The subject matter herein generally relates to a field of data security, and particularly to package of a fingerprint sensor and methods for fabricating the package of fingerprint sensor.
A fingerprint identification chip improves the security of the terminal products such as the fingerprint chip applied in smart phone, tablet PC etc. The potential limitations and disadvantages of conventional fingerprint identification chips comprises: (a) The fingerprint identification chip is etched to form a conductive layer and is connected to a substrate by combination lines, which is a complicated and expensive process; (b) There is a coating layer on the finger contact portion, which is easily scratched or contaminated to cause failure of recognition; (c) The combination lines connected with the chip and the substrate expose portions between the chip and the substrate. The chip, the line layer and the substrate are required to package before bonding with adjacent layers to avoid electrical connection problems.
Implementations of the present technology will now be described with reference to the attached figures.
It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different figures to indicate corresponding or analogous elements. In addition, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein. However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details. In other instances, methods, procedures, and components have not been described in detail so as not to obscure the related relevant feature being described. Also, the description is not to be considered as limiting the scope of the embodiments described herein. The drawings are not necessarily to scale and the proportions of certain parts have been exaggerated to better illustrate details and features of the present disclosure.
The disclosure is illustrated by way of example and not by way of limitation in the figures of the accompanying drawings in which like reference numerals indicate the same or similar elements. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references can mean “at least one.”
Referring to
In S2: a fingerprint sensor chip 2 is manufactured, the fingerprint sensor chip 2 has a chip body 21, and a block 22 is made on the chip body 21, as shown in
In S4: a substrate 1 is manufactured, and the substrate 1 is cut into a first portion 11 and a second portion 12. A line layer 13 is distributed on a first surface 110 of the first portion 11, as shown in
In S6: an FPC 3 is manufactured. The FPC 3 has a body 31, a connector 32, and a plurality of SMD components soldered on the body 31, as shown in
In S8: Adhesive 4 is used to combine the fingerprint sensor chip 2 and the second portion 12 of the substrate 1. The block 22 extends out from the second portion 12 and is fixed with the first portion 11 by the adhesive 4 to be electrically connected to the line layer 13, as shown in
In S10: the FPC 3 is soldered on the first portion 11 to form a solder point 33 electrically connected to the line layer 13.
By the method described in
In an exemplary embodiment, the line layer 13 is positioned on the substrate 1 and the fingerprint sensor chip 2 is electrically connected to the line layer 13 by the block 22. Thus the etching for the fingerprint sensor chip 2 is omitted. The line layer 13 is placed on the substrate 1 of reinforced glass and the surface of the fingerprint sensor chip 2 is directly fixed on the substrate 1 by adhesive 4 without packaging. This decreases the thickness of the fingerprint sensor chip 2. The fingerprint sensor uses the reinforced glass instead of coating to avoid scratching, contaminations, or chromatism. The structure of the fingerprint sensor according to an exemplary embodiment of the disclosure is simple and the manufacturing method is fast and lower cost. The fingerprint sensor chip receives and detects users' fingers on the substrate made of glass, and the fingerprint sensor chip is electrically connected to a conductor by chip circuit to process the electrical signals output by the conductor.
Although the features and elements of the present disclosure are described as embodiments in particular combinations, each feature or element can be used alone or in other various combinations, within the principles of the present disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Number | Date | Country | Kind |
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2016 1 0352261 | May 2016 | CN | national |
Number | Name | Date | Kind |
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5726726 | Nakanishi | Mar 1998 | A |
6924496 | Manansala | Aug 2005 | B2 |
20140361395 | Bhagavat | Dec 2014 | A1 |
20160049526 | Oganesian | Feb 2016 | A1 |
Number | Date | Country |
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104700102 | Jun 2015 | CN |
M522419 | May 2016 | TW |
Number | Date | Country | |
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20170344792 A1 | Nov 2017 | US |