Claims
- 1. A thick film inductor made by the process of subjecting a conductor layer to a plurality of linear cuts by a pulsing laser cutter imposed simultaneously on the entire length of the linear cut being made to create a cross sectional cut of substantially rectangular configuration, wherein the laser cutter converts the conductor layer into a conductor coil, the conductor coil having lines with widths of less than about 2 mils, and the lines having a thickness of at least about 15 microns.
- 2. The device of claim 1 wherein said conductor layer is composed of a layer of dry silver thick film ink.
- 3. The thick film inductor of claim 1 wherein the distance between adjacent conductor lines is less than about 2 mils.
- 4. The thick film inductor of claim 1 wherein the process further comprises screen printing thick film conductor material onto a substrate to form the conductor layer.
- 5. A thick film inductor, comprising:a ceramic substrate; a conductor coil, which has a cross section, positioned on the ceramic substrate, the conductor coil comprised of lines whose widths are less than about 2 mils, the lines having a thickness of at least about 15 microns, the cross section of the conductor coil having a substantially rectangular configuration.
- 6. The thick film inductor of claim 5, wherein the ceramic substrate is alumina.
- 7. The thick film inductor of claim 5 further comprising:a dielectric base coat between the ceramic substrate and the conductor coil, the dielectric base coat having a dielectric constant of no greater than about 5.
- 8. The thick film inductor of claim 5 wherein the distance between adjacent conductor lines is less than about 2 mils.
- 9. The thick film inductor of claim 5 wherein the thickness of the conductor lines is between about 15 and 25 microns.
CROSS REFERENCE TO RELATED APPLICATION
This application is a divisional of applicant's application Ser. No. 08/936,193 filed Sep. 17, 1997, now U.S. Pat. No. 5,922,514.
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