“Handbook of Fillers, second edition”, George Wypych, 2000, Chem Tec Publishing, Yoronto, Ontario, Chapter 6, pp. 312, 318 320.* |
Thermal Trends, “Parameter Optimization for Measuring Thermal Properties of Electronic Materials Using the Transient Plane Source Technique”, Craig A. Dixon, Michael R. Strong, and S. Mark Zhang, vol. 7, No. 5, p. 1, 2000. |
American Chemical Society, “Effect of Stabilization of Polypropylene During Processing and Its Influence on Long-Term Behavior Under Thermal Stress”, Han Sweifel, p. 376-396, 1996. |
ITherm abstract submission,“Silicone Organic Phase Change Materials for TIM”. Mark Zhang, Diane Swarthout, Jane Feng. |
ITherm abstract submission, “Novel Silicone Based Phase Change Thermal Interface Materials”. Dorab E. Bhagwagar, Kimmai T. Nguyen and Andrew A. Mojica. |