This relates generally to automation, and more particularly, to automated equipment for use in manufacturing operations such as testing.
Electronic devices are often tested following assembly to ensure that device performance meets design specifications. For example, a device may be tested at a series of test stations to ensure that components and software in the device are operating satisfactorily. At each test station, an operator may couple a device to test equipment using a cable. Following successful testing at all test stations, a device may be shipped to an end user.
The process of attaching and detaching test cable connectors and the manual operations associated with performing tests at test stations can be cumbersome and burdensome to test system operators. If care is not taken, tests may be less accurate and more time consuming than desired.
It would therefore be desirable to be able to provide improved ways of performing manufacturing operations such as testing operations on electronic devices.
A test system may be provided in which devices under test are loaded into test trays. Test trays in the test system may be tested at test stations. A conveyor belt may be used to move test trays from one test station to another. Each test station may include loading equipment and test equipment. The loading equipment at each test station may include first and second movable arms. The loading equipment may include computer-controlled motor-driven or air-driven positioners configured to move the first and second arms along at least three orthogonal axes.
The first arm may be configured to pick up a test tray from the conveyor belt (e.g., by mating arm engagement features with corresponding test tray engagement features). The first arm may hand off (or transfer) the test tray to the second arm (e.g., the second arm may receive the test tray from the first arm). The second arm may be move the test tray towards the test equipment for testing. For example, the test equipment may be used to test the function of one or more input/output circuitry in the device under test.
In one suitable arrangement, the test system may include at least two layers of test stations stacked on top of one another. As an example, a first layer of test stations may be stacked on top of a second layer of test stations. A first conveyor belt may be configured to convey devices under test past test stations in the first layer, whereas a second conveyor belt may be configured to convey devices under test past test stations in the second layer. Testing devices under test using this configuration may enhance test throughput.
Further features of the present invention, its nature and various advantages will be more apparent from the accompanying drawings and the following detailed description.
Electronic devices such as electronic device 10 of
Devices such as device 10 of
Devices that are being tested in a test system may sometimes be referred to as devices under test (DUTs). Devices under test may be provided to the test stations using a conveyor belt, using robotic arms, or using other loading equipment.
Any suitable device may be tested using test equipment. As an example, device 10 of
As shown in
Device 10 may, if desired, have a display such as display 14. Display 14 may be a touch screen that incorporates capacitive touch electrodes or may be insensitive to touch. Display 14 may include image pixels formed from light-emitting diodes (LEDs), organic LEDs (OLEDs), plasma cells, electrophoretic display elements, electrowetting display elements, liquid crystal display (LCD) components, or other suitable image pixel structures. A cover glass layer may cover the surface of display 14. Openings for buttons such as button 20, openings for speaker ports such as speaker port 22, and other openings may be formed in the cover layer of display 14, if desired.
The central portion of display 14 (i.e., active region 16) may include active image pixel structures. The surrounding rectangular ring-shaped inactive region (region 18) may be devoid of active image pixel structures. If desired, the width of inactive region 18 may be minimized (e.g., to produce a borderless display).
Device 10 may include components such as front-facing camera 24. Camera 24 may be oriented to acquire images of a user during operation of device 10. Device 10 may include sensors in portion 26 of inactive region 18. These sensors may include, for example, an infrared-light-based proximity sensor that includes an infrared-light emitter and a corresponding light detector to emit and detect reflected light from nearby objects. The sensors in portion 26 may also include an ambient light sensor for detecting the amount of light that is in the ambient environment for device 10. Other types of sensors may be used in device 10 if desired. The example of
Device 10 may include input-output ports such as port 28. Port 28 may include audio input-output ports, analog input-output ports, digital data input-output ports, or other ports.
Sensors such as the sensors associated with region 26 of
A schematic diagram of an electronic device such as electronic device 10 is shown in
Storage and processing circuitry 27 may be used to run software on device 10, such as internet browsing applications, voice-over-internet-protocol (VoIP) telephone call applications, email applications, media playback applications, operating system functions, etc. To support interactions with external equipment, storage and processing circuitry 27 may be used in implementing communications protocols. Communications protocols that may be implemented using storage and processing circuitry 27 include internet protocols, wireless local area network (WLAN) protocols (e.g., IEEE 802.11 protocols—sometimes referred to as WiFi®), protocols for other short-range wireless communications links such as the Bluetooth® protocol, cellular telephone protocols, etc.
Circuitry 27 may be configured to implement control algorithms that control the use of antennas in device 10. For example, to support antenna diversity schemes and MIMO schemes or beam forming or other multi-antenna schemes, circuitry 27 may perform signal quality monitoring operations, sensor monitoring operations, and other data gathering operations and may, in response to the gathered data, control which antenna structures within device 10 are being used to receive and process data. As an example, circuitry 27 may control which of two or more antennas is being used to receive incoming radio-frequency signals, may control which of two or more antennas is being used to transmit radio-frequency signals, may control the process of routing incoming data streams over two or more antennas in device 10 in parallel, etc.
Input/output circuitry 29 may be used to allow data to be supplied to device 10 and to allow data to be provided from device 10 to external devices. Input/output circuitry 29 may include input/output devices 31. Input/output devices 31 may include touch screens, displays without touch sensor capabilities, buttons, joysticks, click wheels, scrolling wheels, touch pads, key pads, keyboards, microphones, speakers, tone generators, vibrators, cameras, sensors, light-emitting diodes and other status indicators, light sources, audio jacks and other audio port components, data ports, light sensors, motion sensors (accelerometers), capacitance sensors, proximity sensors, etc. A user can control the operation of device 10 by supplying commands through input/output devices 31 and may receive status information and other output from device 10 using the output resources of input/output devices 31.
Wireless communications circuitry 33 may include radio-frequency (RF) transceiver circuitry formed from one or more integrated circuits, power amplifier circuitry, low-noise input amplifiers, passive RF components, one or more antennas, transmission lines, and other circuitry for handling RF wireless signals. Wireless signals can also be sent using light (e.g., using infrared communications).
Wireless communications circuitry 33 may include satellite navigation system receiver circuitry 35, transceiver circuitry such as transceiver circuitry 37 and 39, and antenna circuitry such as antenna circuitry 41. Satellite navigation system receiver circuitry 35 may be used to support satellite navigation services such as United States' Global Positioning System (GPS) (e.g., for receiving satellite positioning signals at 1575 MHz) and/or other satellite navigation systems.
Transceiver circuitry 37 may handle 2.4 GHz and 5 GHz bands for WiFi® (IEEE 802.11) communications and may handle the 2.4 Bluetooth® communications band. Circuitry 37 may sometimes be referred to as wireless local area network (WLAN) transceiver circuitry (to support WiFi® communications) and Bluetooth® transceiver circuitry. Circuitry 33 may use cellular telephone transceiver circuitry (sometimes referred to as cellular radio) 39 for handling wireless communications in cellular telephone bands such as bands at 850 MHz, 900 MHz, 1800 MHz, 1900 MHz, and 2100 MHz or other cellular telephone bands of interest.
Examples of cellular telephone standards that may be supported by wireless circuitry 33 and device 10 include: the Global System for Mobile Communications (GSM) “2G” cellular telephone standard, the Evolution-Data Optimized (EVDO) cellular telephone standard, the “3G” Universal Mobile Telecommunications System (UMTS) cellular telephone standard, the “3G” Code Division Multiple Access 2000 (CDMA 2000) cellular telephone standard, and the “4G” Long Term Evolution (LTE) cellular telephone standard. Other cellular telephone standards may be used if desired. These cellular telephone standards are merely illustrative.
Wireless communications circuitry 33 may include circuitry for other short-range and long-range wireless links if desired. For example, wireless communications circuitry 33 may include wireless circuitry for receiving radio and television signals, paging circuits, etc. In WiFi® and Bluetooth® links and other short-range wireless links, wireless signals are typically used to convey data over tens of hundreds of feet. In cellular telephone links and other long-range links, wireless signals are typically used to convey data over thousands of feet or miles.
Wireless communications circuitry 33 may include one or more antennas 41. Antennas 41 may be formed using any suitable antenna type. For example, antennas 41 may include antennas with resonating elements that are formed from loop antenna structures, patch antenna structures, inverted-F antenna structures, slot antenna structures, planar inverted-F antenna structures, helical antenna structures, hybrids of these designs, etc. Different types of antennas may be used for different bands and combinations of bands. For example, one type of antenna may be used in forming a local wireless link antenna and another type of antenna may be used in forming a remote wireless link antenna.
Device under test 10 may, if desired, be installed in a test tray such as tray 32. Tray 32 may be configured to receive one or more devices under test. For example, tray 32 may have multiple slots, each of which is configured to receive a corresponding device under test. If desired, tray 32 may be configured to receive only a single device under test.
Device 10 may be installed in test tray 32 manually or using automated equipment. To facilitate manual installation, test tray 32 may include features to facilitate human manipulation. For example, test tray 32 may include features that help an operator open and close clamps or other device holding features in test tray 32.
Device under test 10 that is mounted in test tray 32 may be conveyed between test stations 36 using a conveyor belt such as conveyor belt 38 (e.g., a belt that moves in direction 40). When using a conveyor system such as one or more conveyor belts 38, each test station 36 may be provided with loading mechanisms (or loader) 46. With this type of arrangement, test tray 32 may serve as an interface between DUT 10 and loader 46. Test tray 32 may, for example, be more robust than DUT 10, may have engagement features that are configured to mate with loader 46, may have an identification number that facilitates tracking, and may have other features that facilitate testing of DUT 10 by test stations 36.
For example, loader 46 in each test station 36 may be provided with one or more computer-controlled positioning arms. The positioning arms in loader 46 may be used in picking up a test tray (i.e., a test tray that is loaded with DUT 10) from conveyor 38 (see, arrow 50), may be used to present DUT 10 in the test tray to tester 44 at that test station to perform desired testing the DUT, and may be used to replace the test tray on conveyor 38 following testing (see, arrow 52).
Test stations 36 may provide test results to computing equipment such as test host 42 (e.g., one or more networked computers) for processing. Test host 42 may maintain a database of test results, may be used in sending test commands to test stations 36, may track individual trays and devices under test as the trays and devices pass through system 30, and may perform other control operations.
Following insertion of DUT 10 into test tray 32 and following insertion of plug connector 146 of pad extender 144 into connector 28 of DUT 10, test tray 32 of
Because DUT 10 is connected to test contacts 62 in test tray 32 using pad extender 144 associated with test tray 32, it is not necessary to repeatedly connect and disconnect device under test 10 from cabling at each test station 36. Rather, connections between DUT 10 and the test equipment at each test station 36 by may be formed by coupling contacts 62 in test tray 32 to corresponding contacts (e.g., spring-loaded pins) in each test station 36. By minimizing the number of times that cables need to be connected and disconnected from each device under test, the life of tester cables and connectors may be extended.
The use of test tray 32 and loader 46 may allow DUT 10 to be placed accurately within test stations 36 (e.g., with an accuracy of +/−0.1 mm or better, as an example). Test tray 32 may shield device under test 10 from scratches and other damage during testing. In general, DUT 10 may be received within test tray 32 in either an upwards facing configuration in which display 14 faces outwards away from tray 32 or a downwards facing configuration in which display 14 faces downwards onto base 48 of test tray 32.
Test tray 32 may be provided with guide structures configured to accurately place device under test 10 in a desired location within a recess 154 in tray 32. As shown in
Test tray 32 may also include engagement features such as holes 160 and 162 formed on both ends of tray 32 (see, e.g., top perspective view of tray 32 in
Sensor 203 may (as an example) be a laser-based distance sensor that is used to detect whether an incoming tray 32 has been successfully received within arm 204-1. For example, sensor 203 may detect that a tray 32 is being conveyed towards arm 204-1 passing detection plane 203′. If sensor 203 detects that tray 32 has completely moved past sensor detection plane 203′ at a later point in time, DUT 10 has successfully been received within arm 204-1. If sensor 203 detects that tray 32 has not yet completely moved past detection plane 203′, arm 208-1 will remain in a receiving position until DUT 10 is successfully received within arm 204-1.
Loader 46 may have computer-controlled positioners for moving arms 204-1 and 204-2. Arm 204-1 may be moved vertically to pick up test trays. For example, arm 204-1 of may be lowered in direction 300 to pick-up location 302 (i.e., the surface of conveyor belt 38) when it is desired to use arm 204-1 to pick up a new test tray 32 from conveyor belt 38 (see, e.g.,
Arm 204-2 may be positioned in vertical and horizontal alignment with pick-up arm 204-2 to receive test tray 32 from pick-up arm 204-1 (i.e., arm 204-2 may be maintained in a handoff location that is at the same height as pick-up arm 204-1). For testing, arm 204-2 may be moved vertically in direction 306 from the handoff position to testing position 308. When arm 204-2 is in testing position 308, DUT 10 that is mounted in test tray 32 may be tested using test equipment 44 (e.g., a tester for performing optical tests, audio tests, wireless radio-frequency tests, mechanical tests, etc.). Following testing, arm 204-2 may be moved vertically downward in direction 310 until arm 204-2 reaches drop-off position 312 to deposit tray 32 on conveyor belt 38. Arm 204-2 may therefore sometimes be referred to as a “drop-off” arm.
Both pick-up arm 204-1 and drop-off arm 204-2 may be used simultaneously. For example, arm 204-1 may be used in picking up a test tray 32 while arm 204-2 is in the process of dropping off a previous test tray. The simultaneous use of arms 204-1 and 204-2 may help enhance test system throughput.
As shown in
Loader 46 may also be provided with computer-controlled positioners such as positioner 212-1 for moving pick-up arm 204-1 along a direction that is parallel to horizontal axis X. Positioner 212-1 may be a computer-controlled actuator such as a motor-driven or air-driven actuator. Positioner 212-1 may, as an example, be mounted to extender plate 210-1 or other equipment in loader 46.
Similarly, loader 46 may have a drop-off arm extender plate such as plate 210-2. Plate 210-2 may have a threaded hole hole 214. Computer-controlled motor 222-2 may be used to rotate screw 216-2 about rotational axis 220-2. By rotating screw 216-2, motor 222-2 may be used to raise and lower plate 210-2 and therefore drop-off arm 204-2 in a direction that is parallel to vertical axis Z. For example, motor 222-2 may be used to raise plate 210-2 so that DUT 10 that is held by arm 204-2 is raised to test reference plane 230 (i.e., a plane to which a DUT should be vertically aligned so that tester 44 can properly test the DUT).
Loader 46 may also be provided with a positioner such as positioner 212-2 for moving drop-off arm 204-2 along axis X. Positioner 212-2 may be a computer-controlled actuator such as a motor-driven or air-driven actuator. Positioner 212-2 may, as an example, be mounted to extender plate 210-2 or other equipment in loader 46.
Each of arms 204-1 and 204-2 may include an additional contractible member such as arm member 206 and air-driven or motor-driven actuators such as actuators 208. Member 206 of pick-up arm 204-1 may have engagement features such as pins 160′, whereas member 206 of drop-ff arm 204-2 may have engagement features such as pins 162′. Actuators 208 may be used to extend and retract pins 160′ in arm 204-1 and pins 162′ in arm 204-2 in a direction that is parallel to axis Y.
Holes 160 and 162 in test tray 32 may be configured to engage pins 160′ and 162′, respectively. Initially, pins 160′ may be held in a retracted position by actuators 208. After conveyor belt 38 has moved tray 32 into position within arm 204-1, actuators 208 may be used to extend pins 160′ into holes 160. Once pick-up arm 204-1 has grasped test tray 32 in this way, pick-up arm 204-1 may deliver test tray 32 to tester 44 at the test station associated with pick-up arm 204-1.
In particular, at step 402, pick-up arm 204-1 may be lowered to position 302 (
At step 404, light sensors (e.g., sensor 203 of
At step 408, pick-up arm 204-1 may be lifted towards the handoff position. At step 410, if drop-off arm 204-2 is busy, system 30 may wait for the previous test tray to be ejected from drop-off arm 204-2. Once drop-off arm 204-2 is free, testing operations may proceed to step 412.
At step 412, lateral actuator 212-1 may be used to move test tray 32 towards arm 204-2. Light sensors associated with pick-up arm 204-1 may confirm when arm 204-1 has extended fully towards drop-off arm 204-2, so that the grabber mechanism (actuators and pins) on drop-off arm 204-2 may grab the test tray (step 414). Drop-off arm 204-2 may also include light sensors that are used to confirm that test tray 32 has been satisfactorily grabbed by arm 204-2.
At step 416, pick-up arm 204-1 may release test tray 32 (e.g., by disengaging pins 160′ from holes 160 in tray 32).
At step 418, pick-up arm 204-1 may be laterally retracted away from drop-off arm 204-2. Lateral retraction of arm 204-1 may be confirmed using light sensors.
At step 420, drop-off arm 204-2 may move test tray 32 to testing position 308 (
Following testing of the device under test, drop-off arm 204-2 may be lowered towards the drop-off location on conveyor 38 (step 422). At the drop-off location, test tray 32 may be returned to conveyor belt 38 (e.g., by disengaging pins 162′ from holes 162 in tray 32). As conveyor belt 38 moves, the test tray with the DUT that has been tested may be allowed to pass under pick-up arm 204-1.
The pick-up arm and drop-off arm may be mirrored in software and controlled by separate software objects. Each arm, and thus each arm object, may operate independently, while being controlled by a higher level loader supervisory sequencer. At step 424, drop-off arm 204-2 may return to the hand-off position to await orders from the loader sequencer.
Different types of test stations 36 may be used for performing different types of tests on devices under test 10. For example, stations 36 with open-faced test fixtures may be used for performing optical tests such as ambient light sensor tests and proximity sensor tests. Stations 36 with chambered test fixtures 36 (i.e., stations with test fixtures that are enclosed within metal boxes) may be used for performing wireless signal tests such as antenna tests.
Different types of tests may take different amounts of time to complete. For example, test stations of type A may exhibit an average cycle time of 30 seconds, whereas test stations of type B may exhibit an average cycle time of 45 seconds. To help ensure that devices are not delayed more than necessary when a particular type of test is performed, different number of test stations 36 may be used for performing each type of test. There may be, for example, two test stations 36 on conveyor belt 38 of type A (i.e., for performing tests for a first type of component in device 10) and three test stations 36 on conveyor belt 38 of type B (i.e., for performing tests for a second type of component in device 10). The feed rate in this type of configuration may be 15 seconds. Test data gathered using the different test stations 36 in this way may be fed to associated test host 42 via path 43.
The foregoing is merely illustrative of the principles of this invention and various modifications can be made by those skilled in the art without departing from the scope and spirit of the invention. The foregoing embodiments may be implemented individually or in any combination.
This application claims the benefit of provisional patent application No. 61/595,572, filed Feb. 6, 2012, which is hereby incorporated by reference herein in its entirety.
Number | Date | Country | |
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61595572 | Feb 2012 | US |