1. Technical Field
The disclosure generally relates to thermal modules, and more particularly to a thermal module incorporating a plate type heat pipe.
2. Description of Related Art
With continuing development of the electronic technology, electronic components such as CPUs are generating more and more heat which is required to be dissipated immediately. A thermal module is usually adopted for cooling the electronic component.
Generally, the thermal module includes a blower for generating forced airflow, a fin unit arranged at an air outlet of the blower, and a heat pipe. The heat pipe includes an evaporating section attached to the electronic component to absorb heat therefrom, and a condensing section attached to the fin unit to transfer the heat of the electronic component to the fin unit. Thus the forced airflow of the blower can take away the heat after flows through the fin unit. However, most of electronic devices that contain electronic components therein, such as a laptop computer, do not have enough space therein, and thus a size of the heat pipe is usually limited. Accordingly, a heat transfer capability of the heat pipe is limited, which means that the heat of the electronic component can not be timely transferred to the fin unit for dissipation.
For the foregoing reasons, therefore, there is a need in the art for a thermal module which overcomes the limitations described.
Referring to
Referring to
The heat pipe 30 is in plate type, and has a profile substantially being Z-shaped. The heat pipe 30 forms an evaporation section 31 and a condensation section 33 at two ends thereof, respectively. The evaporation section 31 is attached to the electronic components 90 to absorb heat therefrom. The condensation section 33 is linear-shaped, and attaches to the fin unit 20. The heat of the electronic components thus can be transferred to the fin unit 20 by the heat pipe 30 for dissipation.
The evaporation section 31 of the heat pipe 30 is substantially L-shaped, and includes an elongated portion 312 extending perpendicularly from an end of the condensation section 33, and an end portion 314 extending perpendicularly from the elongated portion 312. The end portion 314 is parallel to the condensation section 33. The end portion 314 and the condensation section 33 are respectively located at opposite sides and opposite ends of the elongated portion 312 of the heat pipe 30. A plurality of through holes 38 are defined in the evaporation section 31 of the heat pipe 30 for fixing members, such as screws to extend therethrough and be secured to the circuit board 80, thus to assemble the thermal module onto the electronic components 90.
Referring to
Referring to
The second portion 369 and the third portion 367 of the top plate 36 form a plurality of contacting members 360 depressed downwardly therefrom for accommodating the electronic components 90 therein. Shapes, sizes, and positions of the contacting members 360 are decided according to an arrangement of the electronic components 90. The plurality of contacting members 360 can have different shapes, areas and depths. In this embodiment, four separated contacting members 360 are shown, in which one contacting member 360 is defined in the third portion 367 of the top plate 36, i.e., at the end portion 314 of the evaporation section 31, and the other three contacting members 360 are defined in the second portion 369 of the top plate 36, i.e., at the elongated portion 312 of the evaporation section 31. Thus the heat pipe 30 can be used to absorb heat from four electronic components 90 at the same time.
Each contacting member 360 is located at a middle of the top plate 36, with a width smaller than that of the evaporation section 31 of the heat pipe 30. Two opposite lateral sides, i.e., left and right sides of each contacting member 360 respectively space a distance from the side plate 34 of the tube 37 of the heat pipe 30. Each of the contacting members 360 includes a base 361 and a flange 362 around the base 361. The base 361 is substantially square or rectangular, and is lower than the top plate 36 of the heat pipe 30. The flange 362 is perpendicular to the base 361, and connects the base 361 to the top plate 36 of the heat pipe 30. A concave 363 is defined in the top plate 36 above each base 361 and surrounded by a corresponding flange 362. Thus, a depth of the chamber 35 of the heat pipe 30 at the contacting members 360 is less than that at other portion of the evaporation section 31 of the heat pipe 30 without the contacting members 360.
In this embodiment, the wick structure 39 is sintered powders. The wick structure 39 is arranged in the middle of the chamber 35 of the heat pipe 30. A width of the wick structure 39 is smaller than that of the heat pipe 30, but larger than that of each of the contacting members 360. The wick structure 39 includes a planar bottom side attaching to the bottom plate 32 of the tube 37 of the heat pipe 30, and a non-planar top side attaching to the top plate 36 of the tube 37. Four recesses are defined in the top side of the wick structure 39 receiving the contacting members 360 of the top plate 36 therein. Thus the wick structure 39 covers the contacting members 360 entirely, including the bases 361 and the flanges 362, and covers a portion of the top plate 36 around the contacting members 360. A passage 60 is defined between each lateral side of the wick structure 39 and the side plate 34 of the tube 37 of the heat pipe 30.
When assembled, the top side of the condensation section 33 of the heat pipe 30 attaches to the bottom side of the fin unit 20 directly. The electronic components 90 are attached to the top plate 36 of the evaporation section 31 of the heat pipe 30 at the contacting members 360. Each electronic component 90 enters into a corresponding concave 363, with an outer surface 92 thereof attaching to a corresponding base 361 closely. Therefore, the electronic components 90 are partly received in the concaves 363 of the heat pipe 30. Other part of the heat pipe 30 without the contacting members 360 extend toward the circuit board 80 to be adjacent to the circuit board 80. Therefore, spaces around the electronic components 90 are utilized to accommodate the heat pipe 30, and a size, particularly a thickness, of the heat pipe 30 is increased, whilst a size of the electronic device which incorporates the thermal module does not need change.
During operation, the working fluid in the wick structure 39 of the heat pipe 30 absorbs the heat generated by the electronic components 90 and evaporates. Then the vapor moves to the condensation section 33 along the passages 60 at the lateral sides of the wick structure 39 to release the heat thereof to the fin unit 20. The vapor cools and condenses at the condensation section 33. The condensed working fluid returns to the evaporation section 31 by the capillary force of the wick structure 39, and evaporates into vapor again thereat. Since the heat pipe 30 of the thermal module has an enlarged size, a heat transfer capability of the heat pipe 30 is enhanced, whereby the heat of the electronic components 90 can be continuously and timely transferred to the fin unit 20 by the heat pipe 30. Finally the airflow of the blower 10 flowing across the fin unit 20 can take away the heat to an outside. Therefore, the thermal module can cool plural electronic components 90 simultaneously. A utilization efficiency of the thermal module is accordingly enhanced.
It is to be understood, however, that even though numerous characteristics and advantages of the disclosure have been set forth in the foregoing description, together with details of the structure and function of the disclosure, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Number | Date | Country | Kind |
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200810306488.5 | Dec 2008 | CN | national |