Bonding

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CPC
Y10S148/012

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YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10S148/00Metal treatment

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Y10S148/012Bonding

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Patents Grantslast 30 patents

Information Patent Grant
Three dimensional device integration method and integrated device
- Patent number 10,366,962
- Issue date Jul 30, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 10,312,217
- Issue date Jun 4, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional device integration method and integrated device
- Patent number 9,564,414
- Issue date Feb 7, 2017
- ZIPTRONIX, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional device integration method and integrated device
- Patent number 9,431,368
- Issue date Aug 30, 2016
- Ziptronix, Inc.
- Paul M. Enquist
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 9,391,143
- Issue date Jul 12, 2016
- Ziptronix, Inc.
- Qin-Yi Tong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 9,331,149
- Issue date May 3, 2016
- Ziptronix, Inc.
- Qin-Yi Tong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 9,082,627
- Issue date Jul 14, 2015
- Ziptronix, Inc.
- Qin-Yi Tong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 8,153,505
- Issue date Apr 10, 2012
- Ziptronix, Inc.
- Qin-Yi Tong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 8,053,329
- Issue date Nov 8, 2011
- Ziptronix, Inc.
- Qin-Yi Tong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 7,871,898
- Issue date Jan 18, 2011
- Ziptronix, Inc.
- Qin-Yi Tong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 7,807,549
- Issue date Oct 5, 2010
- Ziptronix, Inc.
- Qin-Yi Tong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Diamond substrate formation for electronic assemblies
- Patent number 7,713,839
- Issue date May 11, 2010
- Intel Corporation
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 7,553,744
- Issue date Jun 30, 2009
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a complex structure by assembling stressed stru...
- Patent number 7,550,052
- Issue date Jun 23, 2009
- Commissariat a l'Energie Atomique
- Franck Fournel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing external force detection sensor
- Patent number 7,393,714
- Issue date Jul 1, 2008
- Murata Manufacturing Co., Ltd.
- Takahiro Oguchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 7,387,944
- Issue date Jun 17, 2008
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 7,335,572
- Issue date Feb 26, 2008
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional device integration method and integrated device
- Patent number 7,126,212
- Issue date Oct 24, 2006
- Ziptronix, Inc.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an external force detection sensor
- Patent number 7,067,344
- Issue date Jun 27, 2006
- Murata Manufacturing Co., Ltd.
- Takahiro Oguchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing an external force detection sensor
- Patent number 7,049,165
- Issue date May 23, 2006
- Murata Manufacturing Co., Ltd.
- Takahiro Oguchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 7,041,178
- Issue date May 9, 2006
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional device integration method and integrated device
- Patent number 6,984,571
- Issue date Jan 10, 2006
- Ziptronix, Inc.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Treatment method of film quality for the manufacture of substrates
- Patent number 6,969,668
- Issue date Nov 29, 2005
- Silicon Genesis Corporation
- Sien G. Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming electronic dies wherein each die has a layer of s...
- Patent number 6,936,497
- Issue date Aug 30, 2005
- Intel Corporation
- Kramadhati V. Ravi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional integrated device
- Patent number 6,905,557
- Issue date Jun 14, 2005
- Ziptronix, Inc.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 6,902,987
- Issue date Jun 7, 2005
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon-on-insulator wafer for RF integrated circuit
- Patent number 6,743,662
- Issue date Jun 1, 2004
- Honeywell International, Inc.
- Mohammed A. Fathimulla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Treatment process for molecular bonding and unbonding of two struct...
- Patent number 6,429,094
- Issue date Aug 6, 2002
- Commissariat a l'Energie Atomique
- Christophe Maleville
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon-on-sapphire transducer
- Patent number 6,424,017
- Issue date Jul 23, 2002
- Kulite Semiconductor Products, Inc.
- Anthony D. Kurtz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Capping layer in interconnect system and method for bonding the cap...
- Patent number 6,388,328
- Issue date May 14, 2002
- Intel Corporation
- Brian Doyle
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE
- Publication number 20140206176
- Publication date Jul 24, 2014
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE
- Publication number 20140203407
- Publication date Jul 24, 2014
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Low Temperature Bonding And Bonded Structure
- Publication number 20120097638
- Publication date Apr 26, 2012
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR LOW TEMPERATURE BONDING AND AND BONDED STRUCTURE
- Publication number 20110067803
- Publication date Mar 24, 2011
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE
- Publication number 20100163169
- Publication date Jul 1, 2010
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE
- Publication number 20090263953
- Publication date Oct 22, 2009
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three dimensional device integration method and integrated device
- Publication number 20080093747
- Publication date Apr 24, 2008
- Ziptronix
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three dimensional device integration method and integrated device
- Publication number 20080061418
- Publication date Mar 13, 2008
- Ziptronix
- Paul Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for low temperature bonding and bonded structure
- Publication number 20080063878
- Publication date Mar 13, 2008
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for low temperature bonding and bonded structure
- Publication number 20080053959
- Publication date Mar 6, 2008
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three dimensional device integration method and integrated device
- Publication number 20060292744
- Publication date Dec 28, 2006
- Ziptronix
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of producing a complex structure by assembling stressed stru...
- Publication number 20060141742
- Publication date Jun 29, 2006
- Franck Fournel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing an external force detection sensor
- Publication number 20060110843
- Publication date May 25, 2006
- Takahiro Oguchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Diamond substrate formation for electronic assemblies
- Publication number 20060073640
- Publication date Apr 6, 2006
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for low temperature bonding and bonded structure
- Publication number 20050079712
- Publication date Apr 14, 2005
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon-on-insulator wafer for RF integrated circuit
- Publication number 20040159908
- Publication date Aug 19, 2004
- Mohammed A. Fathimulla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for low temperature bonding and bonded structure
- Publication number 20040152282
- Publication date Aug 5, 2004
- Ziptronix, Inc.
- Qin-Yin Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming electronic dies wherein each die has a layer of s...
- Publication number 20040121561
- Publication date Jun 24, 2004
- Kramadhati V. Ravi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing an external force detection sensor
- Publication number 20040110318
- Publication date Jun 10, 2004
- Murata Manufacturing Co., Ltd.
- Takahiro Oguchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Silicon-on-insulator wafer for RF integrated circuit
- Publication number 20040002197
- Publication date Jan 1, 2004
- Honeywell International Inc.
- Mohammed A. Fathimulla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for low temperature bonding and bonded structure
- Publication number 20030211705
- Publication date Nov 13, 2003
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three dimensional device integration method and integrated device
- Publication number 20020173120
- Publication date Nov 21, 2002
- Ziptronix
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three dimensional device intergration method and intergrated device
- Publication number 20020094661
- Publication date Jul 18, 2002
- Ziptronix
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TREATMENT PROCESS FOR MOLECULAR BONDING AND UNBONDING OF TWO STRUCT...
- Publication number 20020022337
- Publication date Feb 21, 2002
- CHRISTOPHE MALEVILLE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for making silicon-on-sapphire transducers
- Publication number 20010029087
- Publication date Oct 11, 2001
- Anthony D. Kurtz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Structure and fabrication process of silicon on insulator wafer
- Publication number 20010002329
- Publication date May 31, 2001
- Advanced Materials Engineering Research, Inc.
- Peiching Ling
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Three dimensional device integration method and integrated device

Method for low temperature bonding and bonded structure

Three dimensional device integration method and integrated device

Three dimensional device integration method and integrated device

Method for low temperature bonding and bonded structure

Method for low temperature bonding and bonded structure

Method for low temperature bonding and bonded structure

Method for low temperature bonding and bonded structure

Method for low temperature bonding and bonded structure

Method for low temperature bonding and bonded structure

Method for low temperature bonding and bonded structure

Diamond substrate formation for electronic assemblies

Method for low temperature bonding and bonded structure

Method of producing a complex structure by assembling stressed stru...

Method of manufacturing external force detection sensor

Method for low temperature bonding and bonded structure

Method for low temperature bonding and bonded structure

Three dimensional device integration method and integrated device

Method of manufacturing an external force detection sensor

Method of manufacturing an external force detection sensor

Method for low temperature bonding and bonded structure

Three dimensional device integration method and integrated device

Treatment method of film quality for the manufacture of substrates

Method of forming electronic dies wherein each die has a layer of s...

Three dimensional integrated device

Method for low temperature bonding and bonded structure

Silicon-on-insulator wafer for RF integrated circuit

Treatment process for molecular bonding and unbonding of two struct...

Silicon-on-sapphire transducer

Capping layer in interconnect system and method for bonding the cap...

Patents Applicationslast 30 patents

METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE

METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE

Method For Low Temperature Bonding And Bonded Structure

METHOD FOR LOW TEMPERATURE BONDING AND AND BONDED STRUCTURE

METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE

METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE

Three dimensional device integration method and integrated device

Three dimensional device integration method and integrated device

Method for low temperature bonding and bonded structure

Method for low temperature bonding and bonded structure

Three dimensional device integration method and integrated device

Method of producing a complex structure by assembling stressed stru...

Method of manufacturing an external force detection sensor

Diamond substrate formation for electronic assemblies

Method for low temperature bonding and bonded structure

Silicon-on-insulator wafer for RF integrated circuit

Method for low temperature bonding and bonded structure

Method of forming electronic dies wherein each die has a layer of s...

Method of manufacturing an external force detection sensor

Silicon-on-insulator wafer for RF integrated circuit

Method for low temperature bonding and bonded structure

Three dimensional device integration method and integrated device

Three dimensional device intergration method and intergrated device

TREATMENT PROCESS FOR MOLECULAR BONDING AND UNBONDING OF TWO STRUCT...

Method for making silicon-on-sapphire transducers

Structure and fabrication process of silicon on insulator wafer