Claims
- 1. A sputtering cathode apparatus for deposition of a doped thin film on a substrate which is moved relative to said apparatus, comprising;
- planar magnetron sputtering means including means defining a frame-shaped plasma area and having a host target material disposed in the magnetron plasma area,
- diode sputtering means disposed inside said framed area and out of the plasma sputtering area and comprising a dopant material,
- and means for electrically exciting said host target material and dopant material to provide co-deposition of said materials therby forming the doped thin film on the substrate.
- 2. A sputtering cathode apparatus as set forth in claim 1 wherein said host target material comprises zinc sulfide.
- 3. A sputtering cathode apparatus as set forth in claim 1 wherein said dopant material comprises manganese.
- 4. A sputtering cathode apparatus as set forth in claim 1 wherein said planar magnetron sputtering means comprises permanent magnet means.
- 5. A sputtering cathode apparatus as set forth in claim 1 wherein said means for electrically exciting comprises circuit means for co-exciting the host and dopant materials.
- 6. A sputtering cathode apparatus as set forth in claim 5 wherein said co-excited respective signals for the host and dopant materials are maintained in phase.
- 7. A sputtering cathode apparatus as set forth in claim 6 wherein the circuit means comprises an RF oscillator, RF amplifier means coupled from the RF oscillator and impedance matching means coupled from the RF amplifier means to each material.
- 8. A sputtering cathode apparatus as set forth in claim 7 wherein the RF amplifier means gain is controlled to control percentage to doping in doped thin film.
- 9. A sputtering cathode apparatus as set forth in claim 1 including means for electrically isolating said planar magnetron sputtering means and said diode sputtering means.
Government Interests
The government has rights in this invention pursuant to Contract No. DAAK20-81-C-0433 awarded by the Department of the Army.
US Referenced Citations (9)