expose an “L” shaped region on said substrate.
  • 19. The system as recited in claim 18 further including an additional stop including an additional aperture that superimposes said aperture, with said stop and said additional stop being disposed between said source and said image plane, with said beam propagating through said aperture having a cross-sectional area with a shape of said cross-sectional area being defined by a superimposition of said aperture and said additional aperture.
  • 20. The system as recited in claim 18 wherein said computer-readable program further includes a fourth set of instructions to control said displacement mechanism, said source and said deflector to periodically propagate through said aperture while moving said substrate with respect to said beam to expose a plurality of flash sites on said substrate.
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