ADVANCED CHIP ENGINEERING TECHNOLOGY, INC

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HSINCHU HSIANG, TW

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Patents Grantslast 30 patents

Information Patent Grant
Wafer level package with die receiving through-hole and method of t...
- Patent number 8,178,963
- Issue date May 15, 2012
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with die receiving through-hole and du...
- Patent number 8,178,964
- Issue date May 15, 2012
- Advanced Chip Engineering Technology, Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 8,058,102
- Issue date Nov 15, 2011
- Advanced Chip Engineering Technology Inc.
- Diann-Fang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing tool for wafer level package and method of placing dies
- Patent number 7,985,626
- Issue date Jul 26, 2011
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
RF module package for releasing stress
- Patent number 7,911,044
- Issue date Mar 22, 2011
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor package and forming method of the same
- Patent number 7,863,105
- Issue date Jan 4, 2011
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package with die receiving through-hole and method of t...
- Patent number 7,812,434
- Issue date Oct 12, 2010
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with multi-chips and method of the same
- Patent number 7,763,494
- Issue date Jul 27, 2010
- Advanced Chip Engineering Technology, Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having a back side protective scheme
- Patent number 7,687,923
- Issue date Mar 30, 2010
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan out type wafer level package structure and method of the same
- Patent number 7,667,318
- Issue date Feb 23, 2010
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package with good CTE performance
- Patent number 7,655,501
- Issue date Feb 2, 2010
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor module
- Patent number 7,566,854
- Issue date Jul 28, 2009
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Fan out type wafer level package structure and method of the same
- Patent number 7,557,437
- Issue date Jul 7, 2009
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for circuits inspection and method of the same
- Patent number 7,534,632
- Issue date May 19, 2009
- Advanced Chip Engineering Technology Inc.
- Yu-Shan Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device package having multi-chips with side-by-side c...
- Patent number 7,525,185
- Issue date Apr 28, 2009
- Advanced Chip Engineering Technology, Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor with a protection layer
- Patent number 7,525,139
- Issue date Apr 28, 2009
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fan out type wafer level package structure and method of the same
- Patent number 7,514,767
- Issue date Apr 7, 2009
- Advanced Chip Engineering Technology Inc.
- Wen Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure of image sensor module and method for manufacturing of wa...
- Patent number 7,501,310
- Issue date Mar 10, 2009
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure of image sensor module and a method for manufacturing of...
- Patent number 7,498,646
- Issue date Mar 3, 2009
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming filling paste structure of WL package
- Patent number 7,476,565
- Issue date Jan 13, 2009
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and process for WL-CSP with metal cover
- Patent number 7,468,544
- Issue date Dec 23, 2008
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor image device package with die receiving through-hole...
- Patent number 7,459,729
- Issue date Dec 2, 2008
- Advanced Chip Engineering Technology, Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure of dielectric layers in built-up layers of wafer level pa...
- Patent number 7,453,148
- Issue date Nov 18, 2008
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system of trace pull test
- Patent number 7,446,546
- Issue date Nov 4, 2008
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- G01 - MEASURING TESTING
Information Patent Grant
Sensor module package structure and method of the same
- Patent number 7,423,335
- Issue date Sep 9, 2008
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device protective structure and method for fabricatin...
- Patent number 7,416,920
- Issue date Aug 26, 2008
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer street buffer layer
- Patent number 7,342,296
- Issue date Mar 11, 2008
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-size package structure and method of the same
- Patent number 7,339,279
- Issue date Mar 4, 2008
- Advanced Chip Engineering Technology Inc.
- Wen Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for image sensor protection
- Patent number 7,335,870
- Issue date Feb 26, 2008
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system of trace pull test
- Patent number 7,319,043
- Issue date Jan 15, 2008
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- G01 - MEASURING TESTING

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Patents Applicationslast 30 patents

Information Patent Application
CONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAME
- Publication number 20110209908
- Publication date Sep 1, 2011
- Advanced Chip Engineering Technology Inc.
- Diann-Fang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20110193216
- Publication date Aug 11, 2011
- Advanced Chip Engineering Technology Inc.
- Diann-Fang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAME
- Publication number 20110180891
- Publication date Jul 28, 2011
- Advanced Chip Engineering Technology Inc.
- Diann-Fang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20110108977
- Publication date May 12, 2011
- Advanced Chip Engineering Technology Inc.
- Diann-Fang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAME
- Publication number 20110031594
- Publication date Feb 10, 2011
- Advanced Chip Engineering Technology Inc.
- Diann-Fang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAME
- Publication number 20110031607
- Publication date Feb 10, 2011
- Advanced Chip Engineering Technology Inc.
- Diann-Fang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK SIDE PROTECTIVE STRUCTURE FOR A SEMICONDUCTOR PACKAGE
- Publication number 20100109156
- Publication date May 6, 2010
- Advanced Chip Engineering Technology Inc.
- Yu-Shan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTER-CONNECTING STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD FOR...
- Publication number 20100007017
- Publication date Jan 14, 2010
- Advanced Chip Engineering Technology Inc.
- Shih-Chuan Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System-in-package and manufacturing method of the same
- Publication number 20090321915
- Publication date Dec 31, 2009
- Advanced Chip Engineering Technology Inc.
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RE-DISTRIBUTION CONDUCTIVE LINE STRUCTURE AND THE METHOD OF FORMING...
- Publication number 20090212428
- Publication date Aug 27, 2009
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive line structure and the method of forming the same
- Publication number 20090184425
- Publication date Jul 23, 2009
- Advanced Chip Engineering Technology Inc.
- Yu-Shan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTER-CONNECTING STRUCTURE FOR SEMICONDUCTOR DEVICE PACKAGE AND MET...
- Publication number 20090166873
- Publication date Jul 2, 2009
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDER BUMP METALLURGY STRUCTURE OF SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20090160052
- Publication date Jun 25, 2009
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacking die package structure for semiconductor devices and method...
- Publication number 20090127686
- Publication date May 21, 2009
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTER-CONNECTING STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD OF...
- Publication number 20090096098
- Publication date Apr 16, 2009
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTER-CONNECTING STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD OF...
- Publication number 20090096093
- Publication date Apr 16, 2009
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN OUT TYPE WAFER LEVEL PACKAGE STRUCTURE AND METHOD OF THE SAME
- Publication number 20090051025
- Publication date Feb 26, 2009
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING A BACK SIDE PROTECTIVE SCHEME
- Publication number 20090039497
- Publication date Feb 12, 2009
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING A BACK SIDE PROTECTIVE SCHEME
- Publication number 20090039532
- Publication date Feb 12, 2009
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTER-CONNECTING STRUCTURE FOR SEMICONDUCTOR DEVICE PACKAGE AND MET...
- Publication number 20090008777
- Publication date Jan 8, 2009
- Advanced Chip Engineering Technology Inc.
- Diann-Fang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGE UTILIZING A REMOVABLE PROTECTION FILM AND METH...
- Publication number 20090008729
- Publication date Jan 8, 2009
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRACE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20080308307
- Publication date Dec 18, 2008
- ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
- Jui-Hsien Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device package with multi-chips and method of the same
- Publication number 20080274593
- Publication date Nov 6, 2008
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer level image sensor package with die receiving cavity and meth...
- Publication number 20080274579
- Publication date Nov 6, 2008
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PLASMA ETCHING WITH PATTERN MASK
- Publication number 20080268647
- Publication date Oct 30, 2008
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PANEL/WAFER MOLDING APPARATUS AND METHOD OF THE SAME
- Publication number 20080265462
- Publication date Oct 30, 2008
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGE WITH RELEASING LAYER AND METHOD FOR FORMING THE SAME
- Publication number 20080265393
- Publication date Oct 30, 2008
- Advanced Chip Engineering Technology Inc.
- Diann-Fang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE TO IMPROVE FUNCTIONS OF HEAT SINK AND...
- Publication number 20080258293
- Publication date Oct 23, 2008
- ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device package having multi-chips with side-by-side c...
- Publication number 20080251908
- Publication date Oct 16, 2008
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE WITH GOOD CTE PERFORMANCE
- Publication number 20080248614
- Publication date Oct 9, 2008
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS

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Trademarklast 30 trademarks

Information Trademark
85010058 - 3DSIP
- Serial number 85010058
- Filing date Apr 9, 2010
- Advanced Chip Engineering Technology Inc.
- 35 - Advertising
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77081541 - UPTEK
- Serial number 77081541
- Registration number 3460167
- Filing date Jan 11, 2007
- Advanced Chip Engineering Technology Inc.
- 35 - Advertising
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77081544 - UP
- Serial number 77081544
- Registration number 3460168
- Filing date Jan 11, 2007
- Advanced Chip Engineering Technology Inc.
- 35 - Advertising
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77072332 - PBP
- Serial number 77072332
- Registration number 3460155
- Filing date Dec 28, 2006
- Advanced Chip Engineering Technology Inc.
- 35 - Advertising
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77072329 - WSP
- Serial number 77072329
- Registration number 3460154
- Filing date Dec 28, 2006
- Advanced Chip Engineering Technology Inc.
- 35 - Advertising
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77072331 - PSP
- Serial number 77072331
- Filing date Dec 28, 2006
- Advanced Chip Engineering Technology Inc.
- 35 - Advertising
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77072334 - PIP
- Serial number 77072334
- Filing date Dec 28, 2006
- Advanced Chip Engineering Technology Inc.
- 35 - Advertising
Information Trademark
78479937 - AMEBA-LGA
- Serial number 78479937
- Registration number 3298833
- Filing date Sep 8, 2004
- Advanced Chip Engineering Technology Inc.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
78479267 - AMEBA-SIP
- Serial number 78479267
- Registration number 3298829
- Filing date Sep 7, 2004
- Advanced Chip Engineering Technology Inc.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
78479250 - SIP
- Serial number 78479250
- Registration number 3298827
- Filing date Sep 7, 2004
- Advanced Chip Engineering Technology Inc.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
78479268 - AMEBA-BGA
- Serial number 78479268
- Registration number 3298830
- Filing date Sep 7, 2004
- Advanced Chip Engineering Technology Inc.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
78479249 - LGA
- Serial number 78479249
- Registration number 3298826
- Filing date Sep 7, 2004
- Advanced Chip Engineering Technology Inc.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
78479251 - BGA
- Serial number 78479251
- Registration number 3298828
- Filing date Sep 7, 2004
- Advanced Chip Engineering Technology Inc.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
78478344 - AMEBA-CSP
- Serial number 78478344
- Registration number 3298823
- Filing date Sep 3, 2004
- Advanced Chip Engineering Technology Inc.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
78475959 - CSP
- Serial number 78475959
- Filing date Aug 30, 2004
- Advanced Chip Engineering Technology Inc.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments

ADVANCED CHIP ENGINEERING TECHNOLOGY, INC

Organization

Patents Grantslast 30 patents

Wafer level package with die receiving through-hole and method of t...

Semiconductor device package with die receiving through-hole and du...

Package structure and manufacturing method thereof

Manufacturing tool for wafer level package and method of placing dies

RF module package for releasing stress

Image sensor package and forming method of the same

Wafer level package with die receiving through-hole and method of t...

Semiconductor device package with multi-chips and method of the same

Semiconductor device package having a back side protective scheme

Fan out type wafer level package structure and method of the same

Wafer level package with good CTE performance

Image sensor module

Fan out type wafer level package structure and method of the same

Method for circuits inspection and method of the same

Semiconductor device package having multi-chips with side-by-side c...

Image sensor with a protection layer

Fan out type wafer level package structure and method of the same

Structure of image sensor module and method for manufacturing of wa...

Structure of image sensor module and a method for manufacturing of...

Method for forming filling paste structure of WL package

Structure and process for WL-CSP with metal cover

Semiconductor image device package with die receiving through-hole...

Structure of dielectric layers in built-up layers of wafer level pa...

Method and system of trace pull test

Sensor module package structure and method of the same

Semiconductor device protective structure and method for fabricatin...

Wafer street buffer layer

Chip-size package structure and method of the same

Method for image sensor protection

Method and system of trace pull test

Patents Applicationslast 30 patents

CONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAME

PACKAGE STRUCTURE

CONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAME

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

CONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAME

CONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAME

BACK SIDE PROTECTIVE STRUCTURE FOR A SEMICONDUCTOR PACKAGE

INTER-CONNECTING STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD FOR...

System-in-package and manufacturing method of the same

RE-DISTRIBUTION CONDUCTIVE LINE STRUCTURE AND THE METHOD OF FORMING...

Conductive line structure and the method of forming the same

INTER-CONNECTING STRUCTURE FOR SEMICONDUCTOR DEVICE PACKAGE AND MET...

UNDER BUMP METALLURGY STRUCTURE OF SEMICONDUCTOR DEVICE PACKAGE

Stacking die package structure for semiconductor devices and method...

INTER-CONNECTING STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD OF...

INTER-CONNECTING STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD OF...

FAN OUT TYPE WAFER LEVEL PACKAGE STRUCTURE AND METHOD OF THE SAME

SEMICONDUCTOR DEVICE PACKAGE HAVING A BACK SIDE PROTECTIVE SCHEME

SEMICONDUCTOR DEVICE PACKAGE HAVING A BACK SIDE PROTECTIVE SCHEME

INTER-CONNECTING STRUCTURE FOR SEMICONDUCTOR DEVICE PACKAGE AND MET...

IMAGE SENSOR PACKAGE UTILIZING A REMOVABLE PROTECTION FILM AND METH...

TRACE STRUCTURE AND METHOD FOR FABRICATING THE SAME

Semiconductor device package with multi-chips and method of the same

Wafer level image sensor package with die receiving cavity and meth...

METHOD OF PLASMA ETCHING WITH PATTERN MASK

PANEL/WAFER MOLDING APPARATUS AND METHOD OF THE SAME

STACK PACKAGE WITH RELEASING LAYER AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE PACKAGE TO IMPROVE FUNCTIONS OF HEAT SINK AND...

Semiconductor device package having multi-chips with side-by-side c...

WAFER LEVEL PACKAGE WITH GOOD CTE PERFORMANCE

Trademarklast 30 trademarks

85010058 - 3DSIP

77081541 - UPTEK

77081544 - UP

77072332 - PBP

77072329 - WSP

77072331 - PSP

77072334 - PIP

78479937 - AMEBA-LGA

78479267 - AMEBA-SIP

78479250 - SIP

78479268 - AMEBA-BGA

78479249 - LGA

78479251 - BGA

78478344 - AMEBA-CSP

78475959 - CSP