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5323105 | Davis, Jr. et al. | Jun 1994 | |
5367254 | Faure et al. | Nov 1994 | |
5442299 | Caggiano | Aug 1995 | |
5488314 | Brandt et al. | Jan 1996 | |
5670889 | Okubo et al. | Sep 1997 | |
5854558 | Motooda et al. | Dec 1998 | |
5955888 | Frederickson et al. | Sep 1999 | |
5977787 | Das et al. | Nov 1999 | |
6144212 | Mizuta | Nov 2000 | |
6163162 | Thiessen et al. | Dec 2000 |
Entry |
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Sisco, Modern Metallurgy for Engineers, 2nd edition 1948; Pitman Publishing Corporation, pp. 298-299 in Chapter 16: High-Alloy Steels as Engineering Materials. |
IBM, Probing Considerations in C-4 Testing of IC Wafers, The International Journal of Microcircuits and Electronic Packaging, vol. 15, No. 4, Fourth Quarter. |
IBM, C-4 Product Design Manual, vol. 1: Chip and Wafer Design Chapter 9, Wafer Probing. Manual distributed to Sematech, MCNC at seminars in 1993 and 1994. |