1. Field of the Invention
The present invention relates to a transfer apparatus, a cleaning apparatus, a chemical processing apparatus, and a method for manufacturing a circuit substrate, and more particularly, is preferably applicable to a wet processing for flexible circuit substrates.
2. Description of Related Art
Relating to the conventional cleaning apparatuses, for example, there is a method for cleaning a tape substrate by jetting a cleaning liquid onto the tape substrate while transferring the tape substrate. Here, when the tape substrate is transferred, the tape substrate is supported by rollers. For this reason, the conventional cleaning apparatus applies a large tension to the tape substrate to prevent the tape substrate from slacking between the rollers so as to stably transfer the tape substrate.
However, the application of a large tension to the tape substrate at the time of transferring the tape substrate causes problems in that distortions and/or bends occur in the tape substrate, and thus the quality of the tape substrate deteriorates. In particular, when the tape substrate is wide, or the tape substrate is thin, it becomes almost impossible to apply a large tension to the tape substrate.
On the other hand, to transfer a tape substrate on rollers without applying a large tension to the tape substrate, there is a method of rotating the rollers in a manner that the rotational speed of the rollers is synchronized with the transfer speed of the tape substrate.
However, the method of rotating the rollers in a manner that the rotation speed of the rollers is synchronized with the transfer speed of the tape substrate causes problems in that the transfer control becomes complex, the structure of the transfer apparatus becomes complicated, and the cost of the transfer apparatus increases.
Accordingly, it is an advantage of the present invention to provide a transfer apparatus, a cleaning apparatus, a chemical processing apparatus and a method for manufacturing a circuit substrate, which can prevent the transfer control from becoming complex, and can prevent the tension from increasing.
To solve the aforementioned problems, a transfer apparatus in accordance with an embodiment of the present invention includes a reservoir tank that stores fluid fluid supply unit that supplies the fluid into the reservoir tank such that the fluid overflows from the reservoir tank and a transfer device that transfers an object to be transferred while floating the object to be transferred on the fluid.
Accordingly, the object to be transferred can be transferred while sliding the object to be transferred on the fluid, such that a surface for holding the object to be transferred can be planarized. For this reason, the tension applied to the object to be transferred can be reduced, and the object to be transferred can be transferred without inflicting damage to the object to be transferred. Also, by overflowing the fluid from the reservoir tank, the object to be transferred can be transferred on the fluid, the transfer control is prevented from becoming complex, and an increase in the cost of the transfer apparatus can be prevented.
Also, a transfer apparatus in accordance with an embodiment of the present invention includes a support member that supports an object to be transferred, a fluid supply unit that supplies fluid on the support member such that the fluid flows along a transfer direction of the object to be transferred and a transfer devices that transfers the object to be transferred while floating the object to be transferred on the fluid.
Accordingly, while carrying the object to be transferred away with the fluid, the object to be transferred can be transferred, such that a surface for holding the object to be transferred can be planarized. For this reason, the tension applied to the object to be transferred can be reduced, and the object to be transferred can be transferred without inflicting damage to the object to be transferred. Also, by flowing the fluid along the transfer direction of the object to be transferred, the object to be transferred can be transferred on the fluid, the transfer control is prevented from becoming complex, and an increase in the cost of the transfer apparatus can be prevented.
Also, a cleaning apparatus in accordance with an embodiment of the present invention includes a reservoir tank that stores a cleaning liquid, a cleaning liquid supply unit that supplies a cleaning liquid into the reservoir tank such that the cleaning liquid overflows from the reservoir tank, a transfer device that transfers an object to be transferred while floating the object to be transferred on the cleaning liquid and a clean liquid jetting unit that jets a cleaning liquid on the object to be transferred that floats on the cleaning liquid.
Accordingly, the object to be transferred can be cleaned while sliding the object to be transferred on the cleaning liquid. For this reason, the tension applied to the object to be transferred can be reduced, and the object to be transferred can be cleaned without inflicting damage to the object to be transferred. Also, by overflowing the cleaning liquid from the reservoir tank, the object to be transferred can be transferred on the cleaning liquid, the transfer control is prevented from becoming complex, and an increase in the cost of the cleaning apparatus can be prevented.
Also, the cleaning apparatus in accordance with an embodiment of the present invention includes a cleaning liquid collecting tank that collects the cleaning liquid overflowed from the reservoir tank, and a cleaning liquid circulation device that circulates the cleaning liquid collected to the reservoir tank.
Accordingly, the cleaning liquid overflowed from the reservoir tank can be reused, the used amount of cleaning liquid is prevented from increasing, and the object to be transferred can be transferred while sliding the object to be transferred on the cleaning liquid.
Also, a cleaning apparatus in accordance with an embodiment of the present invention includes a support member that supports an object to be transferred, a cleaning liquid supply unit that supplies a cleaning liquid on the support member such that the cleaning liquid flows along a transfer direction of the object to be transferred, a transfer device that transfers the object to be transferred while floating the object to be transferred on the cleaning liquid and a cleaning liquid jetting unit that jets the cleaning liquid on the object to be transferred that floats on the cleaning liquid.
Accordingly, while carrying the object to be transferred away with the cleaning liquid, the object to be transferred can be cleaned. For this reason, the tension applied to the object to be transferred can be reduced, and the object to be transferred can be cleaned without inflicting damage to the object to be transferred. Also, by flowing the cleaning liquid along the transfer direction of the object to be transferred, the object to be transferred can be transferred on the cleaning liquid, the transfer control is prevented from becoming complex, and the cost of the cleaning apparatus can be prevented from increasing.
Also, a chemical processing apparatus in accordance with an embodiment of the present invention includes a reservoir tank that stores a chemical, a chemical supply unit that supplies the chemical into the reservoir tank such that the chemical overflows from the reservoir tank, a transfer device that transfers an object to be transferred while floating the object to be transferred on the chemical and a chemical jetting unit that jets the chemical on the object to be transferred that floats on the chemical.
Accordingly, the object to be transferred can be processed with the chemical while sliding the object to be transferred on the chemical. For this reason, the tension applied to the object to be transferred can be reduced, and the object to be transferred can be processed with the chemical without inflicting damage to the object to be transferred. Also, by overflowing the chemical from the reservoir tank, the object to be transferred can be transferred on the chemical, the transfer control is prevented from becoming complex, and an increase in the cost of the chemical processing apparatus can be prevented.
Also, a chemical processing apparatus in accordance with an embodiment of the present invention includes a support member that supports an object to be transferred, a chemical supply unit that supplies a chemical on the support member such that the chemical flows along a transfer direction of the object to be transferred, a transfer device that transfers the object to be transferred while floating the object to be transferred on the chemical and a chemical jetting unit that jets the chemical on the object to be transferred that floats on the chemical.
Accordingly, while carrying the object to be transferred away with the chemical, the object to be transferred can be processed with the chemical. For this reason, the tension applied to the object to be transferred can be reduced, and the object to be transferred can be processed with the chemical without inflicting damage to the object to be transferred. Also, by flowing the chemical along the transfer direction of the object to be transferred, the object to be transferred can be transferred on the chemical, the transfer control is prevented from becoming complex, and an increase in the cost of the chemical processing apparatus can be prevented.
Also, a method for manufacturing a circuit substrate in accordance with an embodiment of the present invention includes a step of overflowing a cleaning liquid or a chemical from a reservoir tank, a step of transferring a circuit substrate while floating the circuit substrate on the cleaning liquid or the chemical overflowed from the reservoir tank and a step of cleaning or chemical-processing the circuit substrate by jetting the cleaning liquid or the chemical onto the circuit substrate that is transferred.
Accordingly, the circuit substrate can be cleaned or processed with the chemical while sliding the circuit substrate on the cleaning liquid or the chemical. For this reason, the circuit substrate can be transferred while the tension applied to the circuit substrate can be reduced and even when the circuit substrate is wide or the circuit substrate is thin, cleaning of the circuit substrate or processing the circuit substrate with the chemical can be continuously performed while preventing the circuit substrate from distorting or bending.
Also, a method for manufacturing a circuit substrate in accordance with an embodiment of the present invention includes a step of flowing a cleaning liquid or a chemical along a transfer direction of a tape substrate, a step of transferring a circuit substrate while floating the circuit substrate on the cleaning liquid or the chemical that flows along the transfer direction of the tape substrate and a step of cleaning or chemical-processing the circuit substrate by jetting the cleaning liquid or the chemical onto the circuit substrate that is transferred.
Accordingly, while carrying the circuit substrate away with the cleaning liquid or the chemical, the circuit substrate can be cleaned or processed with the chemical. For this reason, the circuit substrate can be transferred while the tension applied to the circuit substrate can be reduced and even when the circuit substrate is wide or the circuit substrate is thin, cleaning of the circuit substrate or processing the circuit substrate with the chemical can be continuously performed while preventing the circuit substrate from warping or bending.
A cleaning apparatus and a cleaning method in accordance with embodiments of the present invention will be described below with reference to the accompanying drawings.
Referring to
Also, below the cleaning liquid reservoir tank 3 is provided a cleaning liquid collecting tank 5 for collecting the cleaning liquid 8 that is jetted from the cleaning liquid jetting unit 1 and the cleaning liquid 8 that overflows from the cleaning liquid reservoir tank 3. Further, a pump 6 is provided for sending the cleaning liquid 8 collected in the cleaning liquid collecting tank 5 to the cleaning liquid jetting unit 1, and a pump 7 is provided for sending the cleaning liquid 8 collected in the cleaning liquid collecting tank 5 to the cleaning liquid supplying unit 4. It is noted that, as the cleaning liquid 8, for example, pure water, ultrapure water, organic solvent such as sulfuric acid, diluted hydrochloric acid, alcohol, and the like can be used.
Then, when cleaning the tape substrate 9, the cleaning liquid 8 that accumulates in the cleaning liquid collecting tank 5 is supplied to the cleaning liquid supply unit 4 through the pump 7, such that the cleaning liquid 8 is overflowed from the cleaning liquid reservoir tank 3. Then, while the cleaning liquid 8 is being overflowed from the cleaning liquid reservoir tank 3, the tape substrate 9 is floated on the cleaning liquid 8 and transferred. Then, while the tape substrate 9 floats on the cleaning liquid 8 and is transferred, the cleaning liquid 8 is jetted from the cleaning liquid jetting unit 1 onto the tape substrate 9, to clean the tape substrate 9.
Accordingly, while sliding the tape substrate 9 on the cleaning liquid 8, the tape substrate 9 can be cleaned. For this reason, the tape substrate 9 can be transferred while the tension applied to the tape substrate 9 can be reduced, and even when the width of the tape substrate 9 is great or the thickness of the tape substrate 9 is small, distortions and bends are prevented from occurring on the tape substrate 9, and cleaning of the tape substrate 9 can be continuously performed.
For example, when the cleaning apparatus has a length of 30 m or longer, or when the tape substrate 9 is wide with its width being about 105 mm, and the tape substrate 9 is thin with its thickness being about 25 μm, distortions and bends are prevented from occurring on the tape substrate 9, and the tape substrate 9 can be transferred smoothly.
Also, by overflowing the cleaning liquid 8 from the cleaning liquid reservoir tank 3, the tape substrate 9 can be transferred on the cleaning liquid 8, the transfer control on the tape substrate 9 can be prevented from becoming complex, and an increase in the cost of the cleaning apparatus can be prevented.
It is noted that the tape substrate 9 can be used in a chip on film (COF), a tape carrier package (TCP) and a tape carrier module (TCM), for example.
Also, in the embodiment described above, the method for cleaning the tape substrate 9 while floating and transferring the tape substrate 9 on the cleaning liquid 8 is described. However, while floating and transferring the tape substrate 9 on the chemical, the tape substrate 9 can be processed with the chemical.
Also, below the cleaning liquid flowing unit 13 is provided a cleaning liquid collecting tank 15 for collecting the cleaning liquid 18 that is jetted from the cleaning liquid jetting unit 11 and the cleaning liquid 18 that overflows from the cleaning liquid flowing unit 13. Further, a pump 16 is provided for sending the cleaning liquid 18 collected in the cleaning liquid collecting tank 15 to the cleaning liquid jetting unit 11, and a pump 17 is provided for sending the cleaning liquid 18 collected in the cleaning liquid collecting tank 15 to the cleaning liquid supplying units 14. It is noted that, as the cleaning liquid 18, for example, pure water, ultrapure water, organic solvent such as sulfuric acid, diluted hydrochloric acid, alcohol, and the like can be used.
When the tape substrate 19 is cleaned, the cleaning liquid 18 that accumulates in the cleaning liquid collecting tank 15 is supplied to the cleaning liquid supply units 14 through the pump 17, and the cleaning liquid 18 is flowed on the cleaning liquid flowing unit 13 along the transfer direction of the tape substrate 19. Then, while flowing the cleaning liquid 18 on the cleaning liquid flowing unit 13, the tape substrate 19 is floated and transferred on the cleaning liquid 18, and the cleaning liquid 18 is jetted from the cleaning liquid jetting unit 11 onto the tape substrate 19, thereby cleaning the tape substrate 19.
Accordingly, while carrying the tape substrate 19 away with the cleaning liquid 18, the tape substrate 19 can be cleaned. For this reason, the tape substrate 19 can be transferred while the tension applied to the tape substrate 19 can be reduced, and even when the width of the tape substrate 19 is great or the thickness of the tape substrate 19 is small, warps and bends are prevented from occurring on the tape substrate 19, and cleaning of the tape substrate 19 can be continuously performed.
Also, by flowing the cleaning liquid 18 in the transfer direction of the tape substrate 19, the tape substrate 19 can be transferred on the cleaning liquid 18, the transfer control on the tape substrate 19 can be prevented from becoming complex, and an increase in the cost of the cleaning apparatus can be prevented.
It is noted that the tape substrate 19 can be used in a COF, a TCP and a TCM, for example.
Also, in the embodiment described above, the method for cleaning the tape substrate 19 while carrying the tape substrate 19 away with the cleaning liquid 18 is described. However, the tape substrate 19 may be processed with the chemical while carrying the tape substrate 19 away with the chemical.
Number | Date | Country | Kind |
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2003-153211 | May 2003 | JP | national |