Claims
- 1. An integrated circuit (IC) package comprising:
a mold compound, the mold compound having a frame embedded therein, said embedded frame having a top surface, a bottom surface, and a top-to-bottom opening therein; a die attached to the mold compound wherein the embedded frame lies below a periphery of the die; and a window attached to the mold compound and located above the die to allow light to reach the die.
- 2. The IC package of claim 1, wherein the embedded frame substantially comprises ceramic.
- 3. The IC package of claim 1, wherein the embedded frame substantially comprises an alloy.
- 4. The IC package of claim 3, wherein the embedded frame substantially comprises alloy-42.
- 5. The IC package of claim 1 further comprising:
a window frame bordering the window, the window frame having a CTE smaller than that of the mold compound.
- 6. The IC package of claim 5, wherein the window frame is made of the same material as that of the embedded frame.
- 7. The IC package of claim 1, wherein the frame lies below a periphery of the die.
- 8. An integrated circuit (IC) package comprising:
a mold compound having a ceramic frame embedded therein; a die having a periphery, wherein the frame lies below the periphery of the die; and a window having a ceramic frame that is attached to the mold compound and is located above the periphery of the die.
- 9. A method of making an IC package, the method comprising:
placing a frame in a mold wherein the frame has a top surface, a bottom surface, and a top-to-bottom opening therein; substantially surrounding the frame with a mold compound; attaching a die to the mold compound including positioning the die so that its periphery lies over the frame; attaching the die to a lead frame of the IC package; and enclosing the die by attaching a window to the mold compound above the die.
- 10. The method of claim 9, wherein substantially surrounding the frame with a mold compound is performed by substantially surrounding a ceramic frame with a mold compound.
- 11. The method of claim 9, wherein substantially surrounding the frame with a mold compound is performed by substantially surrounding an alloy frame with a mold compound.
- 12. The method of claim 10, wherein substantially surrounding the frame with a mold compound is performed by substantially surrounding an alloy-42 frame with a plastic mold compound.
- 13. A method of making an IC package, the method comprising:
attaching a die to a mold compound having a frame embedded within it including positioning the die so that its periphery lies over the frame wherein the frame has a top surface, a bottom surface, and a top-to-bottom opening therein; attaching the die to a lead frame of the IC package; and attaching a window to the mold compound above the die, to enclose the die.
- 14. The method of claim 13, wherein attaching the window to the mold compound further comprises:
attaching the window to an alloy window frame; and attaching the alloy window frame to the mold compound.
- 15. The method of claim 13, wherein attaching the window to the mold compound further comprises:
attaching the window to a ceramic window frame; and attaching the ceramic window frame to the mold compound.
- 16. A method of attaching an IC package to a circuit board, the IC package comprising a mold compound having an embedded frame wherein the frame has a top surface, a bottom surface, and a top-to-bottom opening therein, a lead frame, a die attached to the lead frame, a periphery of the die being located above the embedded frame, and a window located above the die to allow light to reach the die, the method comprising:
placing the IC package in proximity to the circuit board; and attaching the IC package to the circuit board via a mass reflow process.
- 17. The method of claim 16, wherein attaching the IC package to the circuit board comprises heating the IC package to above 215° C.
- 18. An IC package substantially as herein described with reference to and as shown in FIGS. 5-9B of the accompanying drawings.
- 19. A method as claimed in claims 9, 13, or 16 substantially as herein described with reference to and as shown in FIGS. 5-9B of the accompanying drawings.
Parent Case Info
[0001] This application is a continuation of Ser. No. 09/546,225, filed Apr. 10, 2002, which is a divisional of Ser. No. 09/219,186, filed on Dec. 21, 1998, which is a continuation-in-part of application Ser. No. 09/172,734, filed on Oct. 13, 1998, entitled “Image Sensor Mounted by Mass Reflow.”
Divisions (1)
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Number |
Date |
Country |
Parent |
09219186 |
Dec 1998 |
US |
Child |
09546225 |
Apr 2000 |
US |
Continuations (1)
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Number |
Date |
Country |
Parent |
09546225 |
Apr 2000 |
US |
Child |
10777373 |
Feb 2004 |
US |
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
09172734 |
Oct 1998 |
US |
Child |
09219186 |
Dec 1998 |
US |