SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED

Organization

Zhongshan, CN

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package device with dedicated heat-dissipation featur...
- Patent number 11,972,998
- Issue date Apr 30, 2024
- Shunsin Technology (Zhong Shan) Limited
- Shun-Hsing Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-guiding and cargo-sensitive component platform and system for...
- Patent number 11,584,594
- Issue date Feb 21, 2023
- Shunsin Technology (Zhong Shan) Limited
- Jhe-Wei Jhang
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Antenna device and method for manufacturing antenna device
- Patent number 11,545,730
- Issue date Jan 3, 2023
- Shunsin Technology (Zhong Shan) Limited
- Jian-Wen Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waterproof button module and electronic device
- Patent number 11,361,916
- Issue date Jun 14, 2022
- Shunsin Technology (Zhong Shan) Limited
- Xiao Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Self-guiding and cargo-sensitive component platform and system for...
- Patent number 11,254,510
- Issue date Feb 22, 2022
- Shunsin Technology (Zhong Shan) Limited
- Jhe-Wei Jhang
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Optical module and method of manufacturing optical module comprisin...
- Patent number 11,051,394
- Issue date Jun 29, 2021
- Shunsin Technology (Zhong Shan) Limited
- Han-Biao Zheng
- G01 - MEASURING TESTING
Information Patent Grant
Chip packages and methods for forming the same
- Patent number 10,950,563
- Issue date Mar 16, 2021
- Shunsin Technology (Zhong Shan) Limited
- Wang-Lai Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip packages and methods for forming the same
- Patent number 10,867,942
- Issue date Dec 15, 2020
- Shunsin Technology (Zhong Shan) Limited
- Wang-Lai Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip packages and methods for forming the same
- Patent number 10,818,619
- Issue date Oct 27, 2020
- Shunsin Technology (Zhong Shan) Limited
- Wang-Lai Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip packages and methods for forming the same
- Patent number 10,770,417
- Issue date Sep 8, 2020
- Shunsin Technology (Zhong Shan) Limited
- Wang-Lai Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Module with wavelength-based directional bias of light for receivin...
- Patent number 10,698,169
- Issue date Jun 30, 2020
- Shunsin Technology (Zhong Shan) Limited
- Han-Zhang Xiao
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Linear vibrator
- Patent number 10,639,673
- Issue date May 5, 2020
- Shunsin Technology (Zhong Shan) Limited
- Shun-Long Lee
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Fingerprint sensor package and fabricating method thereof
- Patent number 10,565,427
- Issue date Feb 18, 2020
- Shunsin Technology (Zhong Shan) Limited
- Jun Yang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Manufacturing method for circuit board based on copper ceramic subs...
- Patent number 10,383,236
- Issue date Aug 13, 2019
- Shunsin Technology (Zhong Shan) Limited
- Fei Ren
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting diode lamps with heat-dispersing construction and me...
- Patent number 10,125,966
- Issue date Nov 13, 2018
- Shunsin Technology (Zhong Shan) Limited
- Shun-Long Lee
- F21 - LIGHTING
Information Patent Grant
Fingerprint sensor package and fabricating method thereof
- Patent number 9,953,206
- Issue date Apr 24, 2018
- Shunsin Technology (Zhong Shan) Limited
- Jun Yang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Light-emitting diode chip packages and methods for manufacture thereof
- Patent number 9,685,595
- Issue date Jun 20, 2017
- Shunsin Technology (Zhong Shan) Limited
- Fei Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing printed circuit board with shallow solder pad
- Patent number 9,392,693
- Issue date Jul 12, 2016
- Shunsin Technology (Zhong Shan) Limited
- Ai-Hua Liang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing lead frame
- Patent number 9,379,505
- Issue date Jun 28, 2016
- Shunsin Technology (Zhong Shan) Limited
- Wang-Lai Yang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Package structure for duplexer, method of manufacturing the same an...
- Patent number 9,264,014
- Issue date Feb 16, 2016
- Shunsin Technology (Zhong Shan) Limited
- Xiao-Ya Guo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing package structure with electronic component
- Patent number 9,006,035
- Issue date Apr 14, 2015
- Shunsin Technology (Zhong Shan) Limited
- Jun-Yi Xiao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package assembly and method of manufacturing the same
- Patent number 8,981,571
- Issue date Mar 17, 2015
- Shunsin Technology (Zhong Shan) Limited
- Wang-Lai Yang
- H01 - BASIC ELECTRIC ELEMENTS

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Patents Applicationslast 30 patents

Information Patent Application
PACKAGING ASSEMBLY FOR SEMICONDUCTOR DEVICE AND METHOD OF MAKING
- Publication number 20240079344
- Publication date Mar 7, 2024
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- SHUN-HSING LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING SEMICONDUC...
- Publication number 20240038742
- Publication date Feb 1, 2024
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- SHUN-HSING LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING SEMICONDUC...
- Publication number 20240030164
- Publication date Jan 25, 2024
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- SHUN-HSING LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-ACCURACY OPTICAL SENSOR FOR DISTANCE MEASUREMENT AND METHOD FO...
- Publication number 20230350023
- Publication date Nov 2, 2023
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- SHUN-HSING LIAO
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE WITH DEDICATED HEAT-DISSIPATION FEATUR...
- Publication number 20230130484
- Publication date Apr 27, 2023
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- SHUN-HSING LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE WITH HEAT-REMOVING FUNCTION AND METHOD...
- Publication number 20230127545
- Publication date Apr 27, 2023
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- SHUN-HSING LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD FOR MANUFACTURING SEMICONDU...
- Publication number 20230130923
- Publication date Apr 27, 2023
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- SHUN-HSING LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SENSOR AND METHOD FOR MANUFACTURING OPTICAL SENSOR
- Publication number 20230079384
- Publication date Mar 16, 2023
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- SHUN-HSING LIAO
- G01 - MEASURING TESTING
Information Patent Application
OPTICAL SENSOR AND METHOD FOR MANUFACTURING OPTICAL SENSOR
- Publication number 20220299639
- Publication date Sep 22, 2022
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- SHUN-HSING LIAO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
OPTICAL SENSOR AND METHOD FOR MANUFACTURING OPTICAL SENSOR
- Publication number 20220291378
- Publication date Sep 15, 2022
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- SHUN-HSING LIAO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SELF-GUIDING AND CARGO-SENSITIVE COMPONENT PLATFORM AND SYSTEM FOR...
- Publication number 20220127082
- Publication date Apr 28, 2022
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- JHE-WEI JHANG
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
ANTENNA DEVICE AND METHOD FOR MANUFACTURING ANTENNA DEVICE
- Publication number 20220077558
- Publication date Mar 10, 2022
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- JIAN-WEN HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-GUIDING AND CARGO-SENSITIVE COMPONENT PLATFORM AND SYSTEM FOR...
- Publication number 20220009720
- Publication date Jan 13, 2022
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- JHE-WEI JHANG
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
OPTICAL COMMUNICATION MODULE OF REDUCED COMPLEXITY AND COST
- Publication number 20210199903
- Publication date Jul 1, 2021
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- JIE HUANG
- G02 - OPTICS
Information Patent Application
OPTICAL MODULE AND METHOD OF MANUFACTURING OPTICAL MODULE COMPRISIN...
- Publication number 20210204391
- Publication date Jul 1, 2021
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- HAN-BIAO ZHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL COMMUNICATION MODULE OF REDUCED SIZE UTILIZING ONE BIREFRIN...
- Publication number 20210191045
- Publication date Jun 24, 2021
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- CHUN-FENG LI
- G02 - OPTICS
Information Patent Application
ENERGY-EFFICIENT OPTICAL COMMUNICATION MODULE AND METHOD OF MANUFAC...
- Publication number 20210165173
- Publication date Jun 3, 2021
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- GUANG-SHENG HE
- G02 - OPTICS
Information Patent Application
OPTICAL COMMUNICATION MODULE MANUFACTURABLE OTHER THAN IN A VACUUM...
- Publication number 20210149130
- Publication date May 20, 2021
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- GUANG-SHENG HE
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CHIP PACKAGES AND METHODS FOR FORMING THE SAME
- Publication number 20200388585
- Publication date Dec 10, 2020
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- WANG-LAI YANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
OPTICAL TRANSMITTER, OPTICAL TRANSCEIVER, AND METHOD FOR MANUFACTUR...
- Publication number 20200363597
- Publication date Nov 19, 2020
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- GUANG-SHENG HE
- G02 - OPTICS
Information Patent Application
STRUCTURE OF PACKAGING MODULE AND METHOD FOR MAKING PACKAGING MODULE
- Publication number 20200357778
- Publication date Nov 12, 2020
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- JUN-YI XIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROPHONE DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20200351596
- Publication date Nov 5, 2020
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- JIAN-WEN HU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MODULE WITH WAVELENGTH-BASED DIRECTIONAL BIAS OF LIGHT FOR RECEIVIN...
- Publication number 20200348474
- Publication date Nov 5, 2020
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- HAN-ZHANG XIAO
- G02 - OPTICS
Information Patent Application
WATERPROOF BUTTON MODULE AND ELECTRONIC DEVICE
- Publication number 20200335288
- Publication date Oct 22, 2020
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- XIAO LI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP PACKAGES AND METHODS FOR FORMING THE SAME
- Publication number 20200335462
- Publication date Oct 22, 2020
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- WANG-LAI YANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGES AND METHODS FOR FORMING THE SAME
- Publication number 20190172805
- Publication date Jun 6, 2019
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- WANG-LAI YANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE ASSEMBLY FOR DIVIDED ELECTROMAGNETIC SHIELDING AND METHOD O...
- Publication number 20190164902
- Publication date May 30, 2019
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- JUN-YI XIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LINEAR VIBRATOR
- Publication number 20190015872
- Publication date Jan 17, 2019
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- SHUN-LONG LEE
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
FINGERPRINT SENSOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20180307889
- Publication date Oct 25, 2018
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- JUN YANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ANTI-EMI SHIELDING PACKAGE AND METHOD OF MAKING SAME
- Publication number 20180197824
- Publication date Jul 12, 2018
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- JUN-YI XIAO
- H01 - BASIC ELECTRIC ELEMENTS

SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED

Organization

Patents Grantslast 30 patents

Semiconductor package device with dedicated heat-dissipation featur...

Self-guiding and cargo-sensitive component platform and system for...

Antenna device and method for manufacturing antenna device

Waterproof button module and electronic device

Self-guiding and cargo-sensitive component platform and system for...

Optical module and method of manufacturing optical module comprisin...

Chip packages and methods for forming the same

Chip packages and methods for forming the same

Chip packages and methods for forming the same

Chip packages and methods for forming the same

Module with wavelength-based directional bias of light for receivin...

Linear vibrator

Fingerprint sensor package and fabricating method thereof

Manufacturing method for circuit board based on copper ceramic subs...

Light emitting diode lamps with heat-dispersing construction and me...

Fingerprint sensor package and fabricating method thereof

Light-emitting diode chip packages and methods for manufacture thereof

Method for manufacturing printed circuit board with shallow solder pad

Method of manufacturing lead frame

Package structure for duplexer, method of manufacturing the same an...

Method for manufacturing package structure with electronic component

Package assembly and method of manufacturing the same

Patents Applicationslast 30 patents

PACKAGING ASSEMBLY FOR SEMICONDUCTOR DEVICE AND METHOD OF MAKING

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING SEMICONDUC...

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING SEMICONDUC...

HIGH-ACCURACY OPTICAL SENSOR FOR DISTANCE MEASUREMENT AND METHOD FO...

SEMICONDUCTOR PACKAGE DEVICE WITH DEDICATED HEAT-DISSIPATION FEATUR...

SEMICONDUCTOR PACKAGE DEVICE WITH HEAT-REMOVING FUNCTION AND METHOD...

SEMICONDUCTOR PACKAGE DEVICE AND METHOD FOR MANUFACTURING SEMICONDU...

OPTICAL SENSOR AND METHOD FOR MANUFACTURING OPTICAL SENSOR

OPTICAL SENSOR AND METHOD FOR MANUFACTURING OPTICAL SENSOR

OPTICAL SENSOR AND METHOD FOR MANUFACTURING OPTICAL SENSOR

SELF-GUIDING AND CARGO-SENSITIVE COMPONENT PLATFORM AND SYSTEM FOR...

ANTENNA DEVICE AND METHOD FOR MANUFACTURING ANTENNA DEVICE

SELF-GUIDING AND CARGO-SENSITIVE COMPONENT PLATFORM AND SYSTEM FOR...

OPTICAL COMMUNICATION MODULE OF REDUCED COMPLEXITY AND COST

OPTICAL MODULE AND METHOD OF MANUFACTURING OPTICAL MODULE COMPRISIN...

OPTICAL COMMUNICATION MODULE OF REDUCED SIZE UTILIZING ONE BIREFRIN...

ENERGY-EFFICIENT OPTICAL COMMUNICATION MODULE AND METHOD OF MANUFAC...

OPTICAL COMMUNICATION MODULE MANUFACTURABLE OTHER THAN IN A VACUUM...

CHIP PACKAGES AND METHODS FOR FORMING THE SAME

OPTICAL TRANSMITTER, OPTICAL TRANSCEIVER, AND METHOD FOR MANUFACTUR...

STRUCTURE OF PACKAGING MODULE AND METHOD FOR MAKING PACKAGING MODULE

MICROPHONE DEVICE AND METHOD FOR MANUFACTURING SAME

MODULE WITH WAVELENGTH-BASED DIRECTIONAL BIAS OF LIGHT FOR RECEIVIN...

WATERPROOF BUTTON MODULE AND ELECTRONIC DEVICE

CHIP PACKAGES AND METHODS FOR FORMING THE SAME

CHIP PACKAGES AND METHODS FOR FORMING THE SAME

PACKAGE ASSEMBLY FOR DIVIDED ELECTROMAGNETIC SHIELDING AND METHOD O...

LINEAR VIBRATOR

FINGERPRINT SENSOR PACKAGE AND FABRICATING METHOD THEREOF

ANTI-EMI SHIELDING PACKAGE AND METHOD OF MAKING SAME