UNIMICRON TECHNOLOGY CORP

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TAIWAN, CN

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing circuit board
- Patent number 12,328,828
- Issue date Jun 10, 2025
- Unimicron Technology Corp.
- Chun-Hung Kuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board assembly and manufacturing method thereof
- Patent number 12,324,100
- Issue date Jun 3, 2025
- Unimicron Technology Corp.
- Yu-Shen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transmission line device compriing first and second conductive line...
- Patent number 12,315,981
- Issue date May 27, 2025
- Unimicron Technology Corp.
- Yu-Kuang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit carrier and manufacturing method thereof and package structure
- Patent number 12,309,943
- Issue date May 20, 2025
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inspection system and inspection method of bare circuit board
- Patent number 12,292,468
- Issue date May 6, 2025
- Unimicron Technology Corp.
- Chun-Hsien Chien
- G01 - MEASURING TESTING
Information Patent Grant
Integrated circuit package structure
- Patent number 12,266,616
- Issue date Apr 1, 2025
- Unimicron Technology Corp.
- Kai-Ming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,253,727
- Issue date Mar 18, 2025
- Unimicron Technology Corp.
- Chun-Hung Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting diode package structure and manufacturing method the...
- Patent number 12,255,279
- Issue date Mar 18, 2025
- Unimicron Technology Corp.
- Wen-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure
- Patent number 12,256,488
- Issue date Mar 18, 2025
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate structure and cutting method thereof
- Patent number 12,250,776
- Issue date Mar 11, 2025
- Unimicron Technology Corp.
- Jeng-Ting Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit substrate structure and manufacturing method thereof
- Patent number 12,243,838
- Issue date Mar 4, 2025
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and manufacturing method thereof
- Patent number 12,232,254
- Issue date Feb 18, 2025
- Unimicron Technology Corporation
- Po-Hsiang Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bare circuit board
- Patent number 12,219,711
- Issue date Feb 4, 2025
- Unimicron Technology Corp.
- Chun-Hsien Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass carrier having protection structure and manufacturing method...
- Patent number 12,218,017
- Issue date Feb 4, 2025
- Unimicron Technology Corp.
- Wen Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure
- Patent number 12,200,861
- Issue date Jan 14, 2025
- Unimicron Technology Corp.
- Guang-Hwa Ma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connector and method for manufacturing the same
- Patent number 12,184,005
- Issue date Dec 31, 2024
- Unimicron Technology Corp.
- Ching-Ho Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit board and manufacturing method thereof
- Patent number 12,185,479
- Issue date Dec 31, 2024
- Unimicron Technology Corp.
- Cheng-Ta Ko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and manufacturing method thereof and electronic device
- Patent number 12,177,964
- Issue date Dec 24, 2024
- Unimicron Technology Corp.
- Jun-Rui Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 12,160,953
- Issue date Dec 3, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package carrier with improved heat dissipation efficiency and manuf...
- Patent number 12,156,325
- Issue date Nov 26, 2024
- Unimicron Technology Corp.
- Ming-Hao Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure
- Patent number 12,144,113
- Issue date Nov 12, 2024
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transmission device for suppressing glass fiber effect
- Patent number 12,133,323
- Issue date Oct 29, 2024
- Unimicron Technology Corp.
- Chin-Hsun Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 12,108,530
- Issue date Oct 1, 2024
- Unimicron Technology Corp.
- Kuang-Ching Fan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board assembly
- Patent number 12,101,881
- Issue date Sep 24, 2024
- Unimicron Technology Corporation
- Ching-Ho Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of improving wire structure of circuit board and improving w...
- Patent number 12,089,347
- Issue date Sep 10, 2024
- Unimicron Technology Corp.
- Chun Yi Kuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure and manufacturing method of the same
- Patent number 12,062,742
- Issue date Aug 13, 2024
- Unimicron Technology Corp.
- Hao-Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board having laminated build-up layers
- Patent number 12,057,381
- Issue date Aug 6, 2024
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of circuit board
- Patent number 12,052,815
- Issue date Jul 30, 2024
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and manufacturing method thereof
- Patent number 12,022,612
- Issue date Jun 25, 2024
- Unimicron Technology Corp.
- Chun-Hung Kuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with a conductive bump mounted on an adhesive layer
- Patent number 12,016,133
- Issue date Jun 18, 2024
- Unimicron Technology Corp.
- Ming-Hao Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PROBE CARD
- Publication number 20250172587
- Publication date May 29, 2025
- Unimicron Technology Corp.
- Chih-Peng Hsieh
- G01 - MEASURING TESTING
Information Patent Application
PROBE CARD
- Publication number 20250172588
- Publication date May 29, 2025
- Unimicron Technology Corp.
- Chih-Peng Hsieh
- G01 - MEASURING TESTING
Information Patent Application
SUBSTRATE STRUCTURE
- Publication number 20250168988
- Publication date May 22, 2025
- Unimicron Technology Corp.
- Jeng-Ting LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250149426
- Publication date May 8, 2025
- Unimicron Technology Corp.
- An-Sheng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250147249
- Publication date May 8, 2025
- Unimicron Technology Corp.
- John Hon-Shing Lau
- G02 - OPTICS
Information Patent Application
PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20250149392
- Publication date May 8, 2025
- Unimicron Technology Corp.
- Chia Ching Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250149503
- Publication date May 8, 2025
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250125298
- Publication date Apr 17, 2025
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR AND MANUFACTURING METHOD THEREOF
- Publication number 20250105536
- Publication date Mar 27, 2025
- Unimicron Technology Corp.
- Ra-Min TAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGING STRUCTURE
- Publication number 20250096145
- Publication date Mar 20, 2025
- Unimicron Technology Corp.
- Chin-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20250089173
- Publication date Mar 13, 2025
- Unimicron Technology Corp.
- Chun Hung KUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT BOARD
- Publication number 20250056712
- Publication date Feb 13, 2025
- Unimicron Technology Corp.
- Jun-Rui Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF PACKAGE CARRIER
- Publication number 20250040026
- Publication date Jan 30, 2025
- Unimicron Technology Corp.
- Ming-Hao Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITIVE ELEMENT, CIRCUIT CARRIER HAVING THE SAME AND FABRICATION...
- Publication number 20250040051
- Publication date Jan 30, 2025
- Unimicron Technology Corp.
- Chun Hung KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE MODULE AND METHOD FOR FABRICATION OF THE SAME
- Publication number 20240413067
- Publication date Dec 12, 2024
- Unimicron Technology Corp.
- Chia-Yu PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240414850
- Publication date Dec 12, 2024
- Unimicron Technology Corp.
- Chin-Sheng Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD DEVICE
- Publication number 20240397621
- Publication date Nov 28, 2024
- Unimicron Technology Corp.
- Chin-Hsun WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240389232
- Publication date Nov 21, 2024
- Unimicron Technology Corp.
- Chun Hung KUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240381533
- Publication date Nov 14, 2024
- Unimicron Technology Corp.
- Chun Hung KUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CO-PACKAGED STRUCTURE FOR OPTICS AND ELECTRICS
- Publication number 20240377598
- Publication date Nov 14, 2024
- Unimicron Technology Corp.
- Chin-Sheng WANG
- G02 - OPTICS
Information Patent Application
SUBSTRATE STRUCTURE AND CUTTING METHOD THEREOF
- Publication number 20240357748
- Publication date Oct 24, 2024
- Unimicron Technology Corp.
- Jeng-Ting LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSPECTION SYSTEM AND INSPECTION METHOD OF BARE CIRCUIT BOARD
- Publication number 20240310428
- Publication date Sep 19, 2024
- Unimicron Technology Corp.
- Chun-Hsien CHIEN
- G01 - MEASURING TESTING
Information Patent Application
EMBEDDED INDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240314932
- Publication date Sep 19, 2024
- Unimicron Technology Corp.
- Chen-An TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT BOARD STRUCTURE
- Publication number 20240306298
- Publication date Sep 12, 2024
- Unimicron Technology Corp.
- Tzyy-Jang TSENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT BOARD
- Publication number 20240282687
- Publication date Aug 22, 2024
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240248264
- Publication date Jul 25, 2024
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240251504
- Publication date Jul 25, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240234371
- Publication date Jul 11, 2024
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240237202
- Publication date Jul 11, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240237209
- Publication date Jul 11, 2024
- Unimicron Technology Corp.
- Ping-Tsung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Trademarklast 30 trademarks

Information Trademark
87313012 - UNIMICRON
- Serial number 87313012
- Registration number 5604112
- Filing date Jan 25, 2017
- UNIMICRON TECHNOLOGY CORP.
- 40 - Treatment of materials
Information Trademark
78083848 - UNIMICRON
- Serial number 78083848
- Registration number 3066482
- Filing date Sep 13, 2001
- World Wiser Electronics, Inc.
- 40 - Treatment of materials

UNIMICRON TECHNOLOGY CORP

Organization

Patents Grantslast 30 patents

Method for manufacturing circuit board

Circuit board assembly and manufacturing method thereof

Transmission line device compriing first and second conductive line...

Circuit carrier and manufacturing method thereof and package structure

Inspection system and inspection method of bare circuit board

Integrated circuit package structure

Electronic device

Light-emitting diode package structure and manufacturing method the...

Circuit board structure

Substrate structure and cutting method thereof

Circuit substrate structure and manufacturing method thereof

Printed circuit board and manufacturing method thereof

Bare circuit board

Glass carrier having protection structure and manufacturing method...

Circuit board structure

Connector and method for manufacturing the same

Flexible circuit board and manufacturing method thereof

Circuit board and manufacturing method thereof and electronic device

Circuit board structure and manufacturing method thereof

Package carrier with improved heat dissipation efficiency and manuf...

Circuit board structure

Transmission device for suppressing glass fiber effect

Circuit board structure and manufacturing method thereof

Circuit board assembly

Method of improving wire structure of circuit board and improving w...

Package structure and manufacturing method of the same

Circuit board having laminated build-up layers

Manufacturing method of circuit board

Circuit board and manufacturing method thereof

Circuit board with a conductive bump mounted on an adhesive layer

Patents Applicationslast 30 patents

PROBE CARD

PROBE CARD

SUBSTRATE STRUCTURE

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

CONNECTOR AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGING STRUCTURE

CIRCUIT BOARD STRUCTURE AND FABRICATION METHOD THEREOF

MANUFACTURING METHOD OF CIRCUIT BOARD

MANUFACTURING METHOD OF PACKAGE CARRIER

CAPACITIVE ELEMENT, CIRCUIT CARRIER HAVING THE SAME AND FABRICATION...

ELECTRONIC PACKAGE MODULE AND METHOD FOR FABRICATION OF THE SAME

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD DEVICE

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

CO-PACKAGED STRUCTURE FOR OPTICS AND ELECTRICS

SUBSTRATE STRUCTURE AND CUTTING METHOD THEREOF

INSPECTION SYSTEM AND INSPECTION METHOD OF BARE CIRCUIT BOARD

EMBEDDED INDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD OF CIRCUIT BOARD STRUCTURE

MANUFACTURING METHOD OF CIRCUIT BOARD

PACKAGE STRUCTURE

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

Trademarklast 30 trademarks

87313012 - UNIMICRON

78083848 - UNIMICRON