Claims
- 1. A method of assembling a semiconductor device comprising securing a diaphragm with an aperture therein by means of insulation to a ring-shaped electrode, assembling a spring member on a cylindrical electrode having a flange at one end and inserting the cylindrical electrode through the aperture in the diaphragm and attaching the cylindrical electrode to the diaphragm with the spring-like member in relaxed position between the flange and the diaphragm, assembling a tube-like member to a base and positioning a semiconductor pellet within the tube-like member on the base, positioning the flange of the cylindrical electrode on the semiconductor pellet and compressing the spring member until the ring-shaped electrode engages the tube-like member on the base, and securing the ring-shaped electrode to the tube-like member with the spring member under compression.
- 2. The method described in claim 1 including the steps of assembling a spring compressible electrode coaxial with the cylindrical electrode and insulated therefrom so that the spring compressible electrode contracts and engages the semiconductor pellet under compression when the other two electrodes are assembled to the base assembly.
- 3. A method of assembling a semiconductor device as described in claim 1 including the step of assembling a cup-shaped member to the base within the tube-like member to receive the semiconductor pellet and maintain the semiconductor pellet in centered position within the tube-like member on the base and provide an electrical interface between the base and the pellet.
Parent Case Info
This is a division of application Ser. No. 553,778, filed Feb. 27, 1975 and now abandoned.
US Referenced Citations (3)
Foreign Referenced Citations (1)
Number |
Date |
Country |
1,070,092 |
May 1967 |
UK |
Divisions (1)
|
Number |
Date |
Country |
Parent |
553778 |
Feb 1975 |
|