HongQiSheng Precision Electronics (QinHuanDao) Co., Ltd.

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QinHuandao, CN

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Patents Grantslast 30 patents

Information Patent Grant
Circuit board and method of manufacturing thereof
- Patent number 12,120,812
- Issue date Oct 15, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Hao-Yi Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and preparation method thereof
- Patent number 12,114,424
- Issue date Oct 8, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Mei Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Board-to-board connection structure and method for manufacturing th...
- Patent number 12,028,976
- Issue date Jul 2, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Jian-Yi Hao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing multilayer printed circuit board
- Patent number 12,016,119
- Issue date Jun 18, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Cheng-Jia Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 11,985,764
- Issue date May 14, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Yang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing transparent circuit board
- Patent number 11,950,371
- Issue date Apr 2, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Cheng-Jia Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Camera module of reduced size and method for manufacturing the same
- Patent number 11,917,278
- Issue date Feb 27, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Man-Zhi Peng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Circuit board and method of manufacturing circuit board
- Patent number 11,871,526
- Issue date Jan 9, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Jun Dai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaging structure with embedded electronic components and method...
- Patent number 11,864,329
- Issue date Jan 2, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Chih-Chieh Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of circuit board assembly
- Patent number 11,825,595
- Issue date Nov 21, 2023
- HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO., LTD.
- Mao-Feng Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board assembly and manufacturing method thereof
- Patent number 11,792,914
- Issue date Oct 17, 2023
- AVARY HOLDING (SHENZHEN) CO., LTD.
- Zhi-Hong Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board with embedded electronic component and method for man...
- Patent number 11,778,752
- Issue date Oct 3, 2023
- Avary Holding (Shenzhen) Co., Limited.
- Hsiao-Ting Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a circuit board
- Patent number 11,700,698
- Issue date Jul 11, 2023
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Hao-Yi Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method of manufacturing the same
- Patent number 11,696,391
- Issue date Jul 4, 2023
- AVARY HOLDING (SHENZHEN) CO., LTD.
- Mao-Feng Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing composite circuit board
- Patent number 11,672,083
- Issue date Jun 6, 2023
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Yang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a circuit board with embedded nickel resistor
- Patent number 11,665,831
- Issue date May 30, 2023
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Jian Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a circuit board
- Patent number 11,627,668
- Issue date Apr 11, 2023
- Avary Holding (Shenzhen) Co., Limited.
- Yong-Chao Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 11,617,263
- Issue date Mar 28, 2023
- Avary Holding (Shenzhen) Co., Limited.
- Lin-Jie Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board, method for manufacturing the same
- Patent number 11,606,862
- Issue date Mar 14, 2023
- Avary Holding (Shenzhen) Co., Limited.
- Po-Yuan Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 11,582,872
- Issue date Feb 14, 2023
- Avary Holding (Shenzhen) Co., Limited.
- Ke-Jian Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing flexible circuit board
- Patent number 11,582,859
- Issue date Feb 14, 2023
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Bao-Jun Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a circuit board
- Patent number 11,570,883
- Issue date Jan 31, 2023
- Avary Holding (Shenzhen) Co., Limited.
- Ying Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
All-directions embeded module, method for manufacturing the all-dir...
- Patent number 11,483,931
- Issue date Oct 25, 2022
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Chih-Chieh Fu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for connecting stacked circuit boards
- Patent number 11,483,938
- Issue date Oct 25, 2022
- Avary Holding (Shenzhen) Co., Limited.
- Rui-Wu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board
- Patent number 11,399,436
- Issue date Jul 26, 2022
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Chih-Chieh Fu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making a heat dissipation structure
- Patent number 11,380,603
- Issue date Jul 5, 2022
- Avary Holding (Shenzhen) Co., Limited.
- Fu-Yun Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a packaging structure
- Patent number 11,375,619
- Issue date Jun 28, 2022
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Chih-Chieh Fu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a circuit board
- Patent number 11,304,312
- Issue date Apr 12, 2022
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Hao-Yi Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing circuit board
- Patent number 11,294,285
- Issue date Apr 5, 2022
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Xian-Qin Hu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Package structure and method for manufacturing the same
- Patent number 11,289,468
- Issue date Mar 29, 2022
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Chih-Chieh Fu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD, MANUFACTURING METHOD, AND DISPLAY MODULE
- Publication number 20240284608
- Publication date Aug 22, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Gang Yuan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP PACKAGING STRUCTURE AND METHOD FOR PACKAGING THE CHIP
- Publication number 20240213036
- Publication date Jun 27, 2024
- Avary Holding (Shenzhen) Co., Limited.
- ZHI-YONG HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSPARENT CIRCUIT BOARD
- Publication number 20240196541
- Publication date Jun 13, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- CHENG-JIA LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD ASSEMBLY AND METHOD OF MANUFACTURING THE SAME, PACKAG...
- Publication number 20240147629
- Publication date May 2, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHANG-HE ZHU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD CONNECTION STRUCTURE AND PREPARATION METHOD THEREFOR
- Publication number 20240098908
- Publication date Mar 21, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHIH-CHIEH FU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD ASSEMBLY
- Publication number 20240040687
- Publication date Feb 1, 2024
- Avary Holding (Shenzhen) Co., Ltd.
- Mao-Feng HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240006748
- Publication date Jan 4, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHIH-CHIEH FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BURIED THERMISTOR AND METHOD OF FABRICATING THE SAME
- Publication number 20230377779
- Publication date Nov 23, 2023
- HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
- Jian WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE WITH EMBEDDED ELECTRONIC COMPONENTS AND METHOD...
- Publication number 20230345643
- Publication date Oct 26, 2023
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHIH-CHIEH FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20230199954
- Publication date Jun 22, 2023
- Avary Holding (Shenzhen) Co., Limited.
- LIN-JIE GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD WITH EMBEDDED COMPONENT AND METHOD OF FABRICATING THE...
- Publication number 20230199966
- Publication date Jun 22, 2023
- Avary Holding (Shenzhen) Co., Ltd.
- Zi-Qiang GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD ASSEMBLY AND MANUFACTURING METHOD THEREOF
- Publication number 20230171875
- Publication date Jun 1, 2023
- Avary Holding (Shenzhen) Co., Ltd.
- Mao-Feng HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD ASSEMBLY AND MANUFACTURING METHOD THEREOF
- Publication number 20230171876
- Publication date Jun 1, 2023
- Avary Holding (Shenzhen) Co., Ltd.
- Zhi-Hong YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING THEREOF
- Publication number 20230171877
- Publication date Jun 1, 2023
- HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
- Hao-Yi WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING DISPLAY MODULE WITH LIGHT EMITTING DIODE FR...
- Publication number 20230155055
- Publication date May 18, 2023
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHENG-JIA LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230125928
- Publication date Apr 27, 2023
- Avary Holding (Shenzhen) Co., Limited.
- YING WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSPARENT CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230089856
- Publication date Mar 23, 2023
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHENG-JIA LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER CIRCUIT BOARD WITH EMBEDDED COMPONENTS AND METHOD FOR M...
- Publication number 20220418101
- Publication date Dec 29, 2022
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHENG-JIA LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220377873
- Publication date Nov 24, 2022
- Avary Holding (Shenzhen) Co., Limited.
- YING WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, METHOD FOR MANUFACTURING THE SAME
- Publication number 20220369467
- Publication date Nov 17, 2022
- Avary Holding (Shenzhen) Co., Limited.
- PO-YUAN CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, METHOD FOR MANUFACTURING THE SAME
- Publication number 20220369475
- Publication date Nov 17, 2022
- Avary Holding (Shenzhen) Co., Limited.
- YONG-CHAO WEI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220338348
- Publication date Oct 20, 2022
- Avary Holding (Shenzhen) Co., Limited.
- LIN-JIE GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOARD-TO-BOARD CONNECTION STRUCTURE AND METHOD FOR MANUFACTURING TH...
- Publication number 20220338350
- Publication date Oct 20, 2022
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- JIAN-YI HAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD WITH EMBEDDED ELECTRONIC COMPONENT AND METHOD FOR MAN...
- Publication number 20220312598
- Publication date Sep 29, 2022
- Avary Holding (Shenzhen) Co., Limited.
- HSIAO-TING HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGING STRUCTURE
- Publication number 20220279655
- Publication date Sep 1, 2022
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHIH-CHIEH FU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220248535
- Publication date Aug 4, 2022
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- YANG LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAMERA MODULE OF REDUCED SIZE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220232152
- Publication date Jul 21, 2022
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- MAN-ZHI PENG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD FOR MANUFACTURING A CIRCUIT BOARD
- Publication number 20220192034
- Publication date Jun 16, 2022
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- HAO-YI WEI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD
- Publication number 20220174822
- Publication date Jun 2, 2022
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- JUN DAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD
- Publication number 20220095451
- Publication date Mar 24, 2022
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHENG-JIA LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

HongQiSheng Precision Electronics (QinHuanDao) Co., Ltd.

Organization

Patents Grantslast 30 patents

Circuit board and method of manufacturing thereof

Circuit board and preparation method thereof

Board-to-board connection structure and method for manufacturing th...

Method for manufacturing multilayer printed circuit board

Circuit board and method for manufacturing the same

Method for manufacturing transparent circuit board

Camera module of reduced size and method for manufacturing the same

Circuit board and method of manufacturing circuit board

Packaging structure with embedded electronic components and method...

Manufacturing method of circuit board assembly

Circuit board assembly and manufacturing method thereof

Circuit board with embedded electronic component and method for man...

Method for manufacturing a circuit board

Wiring substrate and method of manufacturing the same

Method of manufacturing composite circuit board

Method for manufacturing a circuit board with embedded nickel resistor

Method for manufacturing a circuit board

Circuit board and method for manufacturing the same

Circuit board, method for manufacturing the same

Circuit board

Method for manufacturing flexible circuit board

Method for manufacturing a circuit board

All-directions embeded module, method for manufacturing the all-dir...

Method for connecting stacked circuit boards

Circuit board

Method for making a heat dissipation structure

Method for manufacturing a packaging structure

Method for manufacturing a circuit board

Method for manufacturing circuit board

Package structure and method for manufacturing the same

Patents Applicationslast 30 patents

CIRCUIT BOARD, MANUFACTURING METHOD, AND DISPLAY MODULE

CHIP PACKAGING STRUCTURE AND METHOD FOR PACKAGING THE CHIP

TRANSPARENT CIRCUIT BOARD

CIRCUIT BOARD ASSEMBLY AND METHOD OF MANUFACTURING THE SAME, PACKAG...

CIRCUIT BOARD CONNECTION STRUCTURE AND PREPARATION METHOD THEREFOR

CIRCUIT BOARD ASSEMBLY

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

BURIED THERMISTOR AND METHOD OF FABRICATING THE SAME

PACKAGING STRUCTURE WITH EMBEDDED ELECTRONIC COMPONENTS AND METHOD...

CIRCUIT BOARD

CIRCUIT BOARD WITH EMBEDDED COMPONENT AND METHOD OF FABRICATING THE...

CIRCUIT BOARD ASSEMBLY AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD ASSEMBLY AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD AND METHOD OF MANUFACTURING THEREOF

METHOD OF MANUFACTURING DISPLAY MODULE WITH LIGHT EMITTING DIODE FR...

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

TRANSPARENT CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

MULTI-LAYER CIRCUIT BOARD WITH EMBEDDED COMPONENTS AND METHOD FOR M...

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

CIRCUIT BOARD, METHOD FOR MANUFACTURING THE SAME

CIRCUIT BOARD, METHOD FOR MANUFACTURING THE SAME

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

BOARD-TO-BOARD CONNECTION STRUCTURE AND METHOD FOR MANUFACTURING TH...

CIRCUIT BOARD WITH EMBEDDED ELECTRONIC COMPONENT AND METHOD FOR MAN...

PACKAGING STRUCTURE

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

CAMERA MODULE OF REDUCED SIZE AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR MANUFACTURING A CIRCUIT BOARD

CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD

METHOD FOR MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD

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