JCET STATS ChipPAC Korea Limited

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Incheon, KR

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Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE AND A METHOD FOR MAKING THE SAME
- Publication number 20240120289
- Publication date Apr 11, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SHIELDING LAYER ON A SEMICONDUCTOR DEVICE
- Publication number 20240120268
- Publication date Apr 11, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Improved Antenna Testing
- Publication number 20240103058
- Publication date Mar 28, 2024
- JCET STATS ChipPAC Korea Limited
- JinHyeok Song
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
- Publication number 20240105638
- Publication date Mar 28, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MAKING AN ELECTRONIC PACKAGE
- Publication number 20240105538
- Publication date Mar 28, 2024
- JCET STATS ChipPAC Korea Limited
- SangHo SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Antenna-In-Package Structure
- Publication number 20240096770
- Publication date Mar 21, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20240098907
- Publication date Mar 21, 2024
- JCET STATS ChipPAC Korea Limited
- HyoDong RYU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MAKING ELECTRONIC PACKAGE
- Publication number 20240071991
- Publication date Feb 29, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20240057249
- Publication date Feb 15, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Test Equipment and Method of Performing Current and V...
- Publication number 20240053400
- Publication date Feb 15, 2024
- JCET STATS ChipPAC Korea Limited
- YongJu Lee
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR FORMING A PARTIAL SHIELDING FOR AN ELECTRONIC ASSEMBLY
- Publication number 20240055367
- Publication date Feb 15, 2024
- JCET STATS ChipPAC Korea Limited
- EunByeol LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Conductive Structure for...
- Publication number 20240030154
- Publication date Jan 25, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun Lee
- H01 - BASIC ELECTRIC ELEMENTS

JCET STATS ChipPAC Korea Limited

Organization

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE AND A METHOD FOR MAKING THE SAME

METHOD FOR FORMING A SHIELDING LAYER ON A SEMICONDUCTOR DEVICE

Semiconductor Device and Method for Improved Antenna Testing

SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME

METHOD FOR MAKING AN ELECTRONIC PACKAGE

Integrated Antenna-In-Package Structure

ELECTRONIC PACKAGE AND METHOD FOR FORMING THE SAME

METHOD FOR MAKING ELECTRONIC PACKAGE

ELECTRONIC PACKAGE AND METHOD FOR MAKING THE SAME

Semiconductor Test Equipment and Method of Performing Current and V...

METHOD FOR FORMING A PARTIAL SHIELDING FOR AN ELECTRONIC ASSEMBLY

Semiconductor Device and Method of Forming Conductive Structure for...