The subject matter herein generally relates to package assemblies for chips and methods of manufacturing the package assemblies, and more particularly to a package assembly for divided electromagnetic shielding, and a method of manufacturing such package assembly.
In existing technology, manufacture a package assembly for divided electromagnetic shielding is mainly divided into the following two methods:
One is to semi cut the package assembly and then process the electromagnetic shielding;
The other one is to semi cut the packaging assembly, then dispensing, and finally process electromagnetic shielding.
In view of the above schemes, the semi cutting operation increases the manufacturing cycle and cost, and the substrate is prone to warp during the semi cutting process, which result in lower product yield and poor appearance. In addition, gas holes often appear in the dispensing process, which result in wayward product yield, and the cost of silver glue is high.
Implementations of the present technology will now be described, by way of example only, with reference to the attached figures, wherein:
It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different figures to indicate corresponding or analogous elements. In addition, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein. However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details. In other instances, methods, procedures, and components have not been described in detail so as not to obscure the related relevant feature being described. Also, the description is not to be considered as limiting the scope of the embodiments described herein. The drawings are not necessarily to scale and the proportions of certain parts have been exaggerated to better illustrate details and features of the present disclosure.
Several definitions that apply throughout this disclosure will now be presented.
The term “coupled” is defined as connected, whether directly or indirectly through intervening components, and is not necessarily limited to physical connections. The connection can be such that the objects are permanently connected or releasably connected. The term “outside” refers to a region that is beyond the outermost confines of a physical object. The term “inside” indicates that at least a portion of a region is partially contained within a boundary formed by the object. The term “substantially” is defined to be essentially conforming to the particular dimension, shape, or other feature that the term modifies, such that the component need not be exact. For example, “substantially cylindrical” means that the object resembles a cylinder, but can have one or more deviations from a true cylinder. The term “comprising,” when utilized, means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in the so-described combination, group, series and the like.
The present disclosure is described in relation to a package assembly for a divided electromagnetic shielding.
In the embodiment, SIP (System in a Package) as an assembly technique. With the popularity of smart phones and internet, the expected complexity of the SIP module is increasing, and the potential for divided electromagnetic shielding is large.
In each of the package assemblies for divided electromagnetic shielding 100, the plurality of chips 30 is separated by the first colloid 40, and then the electromagnetic shielding layer 50 is electroplated on the first colloid 40, and the electromagnetic shielding layer 50 is inside the package body. Metal material does not need to be electroplated on the outer surface of package assembly 100, warping caused by the semi cutting of the packaged product is avoided, and the package assembly for divided electromagnetic shielding 100 can effectively improve the yield of the product and improve the appearance of the product.
Referring to
SIP (System in a Package) is used as an assembly technique. With the popularity of smart phones and internet, the expected complexity of the SIP module is increasing, and the potential for divided electromagnetic shielding is large.
In summary, taking the package assembly 100 and the above-described manufacturing method as examples, each of the plurality of chips 30 is separated by the first colloid 40, and then the electromagnetic shielding layer 50 is electroplated on the first colloid 40, the electromagnetic shielding layer 50 being thus inside the package body. Metal material does not need to be electroplated on the outer surface of package assembly 100, warping by the semi cutting of the packaged product is avoided, and the package assembly for divided electromagnetic shielding 100 can effectively improve the yield of the product and improve the appearance of the product.
The embodiments shown and described above are only examples. Many details are often found in the art such as the other features of a package assembly for divided electromagnetic shielding and method of manufacturing same. Therefore, many such details are neither shown nor described. Even though numerous characteristics and advantages of the present technology have been set forth in the foregoing description, together with details of the structure and function of the present disclosure, the disclosure is illustrative only, and changes may be made in the detail, especially in matters of shape, size, and arrangement of the parts within the principles of the present disclosure, up to and including the full extent established by the broad general meaning of the terms used in the claims. It will therefore be appreciated that the embodiments described above may be modified within the scope of the claims.
Number | Date | Country | Kind |
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201711194388.3 | Nov 2017 | CN | national |