Optiz, Inc.

Organization

Palo Alto, CA, US

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
Hyperspectral camera
- Patent number 11,614,361
- Issue date Mar 28, 2023
- Optiz, Inc.
- Rob Heeman
- G01 - MEASURING TESTING
Information Patent Grant
Monolithic multi-focus light source device
- Patent number 11,408,589
- Issue date Aug 9, 2022
- Optiz, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a sensor package with cooling feature
- Patent number 10,199,519
- Issue date Feb 5, 2019
- Optiz, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back side illumination image sensor with non-planar optical interface
- Patent number 10,139,619
- Issue date Nov 27, 2018
- Optiz, Inc.
- Vage Oganesian
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Under screen sensor assembly
- Patent number 9,996,725
- Issue date Jun 12, 2018
- Optiz, Inc.
- Vage Oganesian
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Imaging device with photo detectors and color filters arranged by c...
- Patent number 9,985,063
- Issue date May 29, 2018
- Optiz, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a sensor package with cooling feature
- Patent number 9,972,730
- Issue date May 15, 2018
- Optiz, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a wire bond sensor package
- Patent number 9,893,213
- Issue date Feb 13, 2018
- Optiz, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package with cooling feature
- Patent number 9,893,218
- Issue date Feb 13, 2018
- Optiz, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a stress released image sensor package structure
- Patent number 9,853,079
- Issue date Dec 26, 2017
- Optiz, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional system-on-chip image sensor package
- Patent number 9,667,900
- Issue date May 30, 2017
- Optiz, Inc.
- Vage Oganesian
- G02 - OPTICS
Information Patent Grant
Wire bond sensor package
- Patent number 9,666,730
- Issue date May 30, 2017
- Optiz, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making low profile sensor package with cooling feature
- Patent number 9,666,625
- Issue date May 30, 2017
- Optiz, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package with exposed sensor array and method of making same
- Patent number 9,570,634
- Issue date Feb 14, 2017
- Optiz, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress released image sensor package structure and method
- Patent number 9,543,347
- Issue date Jan 10, 2017
- Optiz, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip level heat dissipation using silicon
- Patent number 9,524,917
- Issue date Dec 20, 2016
- Optiz, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package with cooling feature and method of making same
- Patent number 9,496,297
- Issue date Nov 15, 2016
- Optiz, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated camera module and method of making same
- Patent number 9,496,247
- Issue date Nov 15, 2016
- Optiz, Inc.
- Vage Oganesian
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Low profile sensor package with cooling feature and method of makin...
- Patent number 9,461,190
- Issue date Oct 4, 2016
- Optiz, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stepped package for image sensor
- Patent number 9,373,653
- Issue date Jun 21, 2016
- Optiz, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a low profile image sensor package with an image...
- Patent number 9,373,660
- Issue date Jun 21, 2016
- Optiz, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making stamped multi-layer polymer lens
- Patent number 9,233,511
- Issue date Jan 12, 2016
- Optiz, Inc.
- Vage Oganesian
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of forming 3D integrated microelectronic assembly with stres...
- Patent number 9,230,947
- Issue date Jan 5, 2016
- Optiz, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low profile sensor module and method of making same
- Patent number 9,219,091
- Issue date Dec 22, 2015
- Optiz, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making interposer package for CMOS image sensor
- Patent number 9,214,592
- Issue date Dec 15, 2015
- Optiz, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a low profile image sensor package
- Patent number 9,196,650
- Issue date Nov 24, 2015
- OPTIZ INC.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low profile image sensor
- Patent number 9,190,443
- Issue date Nov 17, 2015
- OPTIZ INC.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package with exposed sensor array and method of making same
- Patent number 9,142,695
- Issue date Sep 22, 2015
- Optiz, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making 3D integration microelectronic assembly for integr...
- Patent number 9,054,013
- Issue date Jun 9, 2015
- Optiz, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stepped package for image sensor and method of making same
- Patent number 9,018,725
- Issue date Apr 28, 2015
- Optiz, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Monolithic Multi-Focus Light Source Device
- Publication number 20210172581
- Publication date Jun 10, 2021
- Optiz, Inc.
- Vage Oganesian
- F21 - LIGHTING
Information Patent Application
Method Of Making A Sensor Package With Cooling Feature
- Publication number 20180226517
- Publication date Aug 9, 2018
- Optiz, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Under Screen Sensor Assembly
- Publication number 20180121705
- Publication date May 3, 2018
- Optiz, Inc.
- Vage Oganesian
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method Of Forming A Wire Bond Sensor Package
- Publication number 20170222065
- Publication date Aug 3, 2017
- Optiz, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method Of Forming A Stress Released Image Sensor Package Structure
- Publication number 20170084656
- Publication date Mar 23, 2017
- Optiz, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sensor Package With Cooling Feature
- Publication number 20170033241
- Publication date Feb 2, 2017
- Optiz, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method Of Making Low Profile Sensor Package With Cooling Feature
- Publication number 20160380018
- Publication date Dec 29, 2016
- Optiz, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stress Released Image Sensor Package Structure And Method
- Publication number 20160247849
- Publication date Aug 25, 2016
- Optiz, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Back Side Illumination Image Sensor With Non-Planar Optical Interface
- Publication number 20160238836
- Publication date Aug 18, 2016
- Optiz, Inc.
- Vage Oganesian
- G02 - OPTICS
Information Patent Application
Wire Bond Sensor Package And Method
- Publication number 20160049526
- Publication date Feb 18, 2016
- Optiz, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sensor Package With Exposed Sensor Array And Method Of Making Same
- Publication number 20160043240
- Publication date Feb 11, 2016
- Optiz, Inc.
- Vage Oganesian
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF FORMING A LOW PROFILE IMAGE SENSOR PACKAGE
- Publication number 20160035785
- Publication date Feb 4, 2016
- Optiz, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Level Heat Dissipation Using Silicon
- Publication number 20150311137
- Publication date Oct 29, 2015
- Optiz, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Color Filter And Photodiode Patterning Configuration
- Publication number 20150303231
- Publication date Oct 22, 2015
- Optiz, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stepped Package For Image Sensor
- Publication number 20150200219
- Publication date Jul 16, 2015
- Optiz, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device On Cover Substrate And Method Of Making Same
- Publication number 20150189204
- Publication date Jul 2, 2015
- Optiz, Inc.
- Vage Oganesian
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Sensor Package With Cooling Feature And Method Of Making Same
- Publication number 20150162366
- Publication date Jun 11, 2015
- Optiz, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three Dimensional System-On-Chip Image Sensor Package
- Publication number 20150163425
- Publication date Jun 11, 2015
- Optiz, Inc.
- Vage Oganesian
- G02 - OPTICS
Information Patent Application
Low Profile Sensor Package With Cooling Feature And Method Of Makin...
- Publication number 20150084148
- Publication date Mar 26, 2015
- Optiz, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Camera Module And Method Of Making Same
- Publication number 20150054001
- Publication date Feb 26, 2015
- Optiz, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low Profile Image Sensor
- Publication number 20140264691
- Publication date Sep 18, 2014
- Optiz, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low Profile Sensor Module And Method Of Making Same
- Publication number 20140264692
- Publication date Sep 18, 2014
- Optiz, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cover-Free Sensor Module And Method Of Making Same
- Publication number 20140264693
- Publication date Sep 18, 2014
- Optiz, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method Of Forming A Low Profile Image Sensor Package
- Publication number 20140248736
- Publication date Sep 4, 2014
- Optiz, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method Of Making A Low Stress Cavity Package For Back Side Illumina...
- Publication number 20140065755
- Publication date Mar 6, 2014
- Optiz, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method Of Making 3D Integration Microelectronic Assembly For Integr...
- Publication number 20140004664
- Publication date Jan 2, 2014
- Optiz, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method Of Making 3D Integration Microelectronic Assembly For Integr...
- Publication number 20140004646
- Publication date Jan 2, 2014
- Optiz, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method Of Forming 3D Integrated Microelectronic Assembly With Stres...
- Publication number 20140004647
- Publication date Jan 2, 2014
- Optiz, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS

Optiz, Inc.

Organization

Patents Grantslast 30 patents

Hyperspectral camera

Monolithic multi-focus light source device

Method of making a sensor package with cooling feature

Back side illumination image sensor with non-planar optical interface

Under screen sensor assembly

Imaging device with photo detectors and color filters arranged by c...

Method of making a sensor package with cooling feature

Method of forming a wire bond sensor package

Sensor package with cooling feature

Method of forming a stress released image sensor package structure

Three dimensional system-on-chip image sensor package

Wire bond sensor package

Method of making low profile sensor package with cooling feature

Sensor package with exposed sensor array and method of making same

Stress released image sensor package structure and method

Chip level heat dissipation using silicon

Sensor package with cooling feature and method of making same

Integrated camera module and method of making same

Low profile sensor package with cooling feature and method of makin...

Stepped package for image sensor

Method of forming a low profile image sensor package with an image...

Method of making stamped multi-layer polymer lens

Method of forming 3D integrated microelectronic assembly with stres...

Low profile sensor module and method of making same

Method of making interposer package for CMOS image sensor

Method of forming a low profile image sensor package

Low profile image sensor

Sensor package with exposed sensor array and method of making same

Method of making 3D integration microelectronic assembly for integr...

Stepped package for image sensor and method of making same

Patents Applicationslast 30 patents

Monolithic Multi-Focus Light Source Device

Method Of Making A Sensor Package With Cooling Feature

Under Screen Sensor Assembly

Method Of Forming A Wire Bond Sensor Package

Method Of Forming A Stress Released Image Sensor Package Structure

Sensor Package With Cooling Feature

Method Of Making Low Profile Sensor Package With Cooling Feature

Stress Released Image Sensor Package Structure And Method

Back Side Illumination Image Sensor With Non-Planar Optical Interface

Wire Bond Sensor Package And Method

Sensor Package With Exposed Sensor Array And Method Of Making Same

METHOD OF FORMING A LOW PROFILE IMAGE SENSOR PACKAGE

Chip Level Heat Dissipation Using Silicon

Color Filter And Photodiode Patterning Configuration

Stepped Package For Image Sensor

Semiconductor Device On Cover Substrate And Method Of Making Same

Sensor Package With Cooling Feature And Method Of Making Same

Three Dimensional System-On-Chip Image Sensor Package

Low Profile Sensor Package With Cooling Feature And Method Of Makin...

Integrated Camera Module And Method Of Making Same

Low Profile Image Sensor

Low Profile Sensor Module And Method Of Making Same

Cover-Free Sensor Module And Method Of Making Same

Method Of Forming A Low Profile Image Sensor Package

Method Of Making A Low Stress Cavity Package For Back Side Illumina...

Method Of Making 3D Integration Microelectronic Assembly For Integr...

Method Of Making 3D Integration Microelectronic Assembly For Integr...

Method Of Forming 3D Integrated Microelectronic Assembly With Stres...

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