GEM Services, Inc.

Organization

Santa Clara, CA, US

Business Address
555 TWIN DOLPHIN DR SUITE 165 REDWOOD CITY CA 94065
State Location
CA
State of Incorporation

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
Bi-directional, reverse blocking battery switch
- Patent number 8,558,368
- Issue date Oct 15, 2013
- GEM Services, Inc.
- James Harnden
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor package featuring flip-chip die sandwiched between me...
- Patent number 8,358,017
- Issue date Jan 22, 2013
- GEM Services, Inc.
- Anthony C. Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection of lead frame to die utilizing flip chip process
- Patent number 8,120,154
- Issue date Feb 21, 2012
- GEM Services, Inc.
- Mohammad Eslamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having features formed by stamping
- Patent number 8,106,493
- Issue date Jan 31, 2012
- GEM Services, Inc.
- Anthony C. Tsui
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device package having features formed by stamping
- Patent number 7,838,339
- Issue date Nov 23, 2010
- GEM Services, Inc.
- Anthony C. Tsui
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Interconnection of lead frame to die utilizing flip chip process
- Patent number 7,691,670
- Issue date Apr 6, 2010
- GEM Services, Inc.
- Mohammad Eslamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Space-efficient package for laterally conducting device
- Patent number 7,667,309
- Issue date Feb 23, 2010
- GEM Services, Inc.
- James Harnden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical-enhanced package singulation process
- Patent number 7,553,700
- Issue date Jun 30, 2009
- GEM Services, Inc.
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
4040-28J matrix leadframe
- Patent number D588557
- Issue date Mar 17, 2009
- GEM Services, Inc.
- James Harnden
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
2021-8J matrix leadframe
- Patent number D588080
- Issue date Mar 10, 2009
- GEM Services, Inc.
- James Harnden
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Space-efficient package for laterally conducting device
- Patent number 7,485,498
- Issue date Feb 3, 2009
- GEM Services, Inc.
- James Harnden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package diepad having features formed by elect...
- Patent number 7,382,044
- Issue date Jun 3, 2008
- GEM Services, Inc.
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad-24JW surface mount package
- Patent number D560623
- Issue date Jan 29, 2008
- GEM Services, Inc.
- James Harnden
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Quad-28JW surface mount package
- Patent number D558694
- Issue date Jan 1, 2008
- GEM Services, Inc.
- James Harnden
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Space-efficient package for laterally conducting device
- Patent number 7,215,012
- Issue date May 8, 2007
- GEM Services, Inc.
- James Harnden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package diepad having features formed by elect...
- Patent number 7,122,406
- Issue date Oct 17, 2006
- GEM Services, Inc.
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mount package
- Patent number 7,057,273
- Issue date Jun 6, 2006
- GEM Services, Inc.
- James Harnden
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Portion of a matrix for surface mount package leadframe
- Patent number D513608
- Issue date Jan 17, 2006
- GEM Services, Inc.
- James Harnden
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Portion of a matrix for surface mount package leadframe
- Patent number D505121
- Issue date May 17, 2005
- GEM Services, Inc.
- James Harnden
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Portion of a matrix for surface mount package leadframe
- Patent number D505122
- Issue date May 17, 2005
- GEM Services, Inc.
- James Harnden
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Portion of a matrix for surface mount package leadframe
- Patent number D494939
- Issue date Aug 24, 2004
- GEM Services, Inc.
- James Harnden
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Portion of a matrix for surface mount package leadframe
- Patent number D492266
- Issue date Jun 29, 2004
- GEM Services, Inc.
- James Harnden
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Portion of a matrix for surface mount package leadframe
- Patent number D491900
- Issue date Jun 22, 2004
- GEM Services, Inc.
- James Harnden
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Portion of a matrix for surface mount package leadframe
- Patent number D488136
- Issue date Apr 6, 2004
- GEM Services, Inc.
- James Harnden
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Portion of a matrix for surface mount package leadframe
- Patent number D487432
- Issue date Mar 9, 2004
- GEM Services, Inc.
- James Harnden
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Portion of a matrix for surface mount package leadframe
- Patent number D487431
- Issue date Mar 9, 2004
- GEM Services, Inc.
- James Harnden
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Portion of a matrix for surface mount package leadframe
- Patent number D486802
- Issue date Feb 17, 2004
- GEM Services, Inc.
- James Harnden
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Portion of a matrix for surface mount package leadframe
- Patent number D485808
- Issue date Jan 27, 2004
- GEM Services, Inc.
- James Harnden
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Portion of a matrix for surface mount package leadframe
- Patent number D485244
- Issue date Jan 13, 2004
- GEM Services, Inc.
- James Harnden
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Portion of a matrix for surface mount package leadframe
- Patent number D485243
- Issue date Jan 13, 2004
- GEM Services, Inc.
- James Harnden
- D13 - Equipment for production, distribution, or transformation of energy

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Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE FEATURING FLIP-CHIP DIE SANDWICHED BETWEEN ME...
- Publication number 20130105974
- Publication date May 2, 2013
- GEM Services, Inc.
- Anthony C. Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE PACKAGE WITH A HEATSINK
- Publication number 20130017652
- Publication date Jan 17, 2013
- GEM Services, Inc.
- Anthony C. Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING FEATURES FORMED BY STAMPING
- Publication number 20130009296
- Publication date Jan 10, 2013
- GEM Services, Inc.
- Anthony C. Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING CONFIGURABLE LEAD FRAME FINGERS
- Publication number 20130009297
- Publication date Jan 10, 2013
- GEM Services, Inc.
- Anthony C. Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH TWO COMPONENT LEAD FRAME
- Publication number 20120181677
- Publication date Jul 19, 2012
- GEM Services, Inc.
- Anthony C. Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE PACKAGING
- Publication number 20120181676
- Publication date Jul 19, 2012
- GEM Service, Inc.
- Anthony C. Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BI-DIRECTIONAL, REVERSE BLOCKING BATTERY SWITCH
- Publication number 20120056261
- Publication date Mar 8, 2012
- GEM Services, Inc.
- James Harnden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE FEATURING ENCAPSULATED LEADFRAME WITH...
- Publication number 20110291254
- Publication date Dec 1, 2011
- GEM Services, Inc.
- James Harnden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING FEATURES FORMED BY STAMPING
- Publication number 20110024886
- Publication date Feb 3, 2011
- GEM Services, Inc.
- Anthony C. Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION OF LEAD FRAME TO DIE UTILIZING FLIP CHIP PROCESS
- Publication number 20100140762
- Publication date Jun 10, 2010
- GEM Services, Inc.
- Mohammad Eslamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE FEATURING FLIP-CHIP DIE SANDWICHED BETWEEN ME...
- Publication number 20090283919
- Publication date Nov 19, 2009
- GEM Services, Inc.
- Anthony C. Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION OF LEAD FRAME TO DIE UTILIZING FLIP CHIP PROCESS
- Publication number 20090273065
- Publication date Nov 5, 2009
- GEM Services, Inc.
- Mohammad Eslamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING FEATURES FORMED BY STAMPING
- Publication number 20090250796
- Publication date Oct 8, 2009
- GEM Services, Inc.
- Anthony C. Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BI-DIRECTIONAL, REVERSE BLOCKING BATTERY SWITCH
- Publication number 20090179265
- Publication date Jul 16, 2009
- GEM Services, Inc.
- James Harnden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Space-efficient package for laterally conducting device
- Publication number 20080217662
- Publication date Sep 11, 2008
- GEM Services, Inc.
- James Harnden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device package diepad having features formed by elect...
- Publication number 20080142936
- Publication date Jun 19, 2008
- GEM Services, Inc.
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE FEATURING ENCAPSULATED LEADFRAME WITH...
- Publication number 20080135991
- Publication date Jun 12, 2008
- GEM Services, Inc.
- James Harnden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE DESIGNS FOR VERTICAL CONDUCTION DIE
- Publication number 20080111219
- Publication date May 15, 2008
- GEM Services, Inc.
- James Harnden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Space-efficient package for laterally conducting device
- Publication number 20070134851
- Publication date Jun 14, 2007
- GEM Services, Inc.
- James Harnden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device package leadframe formed from multiple metal l...
- Publication number 20070130759
- Publication date Jun 14, 2007
- GEM Services, Inc.
- James Harnden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface mount package
- Publication number 20070007640
- Publication date Jan 11, 2007
- GEM Services, Inc.
- James Harnden
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Chemical-enhanced package singulation process
- Publication number 20050255634
- Publication date Nov 17, 2005
- GEM Services, Inc.
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface mount package
- Publication number 20050145998
- Publication date Jul 7, 2005
- GEM Services, Inc.
- James Harnden
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Space-efficient package for laterally conducting device
- Publication number 20040173881
- Publication date Sep 9, 2004
- GEM Services, Inc.
- James Harnden
- H01 - BASIC ELECTRIC ELEMENTS

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Trademarklast 30 trademarks

Information Trademark
78256899 - GEM SERVICES
- Serial number 78256899
- Filing date Jun 2, 2003
- GEM Services, Inc.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments

GEM Services, Inc.

Organization

Business Address

State Location

State of Incorporation

Patents Grantslast 30 patents

Bi-directional, reverse blocking battery switch

Semiconductor package featuring flip-chip die sandwiched between me...

Interconnection of lead frame to die utilizing flip chip process

Semiconductor device package having features formed by stamping

Semiconductor device package having features formed by stamping

Interconnection of lead frame to die utilizing flip chip process

Space-efficient package for laterally conducting device

Chemical-enhanced package singulation process

4040-28J matrix leadframe

2021-8J matrix leadframe

Space-efficient package for laterally conducting device

Semiconductor device package diepad having features formed by elect...

Quad-24JW surface mount package

Quad-28JW surface mount package

Space-efficient package for laterally conducting device

Semiconductor device package diepad having features formed by elect...

Surface mount package

Portion of a matrix for surface mount package leadframe

Portion of a matrix for surface mount package leadframe

Portion of a matrix for surface mount package leadframe

Portion of a matrix for surface mount package leadframe

Portion of a matrix for surface mount package leadframe

Portion of a matrix for surface mount package leadframe

Portion of a matrix for surface mount package leadframe

Portion of a matrix for surface mount package leadframe

Portion of a matrix for surface mount package leadframe

Portion of a matrix for surface mount package leadframe

Portion of a matrix for surface mount package leadframe

Portion of a matrix for surface mount package leadframe

Portion of a matrix for surface mount package leadframe

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE FEATURING FLIP-CHIP DIE SANDWICHED BETWEEN ME...

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE PACKAGE WITH A HEATSINK

SEMICONDUCTOR DEVICE PACKAGE HAVING FEATURES FORMED BY STAMPING

SEMICONDUCTOR DEVICE PACKAGE HAVING CONFIGURABLE LEAD FRAME FINGERS

SEMICONDUCTOR DEVICE PACKAGE WITH TWO COMPONENT LEAD FRAME

POWER SEMICONDUCTOR DEVICE PACKAGING

BI-DIRECTIONAL, REVERSE BLOCKING BATTERY SWITCH

SEMICONDUCTOR DEVICE PACKAGE FEATURING ENCAPSULATED LEADFRAME WITH...

SEMICONDUCTOR DEVICE PACKAGE HAVING FEATURES FORMED BY STAMPING

INTERCONNECTION OF LEAD FRAME TO DIE UTILIZING FLIP CHIP PROCESS

SEMICONDUCTOR PACKAGE FEATURING FLIP-CHIP DIE SANDWICHED BETWEEN ME...

INTERCONNECTION OF LEAD FRAME TO DIE UTILIZING FLIP CHIP PROCESS

SEMICONDUCTOR DEVICE PACKAGE HAVING FEATURES FORMED BY STAMPING

BI-DIRECTIONAL, REVERSE BLOCKING BATTERY SWITCH

Space-efficient package for laterally conducting device

Semiconductor device package diepad having features formed by elect...

SEMICONDUCTOR DEVICE PACKAGE FEATURING ENCAPSULATED LEADFRAME WITH...

PACKAGE DESIGNS FOR VERTICAL CONDUCTION DIE

Space-efficient package for laterally conducting device

Semiconductor device package leadframe formed from multiple metal l...

Surface mount package

Chemical-enhanced package singulation process

Surface mount package

Space-efficient package for laterally conducting device

Trademarklast 30 trademarks

78256899 - GEM SERVICES