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K. Kikuta and T. Kikkawa, "Electromigration Charactistics for Al-Ge-Cu" J. Electrochem. Soc. vol. 143, No. 3, Mar. 1996. |
K. Kikuta, T. Kikkawa and H. Aoki, "0.25 .mu.m Contact Hole Filling By Al-Ge Reflow Sputtering," Microelectronic Research Laboratories, NEC Corporation. |
K. Kikuta and t. Kikkawa, "Al-Ge Reflow Sputtering for Submicron Contact Hole Filling," J. Electrochem. Soc. vol. 143, No. 1, Jan. 1996. |
K. Kikuta, Y. Hayashi, T. Nakajima, K. Harashima and T. Kikkawa, Aluminum-Germanium-Copper Multilevel Damascene Process using Low Temperature Reflow Sputtering and Chemical Mechanical Polishing, IEDM 94-101, 1994 IEEE. |