JCET STATS ChipPAC Korea Limited

Organization

Incheon, KR

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
Integrated antenna-in-package structure
- Patent number 12,211,773
- Issue date Jan 28, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for improved antenna testing
- Patent number 12,092,676
- Issue date Sep 17, 2024
- JCET STATS ChipPAC Korea Limited
- JinHyeok Song
- G01 - MEASURING TESTING

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Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE WITH INTEGRATED ANTENNAS AND A METHOD FOR FORMIN...
- Publication number 20250167168
- Publication date May 22, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE ASSEMBLY AND A METHOD FOR FORMING THE SAME
- Publication number 20250140773
- Publication date May 1, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE ASSEMBLY AND METHODS FOR FORMING THE SAME
- Publication number 20250140679
- Publication date May 1, 2025
- JCET STATS ChipPAC Korea Limited
- SangHoon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Flexible Encapsulant Ove...
- Publication number 20250132211
- Publication date Apr 24, 2025
- JCET STATS ChipPAC Korea Limited
- YeoJun Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Antenna-In-Package Structure
- Publication number 20250125233
- Publication date Apr 17, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ASSEMBLY AND METHODS FOR FORMING THE SAME
- Publication number 20250125281
- Publication date Apr 17, 2025
- JCET STATS ChipPAC Korea Limited
- SeongHwan PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20250125295
- Publication date Apr 17, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Embedded Trace Substrate...
- Publication number 20250118599
- Publication date Apr 10, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Fine-Pitch Interconnecti...
- Publication number 20250105162
- Publication date Mar 27, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING CONDUCTIVE BLOCKS, A SEMICONDUCTOR PACKAGE AND A...
- Publication number 20250105194
- Publication date Mar 27, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming AIP Structure to Reduce...
- Publication number 20250079350
- Publication date Mar 6, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR INTERCONNECTION UNIT, SEMICONDUCTOR PACKAGE AND METHOD FOR...
- Publication number 20250038059
- Publication date Jan 30, 2025
- JCET STATS ChipPAC Korea Limited
- HyeonChul LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming an Antenna-in-Package St...
- Publication number 20250038058
- Publication date Jan 30, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MOUNTING AN ELECTRONIC DEVICE ON A FLEXIBLE SUBSTRATE AN...
- Publication number 20250031317
- Publication date Jan 23, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20240421015
- Publication date Dec 19, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH IMPROVED HEAT DISSIPATION
- Publication number 20240404911
- Publication date Dec 5, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Multi-Tier System-in-Pa...
- Publication number 20240371759
- Publication date Nov 7, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A PARTIAL SHIELDING LAYER AND A METHOD FO...
- Publication number 20240355643
- Publication date Oct 24, 2024
- JCET STATS ChipPAC Korea Limited
- Bom LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRIP AND METHOD FOR FORMING A SEMICONDUCTOR...
- Publication number 20240347509
- Publication date Oct 17, 2024
- JCET STATS ChipPAC Korea Limited
- HyeonChul LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER ASSEMBLY FOR CARRYING SEMICONDUCTOR PACKAGE STRIPS WITH IMP...
- Publication number 20240332050
- Publication date Oct 3, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH IMPROVED HEAT DISSIPATION AND METHOD FOR...
- Publication number 20240332114
- Publication date Oct 3, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming an Antenna-in-Package St...
- Publication number 20240321664
- Publication date Sep 26, 2024
- JCET STATS ChipPAC Korea Limited
- YeJin PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a 3-D Stacked Semiconduc...
- Publication number 20240321783
- Publication date Sep 26, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Compartment Shielding fo...
- Publication number 20240321845
- Publication date Sep 26, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240234336
- Publication date Jul 11, 2024
- JCET STATS ChipPAC Korea Limited
- DoYeon PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND A METHOD FOR MAKING THE SAME
- Publication number 20240120289
- Publication date Apr 11, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SHIELDING LAYER ON A SEMICONDUCTOR DEVICE
- Publication number 20240120268
- Publication date Apr 11, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Improved Antenna Testing
- Publication number 20240103058
- Publication date Mar 28, 2024
- JCET STATS ChipPAC Korea Limited
- JinHyeok Song
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
- Publication number 20240105638
- Publication date Mar 28, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MAKING AN ELECTRONIC PACKAGE
- Publication number 20240105538
- Publication date Mar 28, 2024
- JCET STATS ChipPAC Korea Limited
- SangHo SONG
- H01 - BASIC ELECTRIC ELEMENTS

JCET STATS ChipPAC Korea Limited

Organization

Patents Grantslast 30 patents

Integrated antenna-in-package structure

Semiconductor device and method for improved antenna testing

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE WITH INTEGRATED ANTENNAS AND A METHOD FOR FORMIN...

ELECTRONIC PACKAGE ASSEMBLY AND A METHOD FOR FORMING THE SAME

ELECTRONIC PACKAGE ASSEMBLY AND METHODS FOR FORMING THE SAME

Semiconductor Device and Method of Forming Flexible Encapsulant Ove...

Integrated Antenna-In-Package Structure

SEMICONDUCTOR PACKAGE ASSEMBLY AND METHODS FOR FORMING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME

Semiconductor Device and Method of Forming Embedded Trace Substrate...

Semiconductor Device and Method of Forming Fine-Pitch Interconnecti...

METHOD FOR FORMING CONDUCTIVE BLOCKS, A SEMICONDUCTOR PACKAGE AND A...

Semiconductor Device and Method of Forming AIP Structure to Reduce...

MODULAR INTERCONNECTION UNIT, SEMICONDUCTOR PACKAGE AND METHOD FOR...

Semiconductor Device and Method of Forming an Antenna-in-Package St...

METHOD FOR MOUNTING AN ELECTRONIC DEVICE ON A FLEXIBLE SUBSTRATE AN...

SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR PACKAGE WITH IMPROVED HEAT DISSIPATION

Semiconductor Device and Method of Making a Multi-Tier System-in-Pa...

SEMICONDUCTOR DEVICE WITH A PARTIAL SHIELDING LAYER AND A METHOD FO...

SEMICONDUCTOR PACKAGE STRIP AND METHOD FOR FORMING A SEMICONDUCTOR...

CARRIER ASSEMBLY FOR CARRYING SEMICONDUCTOR PACKAGE STRIPS WITH IMP...

SEMICONDUCTOR DEVICE WITH IMPROVED HEAT DISSIPATION AND METHOD FOR...

Semiconductor Device and Method of Forming an Antenna-in-Package St...

Semiconductor Device and Method of Forming a 3-D Stacked Semiconduc...

Semiconductor Device and Method of Forming Compartment Shielding fo...

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC PACKAGE AND A METHOD FOR MAKING THE SAME

METHOD FOR FORMING A SHIELDING LAYER ON A SEMICONDUCTOR DEVICE

Semiconductor Device and Method for Improved Antenna Testing

SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME

METHOD FOR MAKING AN ELECTRONIC PACKAGE