JCET STATS ChipPAC Korea Limited

Organization

Incheon, KR

Organizations

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Integrated antenna-in-package structure
- Patent number 12,211,773
- Issue date Jan 28, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for improved antenna testing
- Patent number 12,092,676
- Issue date Sep 17, 2024
- JCET STATS ChipPAC Korea Limited
- JinHyeok Song
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
MODULAR INTERCONNECTION UNIT, SEMICONDUCTOR PACKAGE AND METHOD FOR...
- Publication number 20250038059
- Publication date Jan 30, 2025
- JCET STATS ChipPAC Korea Limited
- HyeonChul LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming an Antenna-in-Package St...
- Publication number 20250038058
- Publication date Jan 30, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MOUNTING AN ELECTRONIC DEVICE ON A FLEXIBLE SUBSTRATE AN...
- Publication number 20250031317
- Publication date Jan 23, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20240421015
- Publication date Dec 19, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH IMPROVED HEAT DISSIPATION
- Publication number 20240404911
- Publication date Dec 5, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Multi-Tier System-in-Pa...
- Publication number 20240371759
- Publication date Nov 7, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A PARTIAL SHIELDING LAYER AND A METHOD FO...
- Publication number 20240355643
- Publication date Oct 24, 2024
- JCET STATS ChipPAC Korea Limited
- Bom LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRIP AND METHOD FOR FORMING A SEMICONDUCTOR...
- Publication number 20240347509
- Publication date Oct 17, 2024
- JCET STATS ChipPAC Korea Limited
- HyeonChul LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER ASSEMBLY FOR CARRYING SEMICONDUCTOR PACKAGE STRIPS WITH IMP...
- Publication number 20240332050
- Publication date Oct 3, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH IMPROVED HEAT DISSIPATION AND METHOD FOR...
- Publication number 20240332114
- Publication date Oct 3, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming an Antenna-in-Package St...
- Publication number 20240321664
- Publication date Sep 26, 2024
- JCET STATS ChipPAC Korea Limited
- YeJin PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a 3-D Stacked Semiconduc...
- Publication number 20240321783
- Publication date Sep 26, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Compartment Shielding fo...
- Publication number 20240321845
- Publication date Sep 26, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240234336
- Publication date Jul 11, 2024
- JCET STATS ChipPAC Korea Limited
- DoYeon PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND A METHOD FOR MAKING THE SAME
- Publication number 20240120289
- Publication date Apr 11, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SHIELDING LAYER ON A SEMICONDUCTOR DEVICE
- Publication number 20240120268
- Publication date Apr 11, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Improved Antenna Testing
- Publication number 20240103058
- Publication date Mar 28, 2024
- JCET STATS ChipPAC Korea Limited
- JinHyeok Song
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
- Publication number 20240105638
- Publication date Mar 28, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MAKING AN ELECTRONIC PACKAGE
- Publication number 20240105538
- Publication date Mar 28, 2024
- JCET STATS ChipPAC Korea Limited
- SangHo SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Antenna-In-Package Structure
- Publication number 20240096770
- Publication date Mar 21, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20240098907
- Publication date Mar 21, 2024
- JCET STATS ChipPAC Korea Limited
- HyoDong RYU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MAKING ELECTRONIC PACKAGE
- Publication number 20240071991
- Publication date Feb 29, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20240057249
- Publication date Feb 15, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A PARTIAL SHIELDING FOR AN ELECTRONIC ASSEMBLY
- Publication number 20240055367
- Publication date Feb 15, 2024
- JCET STATS ChipPAC Korea Limited
- EunByeol LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Test Equipment and Method of Performing Current and V...
- Publication number 20240053400
- Publication date Feb 15, 2024
- JCET STATS ChipPAC Korea Limited
- YongJu Lee
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor Device and Method of Forming Conductive Structure for...
- Publication number 20240030154
- Publication date Jan 25, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun Lee
- H01 - BASIC ELECTRIC ELEMENTS

JCET STATS ChipPAC Korea Limited

Organization

Patents Grantslast 30 patents

Integrated antenna-in-package structure

Semiconductor device and method for improved antenna testing

Patents Applicationslast 30 patents

MODULAR INTERCONNECTION UNIT, SEMICONDUCTOR PACKAGE AND METHOD FOR...

Semiconductor Device and Method of Forming an Antenna-in-Package St...

METHOD FOR MOUNTING AN ELECTRONIC DEVICE ON A FLEXIBLE SUBSTRATE AN...

SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR PACKAGE WITH IMPROVED HEAT DISSIPATION

Semiconductor Device and Method of Making a Multi-Tier System-in-Pa...

SEMICONDUCTOR DEVICE WITH A PARTIAL SHIELDING LAYER AND A METHOD FO...

SEMICONDUCTOR PACKAGE STRIP AND METHOD FOR FORMING A SEMICONDUCTOR...

CARRIER ASSEMBLY FOR CARRYING SEMICONDUCTOR PACKAGE STRIPS WITH IMP...

SEMICONDUCTOR DEVICE WITH IMPROVED HEAT DISSIPATION AND METHOD FOR...

Semiconductor Device and Method of Forming an Antenna-in-Package St...

Semiconductor Device and Method of Forming a 3-D Stacked Semiconduc...

Semiconductor Device and Method of Forming Compartment Shielding fo...

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC PACKAGE AND A METHOD FOR MAKING THE SAME

METHOD FOR FORMING A SHIELDING LAYER ON A SEMICONDUCTOR DEVICE

Semiconductor Device and Method for Improved Antenna Testing

SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME

METHOD FOR MAKING AN ELECTRONIC PACKAGE

Integrated Antenna-In-Package Structure

ELECTRONIC PACKAGE AND METHOD FOR FORMING THE SAME

METHOD FOR MAKING ELECTRONIC PACKAGE

ELECTRONIC PACKAGE AND METHOD FOR MAKING THE SAME

METHOD FOR FORMING A PARTIAL SHIELDING FOR AN ELECTRONIC ASSEMBLY

Semiconductor Test Equipment and Method of Performing Current and V...

Semiconductor Device and Method of Forming Conductive Structure for...

Trademarklast 30 trademarks